MY144061A - Polishing composition - Google Patents

Polishing composition

Info

Publication number
MY144061A
MY144061A MYPI20041724A MYPI20041724A MY144061A MY 144061 A MY144061 A MY 144061A MY PI20041724 A MYPI20041724 A MY PI20041724A MY PI20041724 A MYPI20041724 A MY PI20041724A MY 144061 A MY144061 A MY 144061A
Authority
MY
Malaysia
Prior art keywords
polishing composition
polishing
alumina
acids
salts
Prior art date
Application number
MYPI20041724A
Other languages
English (en)
Inventor
Takanori Uno
Hiroyasu Sugiyama
Toshiki Owaki
Original Assignee
Fujimi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujimi Inc filed Critical Fujimi Inc
Publication of MY144061A publication Critical patent/MY144061A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/04—Aqueous dispersions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
MYPI20041724A 2003-05-09 2004-05-07 Polishing composition MY144061A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003132312A JP4202183B2 (ja) 2003-05-09 2003-05-09 研磨用組成物

Publications (1)

Publication Number Publication Date
MY144061A true MY144061A (en) 2011-08-15

Family

ID=32501271

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20041724A MY144061A (en) 2003-05-09 2004-05-07 Polishing composition

Country Status (4)

Country Link
JP (1) JP4202183B2 (ja)
CN (1) CN100392035C (ja)
GB (1) GB2401610B (ja)
MY (1) MY144061A (ja)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4718164B2 (ja) * 2004-11-26 2011-07-06 株式会社フジミインコーポレーテッド 研磨用組成物及びそれを用いた研磨方法
KR101267971B1 (ko) * 2005-08-31 2013-05-27 가부시키가이샤 후지미인코퍼레이티드 연마용 조성물 및 연마 방법
US7922926B2 (en) * 2008-01-08 2011-04-12 Cabot Microelectronics Corporation Composition and method for polishing nickel-phosphorous-coated aluminum hard disks
JP5536433B2 (ja) * 2009-12-11 2014-07-02 花王株式会社 ハードディスク基板用研磨液組成物
CN103501963A (zh) * 2011-05-20 2014-01-08 株式会社小原 研磨品的制造方法
JP5755054B2 (ja) * 2011-05-20 2015-07-29 株式会社オハラ 基板の製造方法
TWI547552B (zh) * 2012-03-19 2016-09-01 福吉米股份有限公司 硏光加工用硏磨材及使用此之基板的製造方法
US9039914B2 (en) 2012-05-23 2015-05-26 Cabot Microelectronics Corporation Polishing composition for nickel-phosphorous-coated memory disks
WO2014013977A1 (ja) * 2012-07-17 2014-01-23 株式会社 フジミインコーポレーテッド 合金材料研磨用組成物及びそれを用いた合金材料の製造方法
CN103937414B (zh) * 2014-04-29 2018-03-02 杰明纳微电子股份有限公司 一种计算机硬盘盘基片的精抛光液
CN107735478A (zh) * 2015-06-26 2018-02-23 福吉米株式会社 研磨用组合物
CN106366939A (zh) * 2016-08-30 2017-02-01 东兴华鸿光学科技有限公司 用于光学镜片的抛光液
TW202128943A (zh) 2019-12-20 2021-08-01 日商Jsr 股份有限公司 化學機械研磨用組成物、化學機械研磨方法及化學機械研磨用粒子的製造方法
JP7457586B2 (ja) * 2020-06-18 2024-03-28 株式会社フジミインコーポレーテッド 研磨用組成物の濃縮液およびこれを用いた研磨方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3106339B2 (ja) * 1994-02-04 2000-11-06 株式会社フジミインコーポレーテッド 研磨用組成物
US5693239A (en) * 1995-10-10 1997-12-02 Rodel, Inc. Polishing slurries comprising two abrasive components and methods for their use
US5858813A (en) * 1996-05-10 1999-01-12 Cabot Corporation Chemical mechanical polishing slurry for metal layers and films
US6007592A (en) * 1996-11-14 1999-12-28 Nissan Chemical Industries, Ltd. Polishing composition for aluminum disk and polishing process therewith
US6475407B2 (en) * 1998-05-19 2002-11-05 Showa Denko K.K. Composition for polishing metal on semiconductor wafer and method of using same
JP3998813B2 (ja) * 1998-06-15 2007-10-31 株式会社フジミインコーポレーテッド 研磨用組成物
JP3781677B2 (ja) * 1999-09-30 2006-05-31 昭和電工株式会社 研磨用組成物および研磨方法
WO2001044395A1 (en) * 1999-12-14 2001-06-21 Rodel Holdings, Inc. Polishing compositions for semiconductor substrates
US6527622B1 (en) * 2002-01-22 2003-03-04 Cabot Microelectronics Corporation CMP method for noble metals

Also Published As

Publication number Publication date
CN1550532A (zh) 2004-12-01
GB2401610B (en) 2007-12-27
GB0410214D0 (en) 2004-06-09
GB2401610A (en) 2004-11-17
JP2004331886A (ja) 2004-11-25
JP4202183B2 (ja) 2008-12-24
CN100392035C (zh) 2008-06-04

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