MY177231A - Cutting apparatus - Google Patents

Cutting apparatus

Info

Publication number
MY177231A
MY177231A MYPI2015000514A MYPI2015000514A MY177231A MY 177231 A MY177231 A MY 177231A MY PI2015000514 A MYPI2015000514 A MY PI2015000514A MY PI2015000514 A MYPI2015000514 A MY PI2015000514A MY 177231 A MY177231 A MY 177231A
Authority
MY
Malaysia
Prior art keywords
vibration
vibration signal
cutting blade
signal
unit
Prior art date
Application number
MYPI2015000514A
Inventor
Kubo Masahiro
Nakanishi Yuji
Izumi Kuniharu
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of MY177231A publication Critical patent/MY177231A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0683—Accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Dicing (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Turning (AREA)
  • Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)

Abstract

A cutting apparatus (2) includes a vibration signal generating unit for generating a vibration signal corresponding to the vibration of a cutting blade (60) and a control unit for determining the condition of the cutting blade ( 60) according to the vibration signal generated by the vibration signal generating unit. The vibration signal generating unit includes an ultrasonic vibrator provided in a first flange member (46) for generating a voltage corresponding to the vibration signal and a transmitting unit connected to the ultrasonic vibrator for transmitting the voltage to the control unit. The control unit includes a storing unit for storing a reference signal corresponding to the vibration signal due to the vibration of the cutting blade ( 60) during the rotation of a spindle and a determination target signal corresponding to the vibration signal due to the vibration of the cutting blade (60) during cutting of a workpiece. The control unit further includes a comparing and determining unit for determining the condition of the cutting blade (60) according to a signal obtained by removing the reference signal from the determination target signal. Figure 3
MYPI2015000514A 2014-03-07 2015-02-27 Cutting apparatus MY177231A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014044996A JP6223239B2 (en) 2014-03-07 2014-03-07 Cutting equipment

Publications (1)

Publication Number Publication Date
MY177231A true MY177231A (en) 2020-09-09

Family

ID=54023050

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2015000514A MY177231A (en) 2014-03-07 2015-02-27 Cutting apparatus

Country Status (5)

Country Link
JP (1) JP6223239B2 (en)
KR (1) KR102157402B1 (en)
CN (1) CN104889870B (en)
MY (1) MY177231A (en)
TW (1) TWI647056B (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6699930B2 (en) * 2016-04-07 2020-05-27 株式会社ディスコ Cutting equipment
JP6815770B2 (en) * 2016-07-13 2021-01-20 株式会社ディスコ Cutting equipment
JP6866217B2 (en) * 2017-04-21 2021-04-28 株式会社ディスコ Cutting equipment
JP7138452B2 (en) * 2018-03-01 2022-09-16 株式会社ディスコ Flange mechanism
CN108873814A (en) * 2018-06-25 2018-11-23 深圳精匠云创科技有限公司 Monitoring system, monitoring method and storage equipment
JP2020113641A (en) * 2019-01-09 2020-07-27 株式会社ディスコ Cutting device
KR102463249B1 (en) 2021-01-07 2022-11-07 (주) 카스윈 Supersonic spindle of built in type and method for vibrating spindle
KR20220104899A (en) 2021-01-19 2022-07-26 (주) 카스윈 Ultra sonic spindle device of external power supply type
KR20220104901A (en) 2021-01-19 2022-07-26 (주) 카스윈 Ultra sonic spindle device of nonutility generation type
CN115401524A (en) * 2022-08-19 2022-11-29 上汽通用五菱汽车股份有限公司 Cutter vibration signal monitoring method, system and medium

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS474816Y1 (en) 1967-03-30 1972-02-21
US4514797A (en) * 1982-09-03 1985-04-30 Gte Valeron Corporation Worn tool detector utilizing normalized vibration signals
JPS6062464A (en) * 1983-09-10 1985-04-10 Kawasaki Steel Corp Side end grinding attachment for metallic belt by rotary grinding wheel
JPH0499946A (en) * 1990-08-20 1992-03-31 Sanko Control Kk Method and apparatus for measuring cutting ability of grinder wheel
JPH05154833A (en) * 1991-12-09 1993-06-22 Nikko Kyodo Co Ltd Dicing machine
JP3534338B2 (en) 1999-10-07 2004-06-07 松下電器産業株式会社 Cutting equipment
JP2002066879A (en) * 2000-09-04 2002-03-05 Bosch Automotive Systems Corp Acoustic emission detecting device for machine tool
JP4149691B2 (en) * 2001-08-31 2008-09-10 株式会社東芝 Method for predicting life of rotating machine for semiconductor manufacturing apparatus and semiconductor manufacturing apparatus
JP4658730B2 (en) * 2005-07-28 2011-03-23 株式会社ディスコ Cutting equipment
EP1977857A1 (en) * 2006-01-12 2008-10-08 Tokyo Seimitsu Co.,Ltd. Working system, contact detecting method, and ae contact detecting device
JP4552883B2 (en) 2006-04-19 2010-09-29 株式会社デンソー Vibration detection method
JP2008290203A (en) * 2007-05-25 2008-12-04 Nissan Diesel Motor Co Ltd Grinding work monitoring system and grinding work monitoring method
JP2009032726A (en) * 2007-07-24 2009-02-12 Disco Abrasive Syst Ltd Method for dividing wafer
JP5258921B2 (en) * 2011-03-31 2013-08-07 株式会社小松製作所 Machine tool and its processing control device
JP5764031B2 (en) * 2011-10-06 2015-08-12 株式会社ディスコ Cutting equipment
JP5943578B2 (en) * 2011-10-11 2016-07-05 株式会社東京精密 Wafer chamfering apparatus, and method for detecting surface state of chamfering grindstone or processing state of wafer by chamfering grindstone
TW201332704A (en) * 2012-02-10 2013-08-16 中原大學 Cutting edge chip-buildup monitoring method

Also Published As

Publication number Publication date
KR102157402B1 (en) 2020-09-17
TWI647056B (en) 2019-01-11
CN104889870A (en) 2015-09-09
JP6223239B2 (en) 2017-11-01
CN104889870B (en) 2019-06-14
TW201544229A (en) 2015-12-01
KR20150105223A (en) 2015-09-16
JP2015170745A (en) 2015-09-28

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