IN2014DN03549A - - Google Patents

Info

Publication number
IN2014DN03549A
IN2014DN03549A IN3549DEN2014A IN2014DN03549A IN 2014DN03549 A IN2014DN03549 A IN 2014DN03549A IN 3549DEN2014 A IN3549DEN2014 A IN 3549DEN2014A IN 2014DN03549 A IN2014DN03549 A IN 2014DN03549A
Authority
IN
India
Prior art keywords
insulation
conductors
corrosion resistance
comprised
pure silicon
Prior art date
Application number
Other languages
English (en)
Inventor
Kumano Tomoji
Kaido Chikara
Fujii Hiroyasu
Tanaka Osamu
Kubo Yuji
Yamada Noriko
Fujii Norikazu
Hanzawa Kazufumi
Higashine Kazutaka
Original Assignee
Nittetsu Plant Designing Corp
Nippon Steel Corp & Sumitomo Metal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2002216949A external-priority patent/JP2003193263A/ja
Priority claimed from JP2002277578A external-priority patent/JP2004111884A/ja
Application filed by Nittetsu Plant Designing Corp, Nippon Steel Corp & Sumitomo Metal Corp filed Critical Nittetsu Plant Designing Corp
Priority claimed from PCT/JP2002/010385 external-priority patent/WO2003031681A1/ja
Publication of IN2014DN03549A publication Critical patent/IN2014DN03549A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
    • C23C18/122—Inorganic polymers, e.g. silanes, polysilazanes, polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/125—Process of deposition of the inorganic material
    • C23C18/1254—Sol or sol-gel processing
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/125—Process of deposition of the inorganic material
    • C23C18/1262—Process of deposition of the inorganic material involving particles, e.g. carbon nanotubes [CNT], flakes
    • C23C18/127—Preformed particles
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K1/00—Details of the magnetic circuit
    • H02K1/04—Details of the magnetic circuit characterised by the material used for insulating the magnetic circuit or parts thereof
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K15/00—Methods or apparatus specially adapted for manufacturing, assembling, maintaining or repairing of dynamo-electric machines
    • H02K15/10—Applying solid insulation to windings, stators or rotors
    • H02K15/105—Applying solid insulation to windings, stators or rotors to the windings

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Dispersion Chemistry (AREA)
  • Nanotechnology (AREA)
  • Soft Magnetic Materials (AREA)
  • Manufacturing Of Steel Electrode Plates (AREA)
  • Insulating Of Coils (AREA)
IN3549DEN2014 2001-10-05 2002-10-04 IN2014DN03549A (th)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2001310379 2001-10-05
JP2002077613 2002-03-20
JP2002215387 2002-07-24
JP2002216949A JP2003193263A (ja) 2001-10-05 2002-07-25 優れた端面絶縁性を有する鉄心と鉄心端面の絶縁被膜処理方法
JP2002222759 2002-07-31
JP2002242967 2002-08-23
JP2002277578A JP2004111884A (ja) 2002-07-24 2002-09-24 絶縁性と耐食性の極めて優れる変圧器鉄心およびその製造方法
PCT/JP2002/010385 WO2003031681A1 (fr) 2001-10-05 2002-10-04 Noyau de fer presentant un excellent pouvoir isolant place en extremite, et procede d'application d'un revetement sur une extremite d'un noyau de fer

Publications (1)

Publication Number Publication Date
IN2014DN03549A true IN2014DN03549A (th) 2015-07-10

Family

ID=42063624

Family Applications (1)

Application Number Title Priority Date Filing Date
IN3549DEN2014 IN2014DN03549A (th) 2001-10-05 2002-10-04

Country Status (5)

Country Link
KR (1) KR100567041B1 (th)
HK (1) HK1088991A1 (th)
IN (1) IN2014DN03549A (th)
MY (1) MY141047A (th)
TW (1) TWI313305B (th)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008071982A (ja) 2006-09-15 2008-03-27 Hitachi Industrial Equipment Systems Co Ltd 変圧器
KR100983516B1 (ko) * 2008-08-05 2010-09-24 원종근 와전류 및 자기이력 손실이 적은 중ㆍ고주파용 변압기 및그 제조방법
WO2014119907A1 (en) * 2013-01-31 2014-08-07 Kolon Industries, Inc. Silicone resin and method of preparing the same
KR101811249B1 (ko) 2013-11-28 2017-12-21 제이에프이 스틸 가부시키가이샤 절연 피막 부착 전자 강판
KR101633633B1 (ko) * 2013-12-23 2016-06-27 주식회사 포스코 무방향성 전기강판 및 그 제조방법
KR20210083569A (ko) * 2019-12-27 2021-07-07 엘지전자 주식회사 무방향성 전기강판 및 그 제조 방법
CN114421726B (zh) * 2022-02-09 2024-04-09 浙江露通机电有限公司 一种无刷电机外壳与磁铁固定浸漆工艺及加工槽

Also Published As

Publication number Publication date
HK1088991A1 (en) 2006-11-17
KR20040015035A (ko) 2004-02-18
KR100567041B1 (ko) 2006-04-04
MY141047A (en) 2010-02-25
TWI313305B (th) 2009-08-11

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