MY161100A - Conductive paste - Google Patents
Conductive pasteInfo
- Publication number
- MY161100A MY161100A MYPI2011003255A MYPI2011003255A MY161100A MY 161100 A MY161100 A MY 161100A MY PI2011003255 A MYPI2011003255 A MY PI2011003255A MY PI2011003255 A MYPI2011003255 A MY PI2011003255A MY 161100 A MY161100 A MY 161100A
- Authority
- MY
- Malaysia
- Prior art keywords
- weight
- conductive paste
- glass frit
- components
- al2o3
- Prior art date
Links
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract 1
- 229910052681 coesite Inorganic materials 0.000 abstract 1
- 229910052593 corundum Inorganic materials 0.000 abstract 1
- 229910052906 cristobalite Inorganic materials 0.000 abstract 1
- 239000011521 glass Substances 0.000 abstract 1
- 239000000843 powder Substances 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 235000012239 silicon dioxide Nutrition 0.000 abstract 1
- 229910052682 stishovite Inorganic materials 0.000 abstract 1
- 229910052905 tridymite Inorganic materials 0.000 abstract 1
- 229910001845 yogo sapphire Inorganic materials 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/14—Conductive material dispersed in non-conductive inorganic material
- H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/12—Silica-free oxide glass compositions
- C03C3/122—Silica-free oxide glass compositions containing oxides of As, Sb, Bi, Mo, W, V, Te as glass formers
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
- C03C8/18—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions containing free metals
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
- H01B1/08—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Geochemistry & Mineralogy (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Computer Hardware Design (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Inorganic Chemistry (AREA)
- Wood Science & Technology (AREA)
- Conductive Materials (AREA)
- Glass Compositions (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010158793A JP5488282B2 (ja) | 2010-07-13 | 2010-07-13 | 導電性ペースト |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY161100A true MY161100A (en) | 2017-04-14 |
Family
ID=45484059
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI2011003255A MY161100A (en) | 2010-07-13 | 2011-07-11 | Conductive paste |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5488282B2 (ja) |
| KR (1) | KR101786722B1 (ja) |
| CN (1) | CN102332320B (ja) |
| MY (1) | MY161100A (ja) |
| TW (1) | TWI483269B (ja) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI490184B (zh) * | 2012-12-11 | 2015-07-01 | Advanced Electronic Materials Inc | 無鉛奈米導電漿材料 |
| JP6201190B2 (ja) * | 2014-04-25 | 2017-09-27 | 住友金属鉱山株式会社 | 厚膜導体形成用組成物及びそれを用いて得られる厚膜導体 |
| CN107113969B (zh) * | 2015-01-13 | 2019-06-25 | 日本特殊陶业株式会社 | 陶瓷基板 |
| GB201600573D0 (en) * | 2016-01-12 | 2016-02-24 | Johnson Matthey Plc | Conductive paste, article and process |
| KR101860745B1 (ko) * | 2016-04-18 | 2018-05-24 | (주)창성 | 가소성수지를 적용한 내압착용 전극 페이스트 조성물 및 이를 이용한 칩부품 제조 방법 |
| WO2018025627A1 (ja) * | 2016-08-03 | 2018-02-08 | 昭栄化学工業株式会社 | 導電性ペースト |
| KR102370946B1 (ko) * | 2017-02-10 | 2022-03-08 | 현대자동차주식회사 | 연료 센더용 전극 페이스트 및 그 제조방법 |
| WO2019073637A1 (ja) * | 2017-10-13 | 2019-04-18 | 株式会社村田製作所 | 導電性ペースト、ガラス物品、及びガラス物品の製造方法 |
| CN112992402B (zh) * | 2021-04-16 | 2021-10-08 | 西安宏星电子浆料科技股份有限公司 | 片式电阻用银和二维MXene混合体系导体浆料及其制备方法 |
| CN116354604A (zh) * | 2023-05-31 | 2023-06-30 | 江苏精瓷智能传感技术研究院有限公司 | 用于铂电阻薄膜温度传感的玻璃陶瓷密封材料的制备方法 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3419474B2 (ja) * | 1992-06-25 | 2003-06-23 | 旭テクノグラス株式会社 | 導電性組成物及び多層回路基板 |
| JP2002008441A (ja) | 2000-06-19 | 2002-01-11 | Toyobo Co Ltd | 導電性ペースト |
| WO2005041213A1 (ja) | 2003-10-27 | 2005-05-06 | Toyo Boseki Kabushiki Kaisha | 導電性ペースト |
| JP4432604B2 (ja) * | 2004-04-30 | 2010-03-17 | 昭栄化学工業株式会社 | 導電性ペースト |
| JP4466402B2 (ja) * | 2005-02-17 | 2010-05-26 | 住友金属鉱山株式会社 | 厚膜導体形成用組成物 |
| US7611645B2 (en) * | 2005-04-25 | 2009-11-03 | E. I. Du Pont De Nemours And Company | Thick film conductor compositions and the use thereof in LTCC circuits and devices |
| CN1329926C (zh) * | 2005-05-13 | 2007-08-01 | 范琳 | 一种无铅银电极浆料及其制造方法 |
| JP4456612B2 (ja) * | 2007-03-15 | 2010-04-28 | 三ツ星ベルト株式会社 | 銅導体ペースト、導体回路板及び電子部品 |
| JP2008243946A (ja) | 2007-03-26 | 2008-10-09 | Dainippon Printing Co Ltd | 導電性基板及びその製造方法 |
| JP2009062523A (ja) | 2007-08-10 | 2009-03-26 | Think Laboratory Co Ltd | 導電性インキ組成物 |
| KR20100080612A (ko) * | 2007-10-18 | 2010-07-09 | 이 아이 듀폰 디 네모아 앤드 캄파니 | 반도체 소자의 제조에 사용하기 위한 무연 전도성 조성물 및 공정: Ｍｇ-함유 첨가제 |
| JP5446097B2 (ja) | 2008-02-01 | 2014-03-19 | 大日本印刷株式会社 | 導電性基板及びその製造方法 |
-
2010
- 2010-07-13 JP JP2010158793A patent/JP5488282B2/ja active Active
-
2011
- 2011-06-29 KR KR1020110063540A patent/KR101786722B1/ko active IP Right Grant
- 2011-07-11 MY MYPI2011003255A patent/MY161100A/en unknown
- 2011-07-12 TW TW100124530A patent/TWI483269B/zh active
- 2011-07-13 CN CN201110195191.8A patent/CN102332320B/zh active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2012022841A (ja) | 2012-02-02 |
| CN102332320B (zh) | 2016-03-02 |
| TWI483269B (zh) | 2015-05-01 |
| JP5488282B2 (ja) | 2014-05-14 |
| CN102332320A (zh) | 2012-01-25 |
| KR101786722B1 (ko) | 2017-10-18 |
| TW201207867A (en) | 2012-02-16 |
| KR20120006931A (ko) | 2012-01-19 |
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