MY181499A - Low-profile footed power package - Google Patents
Low-profile footed power packageInfo
- Publication number
- MY181499A MY181499A MYPI2017704183A MYPI2017704183A MY181499A MY 181499 A MY181499 A MY 181499A MY PI2017704183 A MYPI2017704183 A MY PI2017704183A MY PI2017704183 A MYPI2017704183 A MY PI2017704183A MY 181499 A MY181499 A MY 181499A
- Authority
- MY
- Malaysia
- Prior art keywords
- die
- package
- die pad
- lead
- heat
- Prior art date
Links
- 238000000034 method Methods 0.000 abstract 2
- 239000004020 conductor Substances 0.000 abstract 1
- 238000005476 soldering Methods 0.000 abstract 1
Classifications
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
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- H01L21/4814—Conductive parts
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
A power package includes a heat tab extending from a die pad exposed on the underside of the package, which facilitates the removal of heat from the die to the PCB or other surface on which the package is mounted. The heat tab has a bottom surface coplanar with the flat bottom surface of the die pad and bottom surface of a lead. The lead includes a horizontal foot segment, a vertical columnar segment, and a horizontal cantilever segment facing the die pad. The heat tab may also have a foot. A die containing a power device is mounted on a top surface of the die pad and may be electrically connected to the lead using a bonding wire or clip. The die may be mounted on the die pad with an electrically conductive material, and the package may also include a lead that extends from the die pad and is thus electrically tied to die bottom of the die. The result is a package with a minimal footprint that is suitable for the technique known as "wave soldering" that is used in relatively low-cost printed circuit board assembly factories. Methods of fabricating the package are disclosed.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/703,359 US9620439B2 (en) | 2013-03-09 | 2015-05-04 | Low-profile footed power package |
PCT/US2016/030456 WO2016179111A1 (en) | 2015-05-04 | 2016-05-02 | Low-profile footed power package |
Publications (1)
Publication Number | Publication Date |
---|---|
MY181499A true MY181499A (en) | 2020-12-23 |
Family
ID=57218289
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2017704183A MY181499A (en) | 2015-05-04 | 2016-05-02 | Low-profile footed power package |
Country Status (4)
Country | Link |
---|---|
CN (1) | CN107924901A (en) |
MY (1) | MY181499A (en) |
TW (1) | TWI601253B (en) |
WO (1) | WO2016179111A1 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10121742B2 (en) * | 2017-03-15 | 2018-11-06 | Amkor Technology, Inc. | Method of forming a packaged semiconductor device using ganged conductive connective assembly and structure |
US10727151B2 (en) * | 2017-05-25 | 2020-07-28 | Infineon Technologies Ag | Semiconductor chip package having a cooling surface and method of manufacturing a semiconductor package |
CN111279471B (en) * | 2017-11-10 | 2023-09-15 | 新电元工业株式会社 | electronic module |
CN110190004A (en) * | 2019-06-11 | 2019-08-30 | 山东海声尼克微电子有限公司 | A kind of welding procedure for high-current supply Module bond |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4935803A (en) * | 1988-09-09 | 1990-06-19 | Motorola, Inc. | Self-centering electrode for power devices |
US6307755B1 (en) * | 1999-05-27 | 2001-10-23 | Richard K. Williams | Surface mount semiconductor package, die-leadframe combination and leadframe therefor and method of mounting leadframes to surfaces of semiconductor die |
US6891256B2 (en) * | 2001-10-22 | 2005-05-10 | Fairchild Semiconductor Corporation | Thin, thermally enhanced flip chip in a leaded molded package |
US9305859B2 (en) * | 2006-05-02 | 2016-04-05 | Advanced Analogic Technologies Incorporated | Integrated circuit die with low thermal resistance |
US9831393B2 (en) * | 2010-07-30 | 2017-11-28 | Cree Hong Kong Limited | Water resistant surface mount device package |
CN102468292B (en) * | 2010-10-29 | 2015-02-25 | 万国半导体股份有限公司 | Packaging body structure for direct current-direct current convertor |
US8513787B2 (en) * | 2011-08-16 | 2013-08-20 | Advanced Analogic Technologies, Incorporated | Multi-die semiconductor package with one or more embedded die pads |
US9576884B2 (en) * | 2013-03-09 | 2017-02-21 | Adventive Ipbank | Low profile leaded semiconductor package |
-
2016
- 2016-05-02 CN CN201680039638.3A patent/CN107924901A/en active Pending
- 2016-05-02 MY MYPI2017704183A patent/MY181499A/en unknown
- 2016-05-02 WO PCT/US2016/030456 patent/WO2016179111A1/en active Application Filing
- 2016-05-04 TW TW105113833A patent/TWI601253B/en active
Also Published As
Publication number | Publication date |
---|---|
TWI601253B (en) | 2017-10-01 |
TW201642420A (en) | 2016-12-01 |
WO2016179111A1 (en) | 2016-11-10 |
CN107924901A (en) | 2018-04-17 |
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