MY196754A - Heater chip unit - Google Patents

Heater chip unit

Info

Publication number
MY196754A
MY196754A MYPI2022004863A MYPI2022004863A MY196754A MY 196754 A MY196754 A MY 196754A MY PI2022004863 A MYPI2022004863 A MY PI2022004863A MY PI2022004863 A MYPI2022004863 A MY PI2022004863A MY 196754 A MY196754 A MY 196754A
Authority
MY
Malaysia
Prior art keywords
lead wire
trowel
heater chip
main body
chip unit
Prior art date
Application number
MYPI2022004863A
Other languages
English (en)
Inventor
Shinichiro Suga
Original Assignee
Apollo Giken Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Apollo Giken Co Ltd filed Critical Apollo Giken Co Ltd
Publication of MY196754A publication Critical patent/MY196754A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Electrodes For Cathode-Ray Tubes (AREA)
  • Resistance Heating (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
MYPI2022004863A 2020-09-09 2021-07-20 Heater chip unit MY196754A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020151044A JP7137236B2 (ja) 2020-09-09 2020-09-09 ヒーターチップユニット
PCT/JP2021/027195 WO2022054420A1 (ja) 2020-09-09 2021-07-20 ヒーターチップユニット

Publications (1)

Publication Number Publication Date
MY196754A true MY196754A (en) 2023-05-03

Family

ID=80632530

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2022004863A MY196754A (en) 2020-09-09 2021-07-20 Heater chip unit

Country Status (6)

Country Link
JP (1) JP7137236B2 (zh)
KR (1) KR20220126796A (zh)
CN (1) CN115379917B (zh)
MY (1) MY196754A (zh)
TW (1) TW202224820A (zh)
WO (1) WO2022054420A1 (zh)

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0661639A (ja) * 1992-08-04 1994-03-04 Fujitsu Ltd ワイヤボンディングチップ構造
US5864118A (en) * 1997-04-30 1999-01-26 Seagate Technology, Inc. Soldering instrument with heated tip and protective heat shield associated therewith
JP2005319468A (ja) * 2002-05-15 2005-11-17 Kobo Pda Co Ltd 熱圧着用ヒーターチップ
JP4081396B2 (ja) 2003-03-27 2008-04-23 京セラ株式会社 セラミックヒータの熱電対取り付け構造
JP3917964B2 (ja) 2003-08-22 2007-05-23 株式会社 工房Ｐｄａ 熱圧着用のヒーターチップ
US8274011B2 (en) * 2009-01-24 2012-09-25 Hakko Corporation Soldering device and method of making same
JP2010253503A (ja) * 2009-04-23 2010-11-11 Miyachi Technos Corp ヒータチップ及び接合装置
JP5457107B2 (ja) 2009-05-19 2014-04-02 ミヤチテクノス株式会社 ヒータチップ及び接合装置
JP2012183552A (ja) * 2011-03-04 2012-09-27 Miyachi Technos Corp ヒータチップ及び接合装置及び接合方法
JP5794577B2 (ja) * 2011-10-21 2015-10-14 株式会社アマダミヤチ ヒータチップ及び接合装置及び接合方法並びに導体細線と端子の接続構造
US10799977B2 (en) 2015-08-28 2020-10-13 Kobo Pda Co., Ltd. Heater chip, joining apparatus and joining method
JP6677406B2 (ja) * 2015-09-25 2020-04-08 株式会社 工房Ｐｄａ ヒータチップ及び接合装置及び接合方法
JP6851610B2 (ja) * 2016-07-19 2021-03-31 株式会社 工房Ｐｄａ ヒータチップ及び接合装置及び接合方法
US20190299311A1 (en) * 2018-03-28 2019-10-03 Hakko Corporation High Power Dual Sensor Cartridge

Also Published As

Publication number Publication date
CN115379917A (zh) 2022-11-22
KR20220126796A (ko) 2022-09-16
WO2022054420A1 (ja) 2022-03-17
JP2022045443A (ja) 2022-03-22
JP7137236B2 (ja) 2022-09-14
CN115379917B (zh) 2023-09-01
TW202224820A (zh) 2022-07-01

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