MY177230A - Cutting apparatus - Google Patents
Cutting apparatusInfo
- Publication number
- MY177230A MY177230A MYPI2015000515A MYPI2015000515A MY177230A MY 177230 A MY177230 A MY 177230A MY PI2015000515 A MYPI2015000515 A MY PI2015000515A MY PI2015000515 A MYPI2015000515 A MY PI2015000515A MY 177230 A MY177230 A MY 177230A
- Authority
- MY
- Malaysia
- Prior art keywords
- vibration signal
- unit
- vibration
- cutting blade
- ultrasonic vibrator
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Dicing (AREA)
- Turning (AREA)
Abstract
A cutting apparatus (2) includes a vibration signal generating unit (68) for generating a vibration signal corresponding to the vibration of a cutting blade (60) and a control unit (78) for determining the condition of the cutting blade (60) according to the vibration signal generated by the vibration signal generating unit (68) . The vibration signal generating unit (68) includes an ultrasonic vibrator provided in a first flange member (46) for generating a voltage corresponding to the vibration signal corresponding to the vibration of the cutting blade (60) and a transmitting unit connected to the ultrasonic vibrator for transmitting the voltage to the control unit (78) . The ultrasonic vibrator is composed of a plurality of ultrasonic vibrators (70) different in resonance frequency, wherein the plural ultrasonic vibrators (70) are provided in the first flange member (46) and connected in parallel to a first coil unit constituting the transmitting unit. The most illustrative drawing is FIG. 3.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014044995A JP6223238B2 (en) | 2014-03-07 | 2014-03-07 | Cutting equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
MY177230A true MY177230A (en) | 2020-09-09 |
Family
ID=54023048
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2015000515A MY177230A (en) | 2014-03-07 | 2015-02-27 | Cutting apparatus |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6223238B2 (en) |
KR (1) | KR102228491B1 (en) |
CN (1) | CN104889868B (en) |
MY (1) | MY177230A (en) |
TW (1) | TWI651179B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108297178B (en) * | 2018-01-23 | 2021-05-07 | 东莞理工学院 | Double-column cutting device with feedback function |
JP7508489B2 (en) | 2020-01-29 | 2024-07-01 | 株式会社ノリタケカンパニーリミテド | AE signal detection device for grinding wheels |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS474816Y1 (en) | 1967-03-30 | 1972-02-21 | ||
US4514797A (en) * | 1982-09-03 | 1985-04-30 | Gte Valeron Corporation | Worn tool detector utilizing normalized vibration signals |
JPS6062464A (en) * | 1983-09-10 | 1985-04-10 | Kawasaki Steel Corp | Side end grinding attachment for metallic belt by rotary grinding wheel |
JPH0499946A (en) * | 1990-08-20 | 1992-03-31 | Sanko Control Kk | Method and apparatus for measuring cutting ability of grinder wheel |
JPH05154833A (en) * | 1991-12-09 | 1993-06-22 | Nikko Kyodo Co Ltd | Dicing machine |
JP3534338B2 (en) * | 1999-10-07 | 2004-06-07 | 松下電器産業株式会社 | Cutting equipment |
JP2002066879A (en) * | 2000-09-04 | 2002-03-05 | Bosch Automotive Systems Corp | Acoustic emission detecting device for machine tool |
JP4658730B2 (en) * | 2005-07-28 | 2011-03-23 | 株式会社ディスコ | Cutting equipment |
WO2007080699A1 (en) * | 2006-01-12 | 2007-07-19 | Tokyo Seimitsu Co., Ltd. | Working system, contact detecting method, and ae contact detecting device |
JP2007187512A (en) * | 2006-01-12 | 2007-07-26 | Nec Corp | Monitoring device and monitoring system |
JP4552883B2 (en) * | 2006-04-19 | 2010-09-29 | 株式会社デンソー | Vibration detection method |
JP2008290203A (en) * | 2007-05-25 | 2008-12-04 | Nissan Diesel Motor Co Ltd | Grinding work monitoring system and grinding work monitoring method |
JP2009032726A (en) * | 2007-07-24 | 2009-02-12 | Disco Abrasive Syst Ltd | Method for dividing wafer |
TW201226101A (en) * | 2010-12-28 | 2012-07-01 | Nat Univ Chung Hsing | Method and device to detect the state of cutting tool in machine tool with multiple sensors |
JP5258921B2 (en) * | 2011-03-31 | 2013-08-07 | 株式会社小松製作所 | Machine tool and its processing control device |
JP5764031B2 (en) * | 2011-10-06 | 2015-08-12 | 株式会社ディスコ | Cutting equipment |
JP5943578B2 (en) * | 2011-10-11 | 2016-07-05 | 株式会社東京精密 | Wafer chamfering apparatus, and method for detecting surface state of chamfering grindstone or processing state of wafer by chamfering grindstone |
TW201332704A (en) * | 2012-02-10 | 2013-08-16 | 中原大學 | Cutting edge chip-buildup monitoring method |
-
2014
- 2014-03-07 JP JP2014044995A patent/JP6223238B2/en active Active
-
2015
- 2015-02-05 TW TW104103909A patent/TWI651179B/en active
- 2015-02-27 MY MYPI2015000515A patent/MY177230A/en unknown
- 2015-02-28 CN CN201510090442.4A patent/CN104889868B/en active Active
- 2015-03-04 KR KR1020150030226A patent/KR102228491B1/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
JP6223238B2 (en) | 2017-11-01 |
KR102228491B1 (en) | 2021-03-15 |
TWI651179B (en) | 2019-02-21 |
JP2015170744A (en) | 2015-09-28 |
CN104889868A (en) | 2015-09-09 |
TW201540457A (en) | 2015-11-01 |
KR20150105222A (en) | 2015-09-16 |
CN104889868B (en) | 2019-07-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
MY177229A (en) | Cutting apparatus | |
MX2017002716A (en) | Method and apparatus for modulating haptic feedback. | |
MY177231A (en) | Cutting apparatus | |
WO2016046810A3 (en) | Wearable audio device | |
MX2017010252A (en) | Algorithm improvements in a haptic system. | |
CL2016002432A1 (en) | Apparatus, system and method for electronic detonation through the use of a magnetic communication signal. | |
MX2017000986A (en) | Ultrasonic blade overmold. | |
MX2017016927A (en) | Methods and apparatus for inducing a non-fundamental wave mode on a transmission medium. | |
JP2016073452A5 (en) | ||
WO2014031778A3 (en) | Acoustic source for generating an acoustic beam | |
MX369494B (en) | Ultrasonic signal time-frequency decomposition for borehole evaluation or pipeline inspection. | |
MX363907B (en) | A method of generating a drive signal for a vibratory sensor. | |
MX364858B (en) | Determining a vibration response parameter of a vibratory element. | |
GB2545138A (en) | Acoustic thermometry | |
MX353675B (en) | Apparatus and method for determination of far-field signature for marine seismic vibrator source. | |
WO2012010786A3 (en) | METHOD AND DEVICE FOR GENERATING ULTRASOUNDS IMPLEMENTING cMUTs, AND METHOD AND SYSTEM FOR MEDICAL IMAGING. | |
MX2016015052A (en) | Combustion environment diagnostics. | |
MX2019003902A (en) | Apparatuses and methods for superposition based wave synthesis. | |
MY185159A (en) | Apparatus and method for generating a frequency enhanced signal using temporal smoothing of subbands | |
MY177230A (en) | Cutting apparatus | |
MX2015002471A (en) | Sensor characterization apparatus, methods, and systems. | |
EP3742750A4 (en) | Vibration generation system, signal generation device, and vibratory device | |
NZ592935A (en) | Ultrasonic device | |
EP3023813A3 (en) | Seismic sweep using odd order harmonics | |
EP2913644A3 (en) | Portable device for measuring the acoustic reflectivity coefficient in situ |