MY183124A - Lead frame - Google Patents

Lead frame

Info

Publication number
MY183124A
MY183124A MYPI2017702498A MYPI2017702498A MY183124A MY 183124 A MY183124 A MY 183124A MY PI2017702498 A MYPI2017702498 A MY PI2017702498A MY PI2017702498 A MYPI2017702498 A MY PI2017702498A MY 183124 A MY183124 A MY 183124A
Authority
MY
Malaysia
Prior art keywords
leads
linking
lead frames
unit lead
lead frame
Prior art date
Application number
MYPI2017702498A
Inventor
Ishibashi Takahiro
Original Assignee
Mitsui High Tec
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui High Tec filed Critical Mitsui High Tec
Publication of MY183124A publication Critical patent/MY183124A/en

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

Provided is a lead frame (1, 1A to 1H) including: a plurality of unit lead frames (10); and a connecting bar (15) for linking the unit lead frames with each other. Each of the unit lead frames includes a die pad (11), a plurality of leads, and a linking portion (13) for linking tip end portions (12a) of adjacent leads of the plurality of leads with each other, and the unit lead frames are arrayed in matrix; the connecting bar includes a lead support bar (15a) for supporting base end portions (12b) of the leads; and a region in the lead support bar, the region facing the linking portion, is cut out in a direction away from the linking portion. (Figure 1)
MYPI2017702498A 2016-07-12 2017-07-07 Lead frame MY183124A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016137817A JP6738676B2 (en) 2016-07-12 2016-07-12 Lead frame

Publications (1)

Publication Number Publication Date
MY183124A true MY183124A (en) 2021-02-15

Family

ID=60995768

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2017702498A MY183124A (en) 2016-07-12 2017-07-07 Lead frame

Country Status (4)

Country Link
JP (1) JP6738676B2 (en)
CN (1) CN107611113B (en)
MY (1) MY183124A (en)
TW (1) TWI703695B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114026685A (en) * 2019-06-28 2022-02-08 罗姆股份有限公司 Electronic device and mounting structure of electronic device

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2035857A1 (en) * 1990-02-06 1991-08-07 Kikuo Ichigi Leadframe
JPH03296254A (en) * 1990-02-06 1991-12-26 Dainippon Printing Co Ltd Lead frame
JP2866816B2 (en) * 1995-03-31 1999-03-08 日鉄セミコンダクター株式会社 Lead frame
JP3483994B2 (en) * 1995-08-31 2004-01-06 ローム株式会社 Molding apparatus for molding resin package type semiconductor device, and resin packaging method for semiconductor device
JP2000188366A (en) * 1998-12-24 2000-07-04 Hitachi Ltd Semiconductor device
KR20050109502A (en) * 2003-02-21 2005-11-21 어드밴스드 인터커넥트 테크놀로지스 리미티드 Lead frame with included passive devices
JP2005026466A (en) * 2003-07-02 2005-01-27 Renesas Technology Corp Semiconductor device and lead frame
JP2005166695A (en) * 2003-11-28 2005-06-23 Mitsui High Tec Inc Lead frame and manufacturing method of semiconductor device
TWI280399B (en) * 2004-10-01 2007-05-01 Yamaha Corp Physical amount sensor and lead frame used therein
JP5467506B2 (en) * 2009-10-05 2014-04-09 大日本印刷株式会社 Resin-sealed semiconductor device and manufacturing method thereof

Also Published As

Publication number Publication date
TW201803061A (en) 2018-01-16
JP2018010935A (en) 2018-01-18
TWI703695B (en) 2020-09-01
CN107611113A (en) 2018-01-19
CN107611113B (en) 2022-02-08
JP6738676B2 (en) 2020-08-12

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