MY134260A - Compositions and methods for thermosetting molecules in organic compositions - Google Patents

Compositions and methods for thermosetting molecules in organic compositions

Info

Publication number
MY134260A
MY134260A MYPI20015668A MYPI20015668A MY134260A MY 134260 A MY134260 A MY 134260A MY PI20015668 A MYPI20015668 A MY PI20015668A MY PI20015668 A MYPI20015668 A MY PI20015668A MY 134260 A MY134260 A MY 134260A
Authority
MY
Malaysia
Prior art keywords
polymer
compositions
thermosetting
arms
dielectric constant
Prior art date
Application number
MYPI20015668A
Other languages
English (en)
Inventor
Kreisler Lau
Feng Quan Liu
Boris Korolev
Emma Brouk
Ruslan Zherebin
David Nalewajek
Original Assignee
Honeywell Int Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/618,945 external-priority patent/US6469123B1/en
Application filed by Honeywell Int Inc filed Critical Honeywell Int Inc
Publication of MY134260A publication Critical patent/MY134260A/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/30Post-polymerisation treatment, e.g. recovery, purification, drying
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/12Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/02Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2650/00Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G2650/28Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type
    • C08G2650/60Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type containing acetylenic group

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
  • Formation Of Insulating Films (AREA)
  • Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
MYPI20015668A 2000-07-19 2001-12-13 Compositions and methods for thermosetting molecules in organic compositions MY134260A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/618,945 US6469123B1 (en) 2000-07-19 2000-07-19 Compositions and methods for thermosetting molecules in organic compositions
US09/897,936 US20020022708A1 (en) 2000-07-19 2001-07-05 Compositions and methods for thermosetting molecules in organic compositions

Publications (1)

Publication Number Publication Date
MY134260A true MY134260A (en) 2007-11-30

Family

ID=27088367

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20015668A MY134260A (en) 2000-07-19 2001-12-13 Compositions and methods for thermosetting molecules in organic compositions

Country Status (9)

Country Link
US (2) US20020022708A1 (https=)
EP (1) EP1309639A4 (https=)
JP (1) JP2004504455A (https=)
KR (1) KR100620207B1 (https=)
CN (1) CN1458945A (https=)
AU (1) AU2001280549A1 (https=)
MY (1) MY134260A (https=)
TW (1) TWI241310B (https=)
WO (1) WO2002008308A1 (https=)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6987147B2 (en) * 2001-10-01 2006-01-17 Honeywell International Inc. Low dielectric constant materials with improved thermo-mechanical strength and processability
US20030143332A1 (en) * 2002-01-31 2003-07-31 Sumitomo Chemical Company, Limited Coating solution for forming insulating film
JP4878779B2 (ja) 2004-06-10 2012-02-15 富士フイルム株式会社 膜形成用組成物、絶縁膜及び電子デバイス
JP4516857B2 (ja) * 2005-02-28 2010-08-04 富士フイルム株式会社 カゴ構造を有する重合体、それを含む膜形成用組成物、絶縁膜および電子デバイス
JP2007119706A (ja) * 2005-09-28 2007-05-17 Fujifilm Corp 重合体および膜形成用組成物
JP4792282B2 (ja) * 2005-12-09 2011-10-12 富士フイルム株式会社 重合体および膜形成用組成物
JP2007161780A (ja) * 2005-12-09 2007-06-28 Fujifilm Corp 膜形成用組成物、該組成物を用いた絶縁膜及び電子デバイス
US20080159114A1 (en) * 2007-01-02 2008-07-03 Dipietro Richard Anthony High density data storage medium, method and device
US7558186B2 (en) * 2007-01-02 2009-07-07 International Business Machines Corporation High density data storage medium, method and device
JP2008192879A (ja) 2007-02-06 2008-08-21 Fujifilm Corp 半導体集積回路の絶縁膜
JP2008231174A (ja) * 2007-03-19 2008-10-02 Fujifilm Corp 膜形成用組成物、絶縁膜及び電子デバイス
GB2451865A (en) 2007-08-15 2009-02-18 Univ Liverpool Microporous polymers from alkynyl monomers
JP5012372B2 (ja) * 2007-09-27 2012-08-29 住友ベークライト株式会社 有機絶縁膜及び半導体装置
US7799843B2 (en) 2008-02-29 2010-09-21 Fujifilm Corporation Film
JP5404772B2 (ja) * 2008-04-28 2014-02-05 ビーエーエスエフ ソシエタス・ヨーロピア ツイン重合によって得られるLow−k誘電体
JP5401118B2 (ja) 2008-12-10 2014-01-29 富士フイルム株式会社 組成物
JP6666138B2 (ja) 2015-12-24 2020-03-13 エア・ウォーター株式会社 多価アルキン化合物、その製法および用途

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4918158A (en) * 1986-07-21 1990-04-17 Fluorochem Inc. 1,3-diethynyladamantane and methods of polymerization thereof
US5017734A (en) * 1989-12-11 1991-05-21 Kurt Baum Ethynyl adamantane derivatives and methods of polymerization thereof
JPH04314394A (ja) 1991-04-12 1992-11-05 Fujitsu Ltd ガラスセラミック回路基板とその製造方法
US5347063A (en) 1993-03-09 1994-09-13 Mobil Oil Corporation Method for direct arylation of diamondoids
US5576355A (en) * 1993-06-04 1996-11-19 Mobil Oil Corp. Diamondoid derivatives for pharmaceutical use
US5744399A (en) 1995-11-13 1998-04-28 Lsi Logic Corporation Process for forming low dielectric constant layers using fullerenes
WO2000031183A1 (en) * 1998-11-24 2000-06-02 The Dow Chemical Company A composition containing a cross-linkable matrix precursor and a poragen, and a porous matrix prepared therefrom
US6413202B1 (en) * 1999-01-21 2002-07-02 Alliedsignal, Inc. Solvent systems for polymeric dielectric materials
US6509415B1 (en) * 2000-04-07 2003-01-21 Honeywell International Inc. Low dielectric constant organic dielectrics based on cage-like structures
US6444715B1 (en) * 2000-06-06 2002-09-03 Honeywell International Inc. Low dielectric materials and methods of producing same
US6469123B1 (en) * 2000-07-19 2002-10-22 Honeywell International Inc. Compositions and methods for thermosetting molecules in organic compositions
US6423811B1 (en) * 2000-07-19 2002-07-23 Honeywell International Inc. Low dielectric constant materials with polymeric networks

Also Published As

Publication number Publication date
WO2002008308A1 (en) 2002-01-31
US20020022708A1 (en) 2002-02-21
KR100620207B1 (ko) 2006-09-13
EP1309639A1 (en) 2003-05-14
KR20030031123A (ko) 2003-04-18
EP1309639A4 (en) 2004-12-08
US6803441B2 (en) 2004-10-12
AU2001280549A1 (en) 2002-02-05
US20030096938A1 (en) 2003-05-22
CN1458945A (zh) 2003-11-26
TWI241310B (en) 2005-10-11
JP2004504455A (ja) 2004-02-12

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