MY186148A - Setup camera auto height alignment - Google Patents
Setup camera auto height alignmentInfo
- Publication number
- MY186148A MY186148A MYPI2017704544A MYPI2017704544A MY186148A MY 186148 A MY186148 A MY 186148A MY PI2017704544 A MYPI2017704544 A MY PI2017704544A MY PI2017704544 A MYPI2017704544 A MY PI2017704544A MY 186148 A MY186148 A MY 186148A
- Authority
- MY
- Malaysia
- Prior art keywords
- heads
- flipper
- pick
- height alignment
- camera auto
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/56—Accessories
- G03B17/561—Support related camera accessories
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Length Measuring Devices By Optical Means (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
MYPI2017704544A MY186148A (en) | 2017-11-27 | 2017-11-27 | Setup camera auto height alignment |
PH12018000382A PH12018000382A1 (en) | 2017-11-27 | 2018-11-16 | Setup camera auto height alignment |
TW107140968A TWI699852B (zh) | 2017-11-27 | 2018-11-19 | 拾取頭和翻轉頭的視覺輔助自動高度對準的方法 |
KR1020180146220A KR102128662B1 (ko) | 2017-11-27 | 2018-11-23 | 카메라 자동 높이 정렬 설정 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
MYPI2017704544A MY186148A (en) | 2017-11-27 | 2017-11-27 | Setup camera auto height alignment |
Publications (1)
Publication Number | Publication Date |
---|---|
MY186148A true MY186148A (en) | 2021-06-28 |
Family
ID=66844943
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2017704544A MY186148A (en) | 2017-11-27 | 2017-11-27 | Setup camera auto height alignment |
Country Status (4)
Country | Link |
---|---|
KR (1) | KR102128662B1 (ko) |
MY (1) | MY186148A (ko) |
PH (1) | PH12018000382A1 (ko) |
TW (1) | TWI699852B (ko) |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE59603376D1 (de) * | 1996-02-29 | 1999-11-18 | Alphasem Ag Berg | Verfahren und vorrichtung zum aufnehmen, orientieren und montieren von bauelementen |
US6535291B1 (en) * | 2000-06-07 | 2003-03-18 | Cyberoptics Corporation | Calibration methods for placement machines incorporating on-head linescan sensing |
SG104292A1 (en) * | 2002-01-07 | 2004-06-21 | Advance Systems Automation Ltd | Flip chip bonder and method therefor |
JP4128540B2 (ja) * | 2003-06-05 | 2008-07-30 | 株式会社新川 | ボンディング装置 |
US20050045914A1 (en) * | 2003-07-09 | 2005-03-03 | Newport Corporation | Flip chip device assembly machine |
KR20150029086A (ko) * | 2013-09-09 | 2015-03-18 | 한미반도체 주식회사 | 반도체 장치의 z축 높이 감지방법 |
KR102247600B1 (ko) * | 2015-03-16 | 2021-05-03 | 한화정밀기계 주식회사 | 본딩 장치 및 본딩 방법 |
KR102078185B1 (ko) * | 2019-10-01 | 2020-02-17 | 제너셈(주) | 픽커의 z축 이동량 결정 방법 및 반도체 패키지 이송 장치 |
-
2017
- 2017-11-27 MY MYPI2017704544A patent/MY186148A/en unknown
-
2018
- 2018-11-16 PH PH12018000382A patent/PH12018000382A1/en unknown
- 2018-11-19 TW TW107140968A patent/TWI699852B/zh active
- 2018-11-23 KR KR1020180146220A patent/KR102128662B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
TW201926533A (zh) | 2019-07-01 |
PH12018000382A1 (en) | 2019-06-10 |
KR20190062236A (ko) | 2019-06-05 |
KR102128662B1 (ko) | 2020-07-09 |
TWI699852B (zh) | 2020-07-21 |
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