MY160010A - Bonding wire and a method of manufacturing the same - Google Patents

Bonding wire and a method of manufacturing the same

Info

Publication number
MY160010A
MY160010A MYPI2013003150A MYPI2013003150A MY160010A MY 160010 A MY160010 A MY 160010A MY PI2013003150 A MYPI2013003150 A MY PI2013003150A MY PI2013003150 A MYPI2013003150 A MY PI2013003150A MY 160010 A MY160010 A MY 160010A
Authority
MY
Malaysia
Prior art keywords
bonding wire
wire
coating layer
sectional area
cross
Prior art date
Application number
MYPI2013003150A
Other languages
English (en)
Inventor
Tsuyoshi Hasegawa
Original Assignee
Tatsuta Electric Wire & Cable Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tatsuta Electric Wire & Cable Co Ltd filed Critical Tatsuta Electric Wire & Cable Co Ltd
Publication of MY160010A publication Critical patent/MY160010A/en

Links

Classifications

    • H—ELECTRICITY
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Non-Insulated Conductors (AREA)
MYPI2013003150A 2011-02-28 2011-11-28 Bonding wire and a method of manufacturing the same MY160010A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011042560A JP4860004B1 (ja) 2011-02-28 2011-02-28 ボンディングワイヤ及びその製造方法

Publications (1)

Publication Number Publication Date
MY160010A true MY160010A (en) 2017-02-15

Family

ID=45604549

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2013003150A MY160010A (en) 2011-02-28 2011-11-28 Bonding wire and a method of manufacturing the same

Country Status (4)

Country Link
JP (1) JP4860004B1 (ja)
CN (1) CN103597590B (ja)
MY (1) MY160010A (ja)
WO (1) WO2012117636A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5786042B2 (ja) * 2012-01-25 2015-09-30 日鉄住金マイクロメタル株式会社 ボンディングワイヤ及びその製造方法
JP5671512B2 (ja) * 2012-11-07 2015-02-18 タツタ電線株式会社 ボンディング用ワイヤ
SG10201403532QA (en) * 2014-06-23 2016-01-28 Heraeus Deutschland Gmbh & Co Kg Copper bonding wire with angstrom (a) thick surface oxide layer

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6297360A (ja) * 1985-10-24 1987-05-06 Mitsubishi Metal Corp 半導体装置のボンデイングワイヤ用表面被覆高純度銅極細線
JP3230141B2 (ja) * 1995-08-10 2001-11-19 三菱マテリアル株式会社 半導体装置用ボンディングワイヤ
JP2003059964A (ja) * 2001-08-10 2003-02-28 Tanaka Electronics Ind Co Ltd ボンディングワイヤ及びその製造方法
JP2004064033A (ja) * 2001-10-23 2004-02-26 Sumitomo Electric Wintec Inc ボンディングワイヤー
JP4750112B2 (ja) * 2005-06-15 2011-08-17 Ｊｘ日鉱日石金属株式会社 超高純度銅及びその製造方法並びに超高純度銅からなるボンディングワイヤ
CN102842539B (zh) * 2007-07-24 2015-06-24 新日铁住金高新材料株式会社 半导体装置用接合线
JP5109881B2 (ja) * 2008-09-04 2012-12-26 住友金属鉱山株式会社 銅ボンディングワイヤ
JP2010199528A (ja) * 2009-01-27 2010-09-09 Tatsuta System Electronics Kk ボンディングワイヤ

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