MY190543A - Silazane-siloxane random copolymers, their production and use - Google Patents
Silazane-siloxane random copolymers, their production and useInfo
- Publication number
- MY190543A MY190543A MYPI2018702820A MYPI2018702820A MY190543A MY 190543 A MY190543 A MY 190543A MY PI2018702820 A MYPI2018702820 A MY PI2018702820A MY PI2018702820 A MYPI2018702820 A MY PI2018702820A MY 190543 A MY190543 A MY 190543A
- Authority
- MY
- Malaysia
- Prior art keywords
- silazane
- production
- random copolymers
- siloxane random
- siloxane
- Prior art date
Links
- 229920005604 random copolymer Polymers 0.000 title abstract 2
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
- C08G77/54—Nitrogen-containing linkages
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/045—Polysiloxanes containing less than 25 silicon atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/06—Preparatory processes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/296—Organo-silicon compounds
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0362—Manufacture or treatment of packages of encapsulations
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Silicon Polymers (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP16000371 | 2016-02-15 | ||
| PCT/EP2017/000059 WO2017140407A1 (en) | 2016-02-15 | 2017-01-19 | Silazane-siloxane random copolymers, their production and use |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY190543A true MY190543A (en) | 2022-04-27 |
Family
ID=55404558
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI2018702820A MY190543A (en) | 2016-02-15 | 2017-01-19 | Silazane-siloxane random copolymers, their production and use |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US10927220B2 (OSRAM) |
| EP (1) | EP3417002B1 (OSRAM) |
| JP (1) | JP6843875B2 (OSRAM) |
| KR (1) | KR20180113579A (OSRAM) |
| CN (1) | CN108699248B (OSRAM) |
| MY (1) | MY190543A (OSRAM) |
| SG (1) | SG11201806774XA (OSRAM) |
| TW (1) | TWI713694B (OSRAM) |
| WO (1) | WO2017140407A1 (OSRAM) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019072881A1 (en) | 2017-10-13 | 2019-04-18 | Merck Patent Gmbh | METHOD FOR MANUFACTURING AN OPTOELECTRONIC DEVICE |
| WO2019233945A1 (en) * | 2018-06-05 | 2019-12-12 | Merck Patent Gmbh | Method and polymer composition for preparing optoelectronic devices |
| JP7103245B2 (ja) * | 2019-01-29 | 2022-07-20 | 信越化学工業株式会社 | ポリシロキサザン化合物およびその製造方法並びにこれを含む組成物および硬化物 |
| JP7371592B2 (ja) * | 2019-09-27 | 2023-10-31 | 信越化学工業株式会社 | アルコキシシリル基を有するポリシロキサザン化合物およびその製造方法、並びにこれを含む組成物および硬化物 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4678688A (en) * | 1983-12-28 | 1987-07-07 | Shin-Etsu Chemical Co., Ltd. | Method for forming a surface film of cured organosilicon polymer on a substrate surface |
| JPS60145815A (ja) | 1984-01-10 | 1985-08-01 | Shin Etsu Chem Co Ltd | 離型剤組成物 |
| JPH04136278A (ja) | 1990-09-20 | 1992-05-11 | Shin Etsu Chem Co Ltd | 基布処理剤組成物及びそれを用いたパラグライダー用キャノピー素材 |
| TW514652B (en) * | 1996-12-27 | 2002-12-21 | Tonen Corp | Polyorganosiloxazane and method of preparing the same |
| US6274924B1 (en) | 1998-11-05 | 2001-08-14 | Lumileds Lighting, U.S. Llc | Surface mountable LED package |
| US6204523B1 (en) | 1998-11-06 | 2001-03-20 | Lumileds Lighting, U.S., Llc | High stability optical encapsulation and packaging for light-emitting diodes in the green, blue, and near UV range |
| US6534184B2 (en) * | 2001-02-26 | 2003-03-18 | Kion Corporation | Polysilazane/polysiloxane block copolymers |
| JP2004077874A (ja) | 2002-08-20 | 2004-03-11 | Clariant (Japan) Kk | 層間絶縁膜用感光性組成物及びパターン化層間絶縁膜の形成方法 |
| KR20100071650A (ko) | 2008-12-19 | 2010-06-29 | 삼성전자주식회사 | 가스차단성박막, 이를 포함하는 전자소자 및 이의 제조방법 |
| KR101387740B1 (ko) * | 2011-01-07 | 2014-04-21 | 제일모직주식회사 | 실리카계 절연층 형성용 조성물, 실리카계 절연층 형성용 조성물의 제조방법, 실리카계 절연층 및 실리카계 절연층의 제조방법 |
| EP2869977B1 (en) | 2012-07-03 | 2020-04-22 | Burning Bush Group, LLC | High performance silicon based coating compositions |
| US9935246B2 (en) | 2013-12-30 | 2018-04-03 | Cree, Inc. | Silazane-containing materials for light emitting diodes |
| KR20180079378A (ko) * | 2015-10-30 | 2018-07-10 | 에이제트 일렉트로닉 머티어리얼스 (룩셈부르크) 에스.에이.알.엘. | 실라잔-실록산 공중합체의 제조 방법 및 이러한 공중합체의 용도 |
-
2017
- 2017-01-19 US US16/077,870 patent/US10927220B2/en not_active Expired - Fee Related
- 2017-01-19 CN CN201780010344.2A patent/CN108699248B/zh active Active
- 2017-01-19 EP EP17700597.2A patent/EP3417002B1/en active Active
- 2017-01-19 MY MYPI2018702820A patent/MY190543A/en unknown
- 2017-01-19 WO PCT/EP2017/000059 patent/WO2017140407A1/en not_active Ceased
- 2017-01-19 SG SG11201806774XA patent/SG11201806774XA/en unknown
- 2017-01-19 JP JP2018544039A patent/JP6843875B2/ja not_active Expired - Fee Related
- 2017-01-19 KR KR1020187026545A patent/KR20180113579A/ko not_active Ceased
- 2017-02-14 TW TW106104685A patent/TWI713694B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| EP3417002B1 (en) | 2019-11-13 |
| JP2019505645A (ja) | 2019-02-28 |
| US20200255599A1 (en) | 2020-08-13 |
| CN108699248B (zh) | 2021-03-26 |
| US10927220B2 (en) | 2021-02-23 |
| TW201731921A (zh) | 2017-09-16 |
| KR20180113579A (ko) | 2018-10-16 |
| EP3417002A1 (en) | 2018-12-26 |
| TWI713694B (zh) | 2020-12-21 |
| CN108699248A (zh) | 2018-10-23 |
| JP6843875B2 (ja) | 2021-03-17 |
| WO2017140407A1 (en) | 2017-08-24 |
| SG11201806774XA (en) | 2018-09-27 |
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