MY118368A - Thermosetting encapsulants for electronics packaging - Google Patents

Thermosetting encapsulants for electronics packaging

Info

Publication number
MY118368A
MY118368A MYPI97006004A MYPI9706004A MY118368A MY 118368 A MY118368 A MY 118368A MY PI97006004 A MYPI97006004 A MY PI97006004A MY PI9706004 A MYPI9706004 A MY PI9706004A MY 118368 A MY118368 A MY 118368A
Authority
MY
Malaysia
Prior art keywords
electronics packaging
reworkable
electronic package
thermosetting encapsulants
encapsulants
Prior art date
Application number
MYPI97006004A
Other languages
English (en)
Inventor
Shridhar Ratnaswamy Iyer
Pui Kwan Wong
Original Assignee
Shell Int Research
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shell Int Research filed Critical Shell Int Research
Publication of MY118368A publication Critical patent/MY118368A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L73/00—Compositions of macromolecular compounds obtained by reactions forming a linkage containing oxygen or oxygen and carbon in the main chain, not provided for in groups C08L59/00 - C08L71/00; Compositions of derivatives of such polymers
    • H10W74/47—
    • H10W70/60—
    • H10W74/10—
    • H10W74/473—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P20/00—Technologies relating to chemical industry
    • Y02P20/50—Improvements relating to the production of bulk chemicals
    • Y02P20/582—Recycling of unreacted starting or intermediate materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
  • Die Bonding (AREA)
MYPI97006004A 1996-12-16 1997-12-12 Thermosetting encapsulants for electronics packaging MY118368A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/768,056 US5726391A (en) 1996-12-16 1996-12-16 Thermosetting Encapsulants for electronics packaging

Publications (1)

Publication Number Publication Date
MY118368A true MY118368A (en) 2004-10-30

Family

ID=25081388

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI97006004A MY118368A (en) 1996-12-16 1997-12-12 Thermosetting encapsulants for electronics packaging

Country Status (16)

Country Link
US (1) US5726391A (de)
EP (1) EP0946646B1 (de)
JP (1) JP2001506412A (de)
KR (1) KR20000069492A (de)
CN (1) CN1117818C (de)
AU (1) AU716193B2 (de)
BR (1) BR9713937A (de)
CA (1) CA2274864A1 (de)
DE (1) DE69716640T2 (de)
HU (1) HUP0000817A3 (de)
ID (1) ID21916A (de)
IL (1) IL130210A0 (de)
MY (1) MY118368A (de)
TW (1) TW396175B (de)
WO (1) WO1998027161A1 (de)
ZA (1) ZA9711197B (de)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7645899B1 (en) 1994-09-02 2010-01-12 Henkel Corporation Vinyl compounds
TW345727B (en) * 1996-08-22 1998-11-21 Hitachi Ltd Resin encapsulated semiconductor device and process for producing the same
US5912282A (en) * 1996-12-16 1999-06-15 Shell Oil Company Die attach adhesive compositions
WO1999035187A1 (en) 1998-01-07 1999-07-15 Georgia Tech Research Corporation Reworkable epoxy underfill encapsulants
US6281314B1 (en) 1998-07-02 2001-08-28 National Starch And Chemical Investment Holding Corporation Compositions for use in the fabrication of circuit components and printed wire boards
US6316566B1 (en) 1998-07-02 2001-11-13 National Starch And Chemical Investment Holding Corporation Package encapsulant compositions for use in electronic devices
US6063828A (en) * 1998-07-02 2000-05-16 National Starch And Chemical Investment Holding Corporation Underfill encapsulant compositions for use in electronic devices
SG105450A1 (en) 1998-07-02 2004-08-27 Nat Starch Chem Invest Allylated amide compounds and die attach adhesives prepared therefrom
US6350840B1 (en) 1998-07-02 2002-02-26 National Starch And Chemical Investment Holding Corporation Underfill encapsulants prepared from allylated amide compounds
US6057381A (en) * 1998-07-02 2000-05-02 National Starch And Chemical Investment Holding Corporation Method of making an electronic component using reworkable underfill encapsulants
US6528890B1 (en) 1998-12-01 2003-03-04 Micron Technology, Inc. Circuit, method of adhering an integrated circuit device to a substrate, and method of forming a circuit
US6337384B1 (en) 2000-01-18 2002-01-08 Sandia Corporation Method of making thermally removable epoxies
US6403753B1 (en) 2000-01-18 2002-06-11 Sandia Corporation Method of making thermally removable polyurethanes
US6271335B1 (en) 2000-01-18 2001-08-07 Sandia Corporation Method of making thermally removable polymeric encapsulants
US20050288458A1 (en) * 2002-07-29 2005-12-29 Klemarczyk Philip T Reworkable thermosetting resin composition
CN1232515C (zh) * 2000-03-31 2005-12-21 亨凯尔公司 包含环氧乙烷或硫杂丙环的树脂和固化剂的可再加工的组合物
US7012120B2 (en) * 2000-03-31 2006-03-14 Henkel Corporation Reworkable compositions of oxirane(s) or thirane(s)-containing resin and curing agent
US20040248627A1 (en) * 2001-08-07 2004-12-09 Kuo Chun Fu Method for applying film onto electric part
US6825315B2 (en) * 2001-12-21 2004-11-30 Sandia Corporation Method of making thermally removable adhesives
US6933361B2 (en) 2002-07-12 2005-08-23 The Regents Of The University Of California Thermally re-mendable cross-linked polymers
JP2004307859A (ja) * 2003-04-05 2004-11-04 Rohm & Haas Electronic Materials Llc 電子デバイス製造
JP4170839B2 (ja) * 2003-07-11 2008-10-22 日東電工株式会社 積層シート
RU2555883C2 (ru) 2009-06-11 2015-07-10 ХЕНКЕЛЬ Юэс АйПи ЭлЭлСи Термически обратимая термоплавкая клеевая композиция, содержащая многофункциональные диеновые и диенофильные соединения
CN104250313A (zh) * 2010-05-28 2014-12-31 住友电木株式会社 酯化物的制造方法
PL2613426T3 (pl) * 2010-09-02 2022-01-31 Sumitomo Bakelite Co., Ltd. Kompozycja żywicy mocującej do stosowania w wirniku
US8917510B2 (en) * 2011-01-14 2014-12-23 International Business Machines Corporation Reversibly adhesive thermal interface material
US8511369B2 (en) 2011-04-18 2013-08-20 International Business Machines Corporation Thermally reversible crosslinked polymer modified particles and methods for making the same
CN103374318A (zh) * 2012-04-20 2013-10-30 合肥杰事杰新材料股份有限公司 一种热可逆胶粘剂、制备方法及其应用
US9035172B2 (en) 2012-11-26 2015-05-19 Sunpower Corporation Crack resistant solar cell modules
US9085719B2 (en) 2013-03-18 2015-07-21 International Business Machines Corporation Thermally reversible thermal interface materials with improved moisture resistance
DE102014001997B4 (de) 2014-02-17 2020-01-09 Abb Ag Hilfsschalter mit Test-Taste
US9668354B2 (en) * 2015-07-23 2017-05-30 International Business Machines Corporation Conformal coating materials
EP3181652B1 (de) * 2015-12-18 2019-02-27 The Swatch Group Research and Development Ltd. Verfahren zum zusammenfügen und repositionieren uhrenteilen mit einem repositionierbaren heissschmelzkleber
CN111194342A (zh) * 2017-10-27 2020-05-22 太阳精机株式会社 热可逆性交联型热熔粘接剂
US12319781B2 (en) 2022-02-16 2025-06-03 International Business Machines Corporation Rehealable and reworkable polymer for electronic packaging
US20250115734A1 (en) * 2022-02-21 2025-04-10 Vrije Universiteit Brussel Conductive self-healing composite materials
US20250376465A1 (en) * 2022-06-21 2025-12-11 Mitsubishi Gas Chemical Company, Inc. Compound, composition, cured product, and method for producing compound

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0340492A3 (de) * 1988-05-02 1990-07-04 International Business Machines Corporation Konforme Versieglung und interplanare Verkapselung elektronischer Anordnungsstrukturen
JPH03247620A (ja) * 1990-02-26 1991-11-05 Sumitomo Chem Co Ltd 熱硬化性樹脂組成物およびそれを用いた電子部品
US5288769A (en) * 1991-03-27 1994-02-22 Motorola, Inc. Thermally conducting adhesive containing aluminum nitride
US5371328A (en) * 1993-08-20 1994-12-06 International Business Machines Corporation Component rework
TW338044B (en) * 1994-11-15 1998-08-11 Shell Internattonale Res Mij B V A cross linked resin
MY114204A (en) * 1994-11-15 2002-08-30 Shell Int Research A cross-linked resin

Also Published As

Publication number Publication date
KR20000069492A (ko) 2000-11-25
WO1998027161A1 (en) 1998-06-25
CN1117818C (zh) 2003-08-13
IL130210A0 (en) 2000-06-01
AU716193B2 (en) 2000-02-24
JP2001506412A (ja) 2001-05-15
CA2274864A1 (en) 1998-06-25
EP0946646B1 (de) 2002-10-23
BR9713937A (pt) 2000-03-21
ZA9711197B (en) 1998-06-23
EP0946646A1 (de) 1999-10-06
HUP0000817A3 (en) 2001-05-28
HUP0000817A2 (en) 2000-07-28
CN1240464A (zh) 2000-01-05
US5726391A (en) 1998-03-10
ID21916A (id) 1999-08-12
DE69716640D1 (de) 2002-11-28
TW396175B (en) 2000-07-01
DE69716640T2 (de) 2003-09-11
AU5761398A (en) 1998-07-15

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