MY197614A - Polishing composition for magnetic disk substrates - Google Patents

Polishing composition for magnetic disk substrates

Info

Publication number
MY197614A
MY197614A MYPI2020000408A MYPI2020000408A MY197614A MY 197614 A MY197614 A MY 197614A MY PI2020000408 A MYPI2020000408 A MY PI2020000408A MY PI2020000408 A MYPI2020000408 A MY PI2020000408A MY 197614 A MY197614 A MY 197614A
Authority
MY
Malaysia
Prior art keywords
particle size
silica particles
ratio
polishing composition
mass
Prior art date
Application number
MYPI2020000408A
Inventor
Iwata Toru
Original Assignee
Yamaguchi Seiken Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaguchi Seiken Kogyo Co Ltd filed Critical Yamaguchi Seiken Kogyo Co Ltd
Publication of MY197614A publication Critical patent/MY197614A/en

Links

Landscapes

  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)

Abstract

The present invention provides a polishing composition capable of achieving a high polishing rate without using alumina abrasive grains, at the same time, achieving good surface smoothness by reducing shallow pit and waviness, and further reducing roll-off. The polishing composition for a magnetic disk substrate contains colloidal silica having an average primary particle size of 10 to 150nm, pulverized wet-process silica particles having an average particle size of 200 to 500nm, and water. The ratio of colloidal silica in the total silica particles is 20 to 80% by mass, and the ratio of pulverized wet-process silica particles in the total silica particles is 20 to 80% by mass. The ratio of particles having a particle size of 30 to 70nm in colloidal silica is 10 to 90% by volume. Further, the ratio of the average particle size of the pulverized wet-process silica particles to the average primary particle size of the colloidal silica is 2.0 to 15.0, and the concentration of the total silica particles is 2 to 40% by mass. [No suitable figure]
MYPI2020000408A 2019-01-25 2020-01-23 Polishing composition for magnetic disk substrates MY197614A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019011481A JP7219101B2 (en) 2019-01-25 2019-01-25 Abrasive composition for magnetic disk substrate

Publications (1)

Publication Number Publication Date
MY197614A true MY197614A (en) 2023-06-28

Family

ID=71891382

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2020000408A MY197614A (en) 2019-01-25 2020-01-23 Polishing composition for magnetic disk substrates

Country Status (3)

Country Link
JP (1) JP7219101B2 (en)
MY (1) MY197614A (en)
TW (1) TWI820284B (en)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3997154B2 (en) * 2002-12-26 2007-10-24 花王株式会社 Polishing liquid composition
JP6511039B2 (en) 2014-03-28 2019-05-08 山口精研工業株式会社 Abrasive composition and method of polishing magnetic disk substrate
WO2015146942A1 (en) * 2014-03-28 2015-10-01 山口精研工業株式会社 Polishing agent composition and method for polishing magnetic disk substrate
JP6940315B2 (en) 2017-06-22 2021-09-22 山口精研工業株式会社 Abrasive composition for magnetic disk substrates

Also Published As

Publication number Publication date
TWI820284B (en) 2023-11-01
JP2020119620A (en) 2020-08-06
TW202037691A (en) 2020-10-16
JP7219101B2 (en) 2023-02-07

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