MY167573A - Laminate and method for producing light-emitting diode provided with wavelength conversion layer - Google Patents

Laminate and method for producing light-emitting diode provided with wavelength conversion layer

Info

Publication number
MY167573A
MY167573A MYPI2014701547A MYPI2014701547A MY167573A MY 167573 A MY167573 A MY 167573A MY PI2014701547 A MYPI2014701547 A MY PI2014701547A MY PI2014701547 A MYPI2014701547 A MY PI2014701547A MY 167573 A MY167573 A MY 167573A
Authority
MY
Malaysia
Prior art keywords
laminate
emitting diode
wavelength conversion
conversion layer
base material
Prior art date
Application number
MYPI2014701547A
Other languages
English (en)
Inventor
Matsumura Nobuo
Inoue Takejiro
Sadakuni Hironobu
Ishida Yutaka
Kawamoto Kazunari
Sekiguchi Hiroki
Yoshioka Masahiro
Original Assignee
Toray Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries filed Critical Toray Industries
Publication of MY167573A publication Critical patent/MY167573A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/0427—Coating with only one layer of a composition containing a polymer binder
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/043—Improving the adhesiveness of the coatings per se, e.g. forming primers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/20—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for coatings strippable as coherent films, e.g. temporary coatings strippable as coherent films
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2381/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen, or carbon only; Polysulfones; Derivatives of such polymers
    • C08J2381/04—Polysulfides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2483/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2483/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Laminated Bodies (AREA)
MYPI2014701547A 2011-12-13 2012-12-10 Laminate and method for producing light-emitting diode provided with wavelength conversion layer MY167573A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011271879 2011-12-13

Publications (1)

Publication Number Publication Date
MY167573A true MY167573A (en) 2018-09-20

Family

ID=48612522

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2014701547A MY167573A (en) 2011-12-13 2012-12-10 Laminate and method for producing light-emitting diode provided with wavelength conversion layer

Country Status (5)

Country Link
JP (1) JP5488761B2 (zh)
CN (1) CN104010813B (zh)
MY (1) MY167573A (zh)
TW (1) TWI541128B (zh)
WO (1) WO2013089075A1 (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015119172A (ja) * 2013-11-13 2015-06-25 株式会社日本セラテック 発光素子、発光装置、及びそれらの製造方法
JP6481154B2 (ja) * 2014-10-18 2019-03-13 エムテックスマート株式会社 粉粒体の塗布方法
WO2018235447A1 (ja) * 2017-06-21 2018-12-27 積水ポリマテック株式会社 複合成形体
TWI848915B (zh) * 2017-07-28 2024-07-21 日商杜邦東麗特殊材料股份有限公司 光學構件用樹脂薄片、具備其之光學構件、積層體或發光元件以及光學構件用樹脂薄片之製造方法
US20190198720A1 (en) * 2017-12-22 2019-06-27 Lumileds Llc Particle systems and patterning for monolithic led arrays
US10590339B2 (en) * 2018-05-16 2020-03-17 Osram Opto Semiconductors Gmbh Method for producing a converter element, converter element and light emitting device
KR102038228B1 (ko) * 2018-07-31 2019-10-29 도레이첨단소재 주식회사 색변환 시트 및 이를 포함하는 백라이트 유닛
JP2020029525A (ja) * 2018-08-23 2020-02-27 株式会社オリジン 塗料組成物、塗装品及び塗装品の製造方法
JPWO2021193183A1 (zh) * 2020-03-24 2021-09-30
KR20230047377A (ko) * 2020-08-07 2023-04-07 덴카 주식회사 형광체 도료, 도막, 형광체 기판 및 조명 장치

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3085484B2 (ja) * 1992-04-10 2000-09-11 東レ株式会社 離型フィルム
JP2003001777A (ja) * 2001-06-27 2003-01-08 Toray Ind Inc 離型用積層フィルム
JP4946022B2 (ja) * 2005-12-06 2012-06-06 東レ株式会社 ポリフェニレンサルファイド複合フィルム
JP5587771B2 (ja) * 2008-05-28 2014-09-10 株式会社クレハ ポリフェニレンサルファイド樹脂製回路基板用離型フィルム及び積層体
JP5287935B2 (ja) * 2011-06-16 2013-09-11 東レ株式会社 蛍光体含有シート、それを用いたｌｅｄ発光装置およびその製造方法

Also Published As

Publication number Publication date
JPWO2013089075A1 (ja) 2015-04-27
JP5488761B2 (ja) 2014-05-14
TWI541128B (zh) 2016-07-11
WO2013089075A1 (ja) 2013-06-20
TW201323211A (zh) 2013-06-16
CN104010813B (zh) 2016-08-24
CN104010813A (zh) 2014-08-27

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