MY171818A - Low profile leaded semiconductor package - Google Patents

Low profile leaded semiconductor package

Info

Publication number
MY171818A
MY171818A MYPI2014000562A MYPI2014000562A MY171818A MY 171818 A MY171818 A MY 171818A MY PI2014000562 A MYPI2014000562 A MY PI2014000562A MY PI2014000562 A MYPI2014000562 A MY PI2014000562A MY 171818 A MY171818 A MY 171818A
Authority
MY
Malaysia
Prior art keywords
semiconductor package
low profile
package
leaded semiconductor
plastic body
Prior art date
Application number
MYPI2014000562A
Inventor
K Williams Richard
Original Assignee
Adventive Ipbank
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Adventive Ipbank filed Critical Adventive Ipbank
Publication of MY171818A publication Critical patent/MY171818A/en

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Classifications

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    • H01L23/49805—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)

Abstract

In a semiconductor package a lead (43C) having a bottom surface coplanar with the flat bottom surface (42B) of the plastic body (42) extends outward at the bottom of the vertical side surface (42A) of the plastic body (42). The result is a package with a minimal footprint that is suitable for the technique known as ?wave soldering? that is used in relatively low-cost printed circuit board assembly factories. Methods of fabricating the package are disclosed.
MYPI2014000562A 2013-03-09 2014-02-27 Low profile leaded semiconductor package MY171818A (en)

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US201361775540P 2013-03-09 2013-03-09
US201361775544P 2013-03-09 2013-03-09
US14/056,287 US9576884B2 (en) 2013-03-09 2013-10-17 Low profile leaded semiconductor package

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MY171818A true MY171818A (en) 2019-10-31

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CN108364918B (en) 2022-08-30
CN104167395B (en) 2018-03-20
MY196641A (en) 2023-04-26
US9793197B2 (en) 2017-10-17
CN108364918A (en) 2018-08-03
US20140306330A1 (en) 2014-10-16
US20180040545A1 (en) 2018-02-08
TW201501251A (en) 2015-01-01
US10008438B2 (en) 2018-06-26
US20170133304A1 (en) 2017-05-11
TWI618201B (en) 2018-03-11
US9576884B2 (en) 2017-02-21
CN104167395A (en) 2014-11-26

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