MY127672A - High speed ge channel heterostructures for field effect devices - Google Patents
High speed ge channel heterostructures for field effect devicesInfo
- Publication number
- MY127672A MY127672A MYPI20000966A MYPI20000966A MY127672A MY 127672 A MY127672 A MY 127672A MY PI20000966 A MYPI20000966 A MY PI20000966A MY PI20000966 A MYPI20000966 A MY PI20000966A MY 127672 A MY127672 A MY 127672A
- Authority
- MY
- Malaysia
- Prior art keywords
- channel
- mobility
- field effect
- low temperatures
- compressively strained
- Prior art date
Links
- 230000005669 field effect Effects 0.000 title abstract 2
- 239000004065 semiconductor Substances 0.000 abstract 2
- 230000000295 complement effect Effects 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- VLCQZHSMCYCDJL-UHFFFAOYSA-N tribenuron methyl Chemical compound COC(=O)C1=CC=CC=C1S(=O)(=O)NC(=O)N(C)C1=NC(C)=NC(OC)=N1 VLCQZHSMCYCDJL-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
- H01L29/7782—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with confinement of carriers by at least two heterojunctions, e.g. DHHEMT, quantum well HEMT, DHMODFET
Landscapes
- Microelectronics & Electronic Packaging (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Computer Hardware Design (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Junction Field-Effect Transistors (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Thin Film Transistor (AREA)
- Recrystallisation Techniques (AREA)
- Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
- Acyclic And Carbocyclic Compounds In Medicinal Compositions (AREA)
Abstract
A METHOD AND A LAYERED HETEROSTRUCTURE FOR FORMING HIGH MOBILITY GE CHANNEL FIELD EFFECT TRANSISTORS IS DESCRIBED INCORPORATING A PLURALITY OF SEMICONDUCTOR LAYERS ON A SEMICONDUCTOR SUBSTRATE, AND A CHANNEL STRUCTURE OF A COMPRESSIVELY STRAINED EPITAXIAL GE LAYER HAVING A HIGHER BARRIER OR A DEEPER CONFINING QUANTUM WELL AND HAVING EXTREMELY HIGH HOLE MOBILITY FOR COMPLEMENTARY MODFETS AND MOSFETS. THE INVENTION OVERCOMES THE PROBLEM OF A LIMITED HOLE MOBILITY DUE TO ALLOY SCATTERING FOR A P-CHANNEL DEVICE WITH ONLY A SINGLE COMPRESSIVELY STRAINED SIGE CHANNEL LAYER. THIS INVENTION FURTHER PROVIDES IMPROVEMENTS IN MOBILITY AND TRANSCONDUCTANCE OVER DEEP SUBMICRON STATE-OF-THE ART SI PMOSFETS IN ADDITION TO HAVING A BROAD TEMPERATURE OPERATION REGIME FROM ABOVE ROOM TEMPERATURE (425 K) DOWN TO CRYOGENIC LOW TEMPERATURES (0.4 K) WHERE AT LOW TEMPERATURES EVEN HIGH DEVICE PERFORMANCES ARE ACHIEVABLE.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12429999P | 1999-03-12 | 1999-03-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
MY127672A true MY127672A (en) | 2006-12-29 |
Family
ID=22414018
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI20000966A MY127672A (en) | 1999-03-12 | 2000-03-11 | High speed ge channel heterostructures for field effect devices |
Country Status (9)
Country | Link |
---|---|
EP (1) | EP1169737B1 (en) |
JP (2) | JP3974329B2 (en) |
KR (1) | KR100441469B1 (en) |
CN (1) | CN1331240C (en) |
AT (1) | ATE394794T1 (en) |
DE (1) | DE60038793D1 (en) |
MY (1) | MY127672A (en) |
TW (1) | TW477025B (en) |
WO (1) | WO2000054338A1 (en) |
Families Citing this family (50)
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US6489639B1 (en) * | 2000-05-24 | 2002-12-03 | Raytheon Company | High electron mobility transistor |
AU2001263211A1 (en) | 2000-05-26 | 2001-12-11 | Amberwave Systems Corporation | Buried channel strained silicon fet using an ion implanted doped layer |
US6593641B1 (en) | 2001-03-02 | 2003-07-15 | Amberwave Systems Corporation | Relaxed silicon germanium platform for high speed CMOS electronics and high speed analog circuits |
US6830976B2 (en) | 2001-03-02 | 2004-12-14 | Amberwave Systems Corproation | Relaxed silicon germanium platform for high speed CMOS electronics and high speed analog circuits |
US6900103B2 (en) | 2001-03-02 | 2005-05-31 | Amberwave Systems Corporation | Relaxed silicon germanium platform for high speed CMOS electronics and high speed analog circuits |
WO2002071491A1 (en) * | 2001-03-02 | 2002-09-12 | Amberwave Systems Corporation | Relaxed silicon germanium platform for high speed cmos electronics and high speed analog circuits |
US6900094B2 (en) | 2001-06-14 | 2005-05-31 | Amberwave Systems Corporation | Method of selective removal of SiGe alloys |
WO2002103801A1 (en) * | 2001-06-18 | 2002-12-27 | Massachusetts Institute Of Technology | Structures and methods for a high-speed semiconductor device |
US6916727B2 (en) | 2001-06-21 | 2005-07-12 | Massachusetts Institute Of Technology | Enhancement of P-type metal-oxide-semiconductor field effect transistors |
WO2003015142A2 (en) | 2001-08-06 | 2003-02-20 | Massachusetts Institute Of Technology | Formation of planar strained layers |
US6838728B2 (en) | 2001-08-09 | 2005-01-04 | Amberwave Systems Corporation | Buried-channel devices and substrates for fabrication of semiconductor-based devices |
US6974735B2 (en) | 2001-08-09 | 2005-12-13 | Amberwave Systems Corporation | Dual layer Semiconductor Devices |
US7138649B2 (en) | 2001-08-09 | 2006-11-21 | Amberwave Systems Corporation | Dual-channel CMOS transistors with differentially strained channels |
EP1315199A1 (en) * | 2001-11-22 | 2003-05-28 | ETH Zürich | Formation of high-mobility silicon-germanium structures by low-energy plasma enhanced chemical vapor deposition |
US6649492B2 (en) * | 2002-02-11 | 2003-11-18 | International Business Machines Corporation | Strained Si based layer made by UHV-CVD, and devices therein |
JP2003347229A (en) | 2002-05-31 | 2003-12-05 | Renesas Technology Corp | Method of manufacturing semiconductor device and semiconductor device |
AU2003238963A1 (en) | 2002-06-07 | 2003-12-22 | Amberwave Systems Corporation | Semiconductor devices having strained dual channel layers |
US6841457B2 (en) * | 2002-07-16 | 2005-01-11 | International Business Machines Corporation | Use of hydrogen implantation to improve material properties of silicon-germanium-on-insulator material made by thermal diffusion |
AU2003274922A1 (en) * | 2002-08-23 | 2004-03-11 | Amberwave Systems Corporation | Semiconductor heterostructures having reduced dislocation pile-ups and related methods |
KR20050107510A (en) * | 2003-03-13 | 2005-11-11 | 에이에스엠 아메리카, 인코포레이티드 | Epitaxial semiconductor deposition methods and structrures |
US7682947B2 (en) | 2003-03-13 | 2010-03-23 | Asm America, Inc. | Epitaxial semiconductor deposition methods and structures |
US6855963B1 (en) * | 2003-08-29 | 2005-02-15 | International Business Machines Corporation | Ultra high-speed Si/SiGe modulation-doped field effect transistors on ultra thin SOI/SGOI substrate |
US7303949B2 (en) | 2003-10-20 | 2007-12-04 | International Business Machines Corporation | High performance stress-enhanced MOSFETs using Si:C and SiGe epitaxial source/drain and method of manufacture |
FR2868202B1 (en) * | 2004-03-25 | 2006-05-26 | Commissariat Energie Atomique | PROCESS FOR THE PREPARATION OF A SILICON DIOXIDE LAYER BY HIGH TEMPERATURE OXIDATION ON A SUBSTRATE HAVING AT LEAST ON THE SURFACE OF GERMANIUM OR A SICICIUM-GERMANIUM ALLOY |
US20060011906A1 (en) * | 2004-07-14 | 2006-01-19 | International Business Machines Corporation | Ion implantation for suppression of defects in annealed SiGe layers |
KR101131418B1 (en) | 2004-12-07 | 2012-04-03 | 주성엔지니어링(주) | Semiconductor device and method of manufacturing the same |
US7785995B2 (en) * | 2006-05-09 | 2010-08-31 | Asm America, Inc. | Semiconductor buffer structures |
JP4696037B2 (en) * | 2006-09-01 | 2011-06-08 | ルネサスエレクトロニクス株式会社 | Semiconductor device manufacturing method and semiconductor device |
US7897480B2 (en) | 2007-04-23 | 2011-03-01 | International Business Machines Corporation | Preparation of high quality strained-semiconductor directly-on-insulator substrates |
JP2010219249A (en) * | 2009-03-16 | 2010-09-30 | Fujitsu Ltd | Manufacturing method of semiconductor device and semiconductor device |
KR101087939B1 (en) | 2009-06-17 | 2011-11-28 | 주식회사 하이닉스반도체 | Semiconductor Device and Method for Manufacturing the same |
US8283653B2 (en) * | 2009-12-23 | 2012-10-09 | Intel Corporation | Non-planar germanium quantum well devices |
CN102194859B (en) * | 2010-03-05 | 2013-05-01 | 中国科学院微电子研究所 | High mobility III-V semiconductor MOS interface structure |
CN101859796B (en) * | 2010-05-20 | 2012-11-14 | 清华大学 | MOS pipe structure with in-situ doped source and drain and formation method thereof |
US9608055B2 (en) | 2011-12-23 | 2017-03-28 | Intel Corporation | Semiconductor device having germanium active layer with underlying diffusion barrier layer |
US9127345B2 (en) | 2012-03-06 | 2015-09-08 | Asm America, Inc. | Methods for depositing an epitaxial silicon germanium layer having a germanium to silicon ratio greater than 1:1 using silylgermane and a diluent |
CN103594506B (en) | 2012-08-16 | 2017-03-08 | 中国科学院微电子研究所 | Semiconductor device with a plurality of transistors |
US9171715B2 (en) | 2012-09-05 | 2015-10-27 | Asm Ip Holding B.V. | Atomic layer deposition of GeO2 |
JP6004429B2 (en) * | 2012-09-10 | 2016-10-05 | 国立研究開発法人産業技術総合研究所 | Method for producing single-crystal SiGe layer and solar cell using the same |
US8710490B2 (en) * | 2012-09-27 | 2014-04-29 | Intel Corporation | Semiconductor device having germanium active layer with underlying parasitic leakage barrier layer |
GB2544190B (en) * | 2012-12-17 | 2017-10-18 | Intel Corp | Semicoductor devices with germanium-rich active layers & doped transition layers |
US8748940B1 (en) | 2012-12-17 | 2014-06-10 | Intel Corporation | Semiconductor devices with germanium-rich active layers and doped transition layers |
US9136343B2 (en) * | 2013-01-24 | 2015-09-15 | Intel Corporation | Deep gate-all-around semiconductor device having germanium or group III-V active layer |
US9218963B2 (en) | 2013-12-19 | 2015-12-22 | Asm Ip Holding B.V. | Cyclical deposition of germanium |
JP6378928B2 (en) * | 2014-05-15 | 2018-08-22 | 富士通株式会社 | Ge-based semiconductor device, manufacturing method thereof, and optical interconnect system |
CN104992930A (en) * | 2015-07-07 | 2015-10-21 | 西安电子科技大学 | Strain Ge CMOS integrated device preparation method and CMOS integrated device |
CN105244320A (en) * | 2015-08-28 | 2016-01-13 | 西安电子科技大学 | SOI-based CMOS integrated device with strain Ge channel and inverted trapezoidal grid and preparation method of integrated device |
CN105118809A (en) * | 2015-08-28 | 2015-12-02 | 西安电子科技大学 | Strain Ge groove-type gate CMOS (Complementary Metal Oxide Semiconductor) integrated device manufacturing method and CMOS integrated device thereof |
US10685884B2 (en) | 2017-07-31 | 2020-06-16 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor device including a Fin-FET and method of manufacturing the same |
CN113517348B (en) * | 2021-06-28 | 2023-08-04 | 西安电子科技大学芜湖研究院 | Direct band gap GeSn enhanced nMOS device and preparation method thereof |
Family Cites Families (8)
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DE68926256T2 (en) * | 1988-01-07 | 1996-09-19 | Fujitsu Ltd | Complementary semiconductor device |
US5241197A (en) * | 1989-01-25 | 1993-08-31 | Hitachi, Ltd. | Transistor provided with strained germanium layer |
JPH0316230A (en) * | 1989-06-14 | 1991-01-24 | Hitachi Ltd | Semiconductor device and manufacture thereof |
JPH02196436A (en) * | 1989-01-25 | 1990-08-03 | Hitachi Ltd | Semiconductor device |
JPH03187269A (en) * | 1989-12-18 | 1991-08-15 | Hitachi Ltd | Semiconductor device |
JPH05121450A (en) * | 1991-06-13 | 1993-05-18 | Hitachi Ltd | Semiconductor device and its manufacture |
JPH08162414A (en) * | 1994-12-05 | 1996-06-21 | Fujitsu Ltd | Semiconductor device |
TW415103B (en) * | 1998-03-02 | 2000-12-11 | Ibm | Si/SiGe optoelectronic integrated circuits |
-
2000
- 2000-03-11 KR KR10-2001-7011492A patent/KR100441469B1/en not_active IP Right Cessation
- 2000-03-11 DE DE60038793T patent/DE60038793D1/en not_active Expired - Lifetime
- 2000-03-11 MY MYPI20000966A patent/MY127672A/en unknown
- 2000-03-11 EP EP00914903A patent/EP1169737B1/en not_active Expired - Lifetime
- 2000-03-11 CN CNB008049513A patent/CN1331240C/en not_active Expired - Lifetime
- 2000-03-11 AT AT00914903T patent/ATE394794T1/en not_active IP Right Cessation
- 2000-03-11 WO PCT/US2000/006258 patent/WO2000054338A1/en active IP Right Grant
- 2000-03-11 JP JP2000604467A patent/JP3974329B2/en not_active Expired - Lifetime
- 2000-06-14 TW TW089104661A patent/TW477025B/en not_active IP Right Cessation
-
2006
- 2006-11-17 JP JP2006311849A patent/JP4912123B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP2002539613A (en) | 2002-11-19 |
EP1169737B1 (en) | 2008-05-07 |
KR100441469B1 (en) | 2004-07-23 |
TW477025B (en) | 2002-02-21 |
JP4912123B2 (en) | 2012-04-11 |
JP2007165867A (en) | 2007-06-28 |
DE60038793D1 (en) | 2008-06-19 |
WO2000054338A1 (en) | 2000-09-14 |
CN1331240C (en) | 2007-08-08 |
EP1169737A1 (en) | 2002-01-09 |
JP3974329B2 (en) | 2007-09-12 |
KR20010102557A (en) | 2001-11-15 |
CN1343374A (en) | 2002-04-03 |
ATE394794T1 (en) | 2008-05-15 |
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