MY197614A - Polishing composition for magnetic disk substrates - Google Patents

Polishing composition for magnetic disk substrates

Info

Publication number
MY197614A
MY197614A MYPI2020000408A MYPI2020000408A MY197614A MY 197614 A MY197614 A MY 197614A MY PI2020000408 A MYPI2020000408 A MY PI2020000408A MY PI2020000408 A MYPI2020000408 A MY PI2020000408A MY 197614 A MY197614 A MY 197614A
Authority
MY
Malaysia
Prior art keywords
particle size
silica particles
ratio
polishing composition
mass
Prior art date
Application number
MYPI2020000408A
Other languages
English (en)
Inventor
Iwata Toru
Original Assignee
Yamaguchi Seiken Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaguchi Seiken Kogyo Co Ltd filed Critical Yamaguchi Seiken Kogyo Co Ltd
Publication of MY197614A publication Critical patent/MY197614A/en

Links

Landscapes

  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
MYPI2020000408A 2019-01-25 2020-01-23 Polishing composition for magnetic disk substrates MY197614A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019011481A JP7219101B2 (ja) 2019-01-25 2019-01-25 磁気ディスク基板用研磨剤組成物

Publications (1)

Publication Number Publication Date
MY197614A true MY197614A (en) 2023-06-28

Family

ID=71891382

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2020000408A MY197614A (en) 2019-01-25 2020-01-23 Polishing composition for magnetic disk substrates

Country Status (3)

Country Link
JP (1) JP7219101B2 (zh)
MY (1) MY197614A (zh)
TW (1) TWI820284B (zh)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3997154B2 (ja) 2002-12-26 2007-10-24 花王株式会社 研磨液組成物
JP6484894B2 (ja) * 2014-03-28 2019-03-20 山口精研工業株式会社 研磨剤組成物、および磁気ディスク基板の研磨方法
WO2015146941A1 (ja) 2014-03-28 2015-10-01 山口精研工業株式会社 研磨剤組成物、および磁気ディスク基板の研磨方法
JP6940315B2 (ja) 2017-06-22 2021-09-22 山口精研工業株式会社 磁気ディスク基板用研磨剤組成物

Also Published As

Publication number Publication date
TWI820284B (zh) 2023-11-01
TW202037691A (zh) 2020-10-16
JP2020119620A (ja) 2020-08-06
JP7219101B2 (ja) 2023-02-07

Similar Documents

Publication Publication Date Title
JP2857722B2 (ja) 活性化研磨組成物
RU2006104117A (ru) Абразивные частицы для механической полировки
TW200617150A (en) Polishing composition
MY130609A (en) Polishing composition
MY139682A (en) Substrate for magnetic disk
TW200729177A (en) Polishing composition for hard disk substrate
JP2000336344A (ja) 研磨剤
EP0210001A1 (en) Process for polishing non-electrolysis nickel plate, alumite or aluminium surface of a memory hard disc
IL147039A0 (en) Cmp composition containing silane modified abrasive particles
WO2002028979A1 (fr) Matiere abrasive a base de cerium et procede de production de ladite matiere
TW200628406A (en) Cerium oxide abrasive and slurry containing the same
TWI653324B (zh) 硏磨劑組合物及磁碟基板之硏磨法
JP6730859B2 (ja) 研磨用組成物および磁気ディスク基板製造方法
SG10201901971PA (en) Polishing composition
TW200724633A (en) Polishing slurries and methods for utilizing same
SG170807A1 (en) Fine particles of oxide crystal and slurry for polishing which contains the fine particles
SG11201805718RA (en) Polishing composition and method for polishing silicon substrate
TW200717635A (en) Polishing method for semiconductor wafer
MY154723A (en) Cerium-based abrasive, abrasive slurry, and production of cerium-based abrasive.
WO2004106455A3 (en) Slurry composition and method of use
MY197614A (en) Polishing composition for magnetic disk substrates
MY134679A (en) Polishing composition
JP2018081733A (ja) 磁気ディスク基板用研磨液組成物
US9534147B2 (en) Polishing composition and method for nickel-phosphorous coated memory disks
MY139129A (en) Polishing composition