MY111332A - Semiconductor wafer-securing adhesive tape. - Google Patents

Semiconductor wafer-securing adhesive tape.

Info

Publication number
MY111332A
MY111332A MYPI92001221A MYPI19921221A MY111332A MY 111332 A MY111332 A MY 111332A MY PI92001221 A MYPI92001221 A MY PI92001221A MY PI19921221 A MYPI19921221 A MY PI19921221A MY 111332 A MY111332 A MY 111332A
Authority
MY
Malaysia
Prior art keywords
layer
semiconductor wafer
adhesive tape
styrene
film
Prior art date
Application number
MYPI92001221A
Other languages
English (en)
Inventor
Hasebe Morikuni
Shiramatsu Eiji
Iwamoto Kazushige
Ishiwata Shinichi
Mougi Kenji
Nakayama Koji
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP9209392A external-priority patent/JP3291017B2/ja
Priority claimed from JP09209492A external-priority patent/JP3326195B2/ja
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of MY111332A publication Critical patent/MY111332A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
    • C08L53/025—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes modified
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
    • C09J2301/162—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer the carrier being a laminate constituted by plastic layers only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Laminated Bodies (AREA)
MYPI92001221A 1991-06-28 1992-06-26 Semiconductor wafer-securing adhesive tape. MY111332A (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP18539791 1991-06-28
JP9209392A JP3291017B2 (ja) 1992-03-18 1992-03-18 半導体ウエハ固定用粘着テープ
JP11392892 1992-03-18
JP09209492A JP3326195B2 (ja) 1991-06-28 1992-03-18 半導体ウエハ固定用粘着テープ

Publications (1)

Publication Number Publication Date
MY111332A true MY111332A (en) 1999-11-30

Family

ID=27467997

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI92001221A MY111332A (en) 1991-06-28 1992-06-26 Semiconductor wafer-securing adhesive tape.

Country Status (5)

Country Link
EP (1) EP0520515B1 (enExample)
KR (1) KR0162103B1 (enExample)
DE (1) DE69206331T2 (enExample)
MY (1) MY111332A (enExample)
TW (1) TW215453B (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9301929D0 (en) * 1993-02-01 1993-03-17 Raychem Ltd Low-temperature-tolerant gels
FR2717489B1 (fr) * 1994-03-16 1999-09-24 Atochem Elf Sa Composition de liant de coextrusion et complexe multicouche coextrudé dans lequel ladite composition est utilisée comme couche adhésive.
FR2717487B1 (fr) * 1994-03-16 1998-06-26 Atochem Elf Sa Composition de liant de coextrusion et complexe multicouche coextrudé dans lequel ladite composition est utilisée comme couche adhésive.
TW311927B (enExample) * 1995-07-11 1997-08-01 Minnesota Mining & Mfg
US5648136A (en) * 1995-07-11 1997-07-15 Minnesota Mining And Manufacturing Co. Component carrier tape
EP0862602B1 (en) * 1995-11-22 1999-09-01 Sumitomo Bakelite Company Limited Cover tape for packaging electronic components
JP4153577B2 (ja) 1997-11-28 2008-09-24 旭化成ケミカルズ株式会社 耐油性に優れた熱可塑性エラストマー
US6235387B1 (en) 1998-03-30 2001-05-22 3M Innovative Properties Company Semiconductor wafer processing tapes
ATE336371T1 (de) * 2001-06-26 2006-09-15 Sumitomo Bakelite Co Abdeckstreifen zum verpacken von elektronischen bauteilen
JP2012094834A (ja) * 2010-09-13 2012-05-17 Sumitomo Bakelite Co Ltd ダイシングフィルム
JP5680128B2 (ja) * 2012-04-13 2015-03-04 東京応化工業株式会社 接着剤組成物、接着フィルム、及び貼付方法
JP5117629B1 (ja) * 2012-06-28 2013-01-16 古河電気工業株式会社 ウェハ加工用粘着テープ
JP6216575B2 (ja) * 2012-10-25 2017-10-18 東京応化工業株式会社 接着剤組成物及び接着フィルム
CN104885202B (zh) * 2013-03-04 2017-07-11 琳得科株式会社 切割片用基材膜及具备该基材膜的切割片

Also Published As

Publication number Publication date
EP0520515A3 (en) 1993-08-25
DE69206331D1 (de) 1996-01-11
KR0162103B1 (ko) 1999-01-15
DE69206331T2 (de) 1996-08-29
TW215453B (enExample) 1993-11-01
EP0520515A2 (en) 1992-12-30
EP0520515B1 (en) 1995-11-29
KR930000642A (ko) 1993-01-15

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