MY141047A - Core having superior end face insulation and method of treating core end faces to give insulation coating - Google Patents
Core having superior end face insulation and method of treating core end faces to give insulation coatingInfo
- Publication number
- MY141047A MY141047A MYPI20023729A MYPI20023729A MY141047A MY 141047 A MY141047 A MY 141047A MY PI20023729 A MYPI20023729 A MY PI20023729A MY PI20023729 A MYPI20023729 A MY PI20023729A MY 141047 A MY141047 A MY 141047A
- Authority
- MY
- Malaysia
- Prior art keywords
- core
- silicone polymer
- insulation
- end faces
- insulation coating
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
- C23C18/122—Inorganic polymers, e.g. silanes, polysilazanes, polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/125—Process of deposition of the inorganic material
- C23C18/1254—Sol or sol-gel processing
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/125—Process of deposition of the inorganic material
- C23C18/1262—Process of deposition of the inorganic material involving particles, e.g. carbon nanotubes [CNT], flakes
- C23C18/127—Preformed particles
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K1/00—Details of the magnetic circuit
- H02K1/04—Details of the magnetic circuit characterised by the material used for insulating the magnetic circuit or parts thereof
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K15/00—Methods or apparatus specially adapted for manufacturing, assembling, maintaining or repairing of dynamo-electric machines
- H02K15/10—Applying solid insulation to windings, stators or rotors
- H02K15/105—Applying solid insulation to windings, stators or rotors to the windings
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Dispersion Chemistry (AREA)
- Nanotechnology (AREA)
- Soft Magnetic Materials (AREA)
- Manufacturing Of Steel Electrode Plates (AREA)
- Insulating Of Coils (AREA)
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001310379 | 2001-10-05 | ||
JP2002077613 | 2002-03-20 | ||
JP2002215387 | 2002-07-24 | ||
JP2002216949A JP2003193263A (ja) | 2001-10-05 | 2002-07-25 | 優れた端面絶縁性を有する鉄心と鉄心端面の絶縁被膜処理方法 |
JP2002222759 | 2002-07-31 | ||
JP2002242967 | 2002-08-23 | ||
JP2002277578A JP2004111884A (ja) | 2002-07-24 | 2002-09-24 | 絶縁性と耐食性の極めて優れる変圧器鉄心およびその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
MY141047A true MY141047A (en) | 2010-02-25 |
Family
ID=42063624
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI20023729A MY141047A (en) | 2001-10-05 | 2002-10-04 | Core having superior end face insulation and method of treating core end faces to give insulation coating |
Country Status (5)
Country | Link |
---|---|
KR (1) | KR100567041B1 (th) |
HK (1) | HK1088991A1 (th) |
IN (1) | IN2014DN03549A (th) |
MY (1) | MY141047A (th) |
TW (1) | TWI313305B (th) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008071982A (ja) | 2006-09-15 | 2008-03-27 | Hitachi Industrial Equipment Systems Co Ltd | 変圧器 |
KR100983516B1 (ko) * | 2008-08-05 | 2010-09-24 | 원종근 | 와전류 및 자기이력 손실이 적은 중ㆍ고주파용 변압기 및그 제조방법 |
WO2014119907A1 (en) * | 2013-01-31 | 2014-08-07 | Kolon Industries, Inc. | Silicone resin and method of preparing the same |
CN105793466B (zh) | 2013-11-28 | 2018-06-08 | 杰富意钢铁株式会社 | 带绝缘膜的电磁钢板 |
KR101633633B1 (ko) * | 2013-12-23 | 2016-06-27 | 주식회사 포스코 | 무방향성 전기강판 및 그 제조방법 |
KR20210083569A (ko) * | 2019-12-27 | 2021-07-07 | 엘지전자 주식회사 | 무방향성 전기강판 및 그 제조 방법 |
CN114421726B (zh) * | 2022-02-09 | 2024-04-09 | 浙江露通机电有限公司 | 一种无刷电机外壳与磁铁固定浸漆工艺及加工槽 |
-
2002
- 2002-10-04 KR KR1020037007484A patent/KR100567041B1/ko active IP Right Grant
- 2002-10-04 TW TW091123060A patent/TWI313305B/zh not_active IP Right Cessation
- 2002-10-04 MY MYPI20023729A patent/MY141047A/en unknown
- 2002-10-04 IN IN3549DEN2014 patent/IN2014DN03549A/en unknown
-
2006
- 2006-08-21 HK HK06109222.5A patent/HK1088991A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR100567041B1 (ko) | 2006-04-04 |
KR20040015035A (ko) | 2004-02-18 |
HK1088991A1 (en) | 2006-11-17 |
IN2014DN03549A (th) | 2015-07-10 |
TWI313305B (th) | 2009-08-11 |
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