MY183124A - Lead frame - Google Patents

Lead frame

Info

Publication number
MY183124A
MY183124A MYPI2017702498A MYPI2017702498A MY183124A MY 183124 A MY183124 A MY 183124A MY PI2017702498 A MYPI2017702498 A MY PI2017702498A MY PI2017702498 A MYPI2017702498 A MY PI2017702498A MY 183124 A MY183124 A MY 183124A
Authority
MY
Malaysia
Prior art keywords
leads
linking
lead frames
unit lead
lead frame
Prior art date
Application number
MYPI2017702498A
Other languages
English (en)
Inventor
Ishibashi Takahiro
Original Assignee
Mitsui High Tec
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui High Tec filed Critical Mitsui High Tec
Publication of MY183124A publication Critical patent/MY183124A/en

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
MYPI2017702498A 2016-07-12 2017-07-07 Lead frame MY183124A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016137817A JP6738676B2 (ja) 2016-07-12 2016-07-12 リードフレーム

Publications (1)

Publication Number Publication Date
MY183124A true MY183124A (en) 2021-02-15

Family

ID=60995768

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2017702498A MY183124A (en) 2016-07-12 2017-07-07 Lead frame

Country Status (4)

Country Link
JP (1) JP6738676B2 (zh)
CN (1) CN107611113B (zh)
MY (1) MY183124A (zh)
TW (1) TWI703695B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114026685A (zh) * 2019-06-28 2022-02-08 罗姆股份有限公司 电子装置以及电子装置的安装结构

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2035857A1 (en) * 1990-02-06 1991-08-07 Kikuo Ichigi Leadframe
JPH03296254A (ja) * 1990-02-06 1991-12-26 Dainippon Printing Co Ltd リードフレーム
JP2866816B2 (ja) * 1995-03-31 1999-03-08 日鉄セミコンダクター株式会社 リードフレーム
JP3483994B2 (ja) * 1995-08-31 2004-01-06 ローム株式会社 樹脂パッケージ型半導体装置の成形用金型装置、および半導体装置の樹脂パッケージング方法
JP2000188366A (ja) * 1998-12-24 2000-07-04 Hitachi Ltd 半導体装置
KR20050109502A (ko) * 2003-02-21 2005-11-21 어드밴스드 인터커넥트 테크놀로지스 리미티드 내장형 수동 소자를 갖는 리드 프레임
JP2005026466A (ja) * 2003-07-02 2005-01-27 Renesas Technology Corp 半導体装置およびリードフレーム
JP2005166695A (ja) * 2003-11-28 2005-06-23 Mitsui High Tec Inc リードフレーム及び半導体装置の製造方法
TWI280399B (en) * 2004-10-01 2007-05-01 Yamaha Corp Physical amount sensor and lead frame used therein
JP5467506B2 (ja) * 2009-10-05 2014-04-09 大日本印刷株式会社 樹脂封止型半導体装置及びその製造方法

Also Published As

Publication number Publication date
TW201803061A (zh) 2018-01-16
JP2018010935A (ja) 2018-01-18
TWI703695B (zh) 2020-09-01
CN107611113A (zh) 2018-01-19
CN107611113B (zh) 2022-02-08
JP6738676B2 (ja) 2020-08-12

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