MY110530A - Method for simultaneous preparation of bisphenol f and novolak phenol resin - Google Patents

Method for simultaneous preparation of bisphenol f and novolak phenol resin

Info

Publication number
MY110530A
MY110530A MYPI93001633A MYPI19931633A MY110530A MY 110530 A MY110530 A MY 110530A MY PI93001633 A MYPI93001633 A MY PI93001633A MY PI19931633 A MYPI19931633 A MY PI19931633A MY 110530 A MY110530 A MY 110530A
Authority
MY
Malaysia
Prior art keywords
bisphenol
phenol resin
novolak phenol
give
acid catalyst
Prior art date
Application number
MYPI93001633A
Inventor
Limuro Shigeru
Ito Satoru
Takashima Tomoko
Kitamura Takashi
Original Assignee
Mitsui Toatsu Chemicals Incorporated
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Toatsu Chemicals Incorporated filed Critical Mitsui Toatsu Chemicals Incorporated
Publication of MY110530A publication Critical patent/MY110530A/en

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Phenolic Resins Or Amino Resins (AREA)

Abstract

HEREIN DISCLOSED IS A METHOD FOR SIMULTANEOUSLY PREPARING A HIGHLY PURE BISPHENOL F AND/OR A BISPHENOL F FOR GENERAL USE AND A NOVOLAK PHENOL RESIN AND/OR A HIGH MOLECULAR WEIGHT NOVOLAK PHENOL RESIN COMPRISING THE STEPS OF: (1)A PREPARATION STEP COMPRISING REACTING PHENOL WITH FORMALDEHYDE IN THE PRESENCE OF AN ACID CATALYST AND REMOVING THE ACID CATALYST, WATER AND THE UNREACTED PHENOL FROM THE RESULTING REACTION PRODUCT TO GIVE A CRUDE BISPHENOL F; (2)A DISTILLATION STEP COMPRISING DISTILLING A PART OF THE CRUDE BISPHENOL F TO GIVE A HIGHLY PURE BISPHENOL F, AS A DISTILATE, HAVING A BINUCLEAR MOIETY-CONTENT OF NOT LESS THAN 95% BY WEIGHT AND A NOVOLAK PHENOL RESIN, AS A STILL-BOTTOM PRODUCTS, HAVING A BINUCLEAR MOIETY-CONTENT OF NOT MORE THAN 15% BY AREA;(3)A STEP FOR MIXING THE HIGHLY PURE BISPHENOL F WITH THE REMAINING CRUDE BISPHENOL F TO GIVE A BISPHENOL F FOR GENERAL USE; AND (4)A STEP OF POLYMERIZING THE NOVOLAK PHENOL RESIN WITH FORMALDEHYDE IN THE PRESENCE OF AN ACID CATALYST TO GIVE A HIGH MOLECULAR WEIGHT NOVOLAK PHENOL RESIN. (FIG. 1)
MYPI93001633A 1992-09-18 1993-08-17 Method for simultaneous preparation of bisphenol f and novolak phenol resin MY110530A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24963292A JPH06100665A (en) 1992-09-18 1992-09-18 Epoxy resin composition

Publications (1)

Publication Number Publication Date
MY110530A true MY110530A (en) 1998-07-31

Family

ID=17195918

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI93001633A MY110530A (en) 1992-09-18 1993-08-17 Method for simultaneous preparation of bisphenol f and novolak phenol resin

Country Status (2)

Country Link
JP (1) JPH06100665A (en)
MY (1) MY110530A (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19530630A1 (en) * 1995-08-21 1997-02-27 Hoechst Ag Process for the preparation of methyl-substituted polyalkylidene polyphenols
JP2726251B2 (en) * 1995-12-14 1998-03-11 住友ベークライト株式会社 Die bonding material
JP4491900B2 (en) * 2000-03-28 2010-06-30 パナソニック電工株式会社 Epoxy resin composition and semiconductor device
CN100358932C (en) * 2003-08-21 2008-01-02 旭化成化学株式会社 Photosensitive composition and cured product thereof
WO2005019299A1 (en) * 2003-08-21 2005-03-03 Asahi Kasei Chemicals Corporation Photosensitive composition and cured product thereof
KR101640961B1 (en) * 2009-03-11 2016-07-19 스미토모 베이클리트 컴퍼니 리미티드 Resin composition for encapsulating semiconductor and semiconductor device
JP5316282B2 (en) * 2009-07-22 2013-10-16 住友ベークライト株式会社 Epoxy resin composition for semiconductor encapsulation and semiconductor device
JP6257020B2 (en) * 2012-09-21 2018-01-10 Dic株式会社 Phenylphenol-naphthol resin, curable resin composition, cured product thereof, and printed wiring board
JP6125967B2 (en) * 2013-09-30 2017-05-10 明和化成株式会社 Epoxy resin composition, sealing material, cured product thereof, and phenol resin
JP2015172105A (en) * 2014-03-11 2015-10-01 日本化薬株式会社 Epoxy resin mixture, curable resin composition, cured product thereof, and semiconductor device
JP7307050B2 (en) * 2018-03-09 2023-07-11 日鉄ケミカル＆マテリアル株式会社 Resin composition for fiber-reinforced composite material and fiber-reinforced composite material using the same

Also Published As

Publication number Publication date
JPH06100665A (en) 1994-04-12

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