JP2726251B2 - Die bonding material - Google Patents
Die bonding materialInfo
- Publication number
- JP2726251B2 JP2726251B2 JP7326078A JP32607895A JP2726251B2 JP 2726251 B2 JP2726251 B2 JP 2726251B2 JP 7326078 A JP7326078 A JP 7326078A JP 32607895 A JP32607895 A JP 32607895A JP 2726251 B2 JP2726251 B2 JP 2726251B2
- Authority
- JP
- Japan
- Prior art keywords
- die bonding
- bonding material
- resin
- bisphenol
- reaction product
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Die Bonding (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、低応力性、接着
性、低吸水性及び低ブリード性に優れたダイボンディン
グ材に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a die bonding material excellent in low stress, low adhesiveness, low water absorption and low bleeding.
【０００２】[0002]
【従来の技術】近年半導体チップの大型化、パッケージ
の薄型化に伴い周辺材料である樹脂材料に対する信頼性
の要求は年々厳しいものとなってきている。その中でリ
ードフレームに半導体チップを接着するダイボンディン
グ材の特性がパッケージの信頼性を高める要因として重
要視されてきている。パッケージの信頼性で特に重要な
ものとして、実装時の熱ストレスに対する耐半田クラッ
ク性がある。この特性を向上させるためには半導体封止
材料と同様にダイボンディング材にも低応力性、低吸水
性、高接着性が要求される。しかしながら、これまでこ
れらの特性を全て満足する材料は知られていなかった。
例えば、ダイボンディング材としてはポリアミド樹脂に
無機フィラーを分散させたものがあり、接着性、低応力
性に関しては優れているが、低吸水性の点で劣り、又溶
剤を用いるため硬化物中にボイドが残り易く、硬化に高
温を必要とするといった欠点があった。一方、他の樹脂
としてエポキシ樹脂に無機フィラーを分散させたものが
あるが、接着性に優れているものの、低吸水性の点でや
や劣り、又硬化物が硬く脆いため低応力性に劣るという
問題があった。2. Description of the Related Art In recent years, as semiconductor chips have become larger and packages have become thinner, the requirements for reliability of resin materials as peripheral materials have become stricter year by year. Among them, characteristics of a die bonding material for bonding a semiconductor chip to a lead frame have been regarded as important as a factor for improving the reliability of a package. Particularly important in the reliability of the package is resistance to solder cracks against thermal stress during mounting. In order to improve these characteristics, the die bonding material is required to have low stress, low water absorption, and high adhesiveness as well as the semiconductor sealing material. However, a material satisfying all of these properties has not been known so far.
For example, as a die bonding material, there is a material obtained by dispersing an inorganic filler in a polyamide resin, which is excellent in adhesiveness and low stress, but inferior in low water absorption, and in a cured product because a solvent is used. There are disadvantages that voids are easily left and high temperature is required for curing. On the other hand, there is a resin in which an inorganic filler is dispersed in an epoxy resin as another resin, but although it has excellent adhesiveness, it is slightly inferior in terms of low water absorption, and is also inferior in low stress property because the cured product is hard and brittle. There was a problem.
【０００３】これらを解決するために、本発明者は、特
開平７−２２４４１号公報によりシリコーン変性エポキ
シ樹脂をベースとしたダイボンディング材を提案した。
しかし、この方法で得られるダイボンディング材は以下
の問題があることが判明した。硬化時に樹脂成分がリ
ードフレームの表面状態（化学処理、表面粗度、汚れ
等）によってブリードアウトする。硬化が遅く、十分
な特性を得るには硬化時間がかかる。これらの原因を検
討した結果式（１）で示されるエポキシ樹脂と２官能フ
ェノールの反応が１：１の付加物の生成が主に起こって
おり、高分子量成分が殆どなくその傾向は反応時間や触
媒に依存しないことがゲルパーミュエーションクロマト
グラフィー（ＧＰＣ）法により判明し、未反応物である
式（１）のエポキシ樹脂が残っていることが判明した。
従って、この未反応物がダイボンディング材の硬化時に
特にリードフレームの表面状態によってはブリードアウ
トし易く、かつ上記エポキシ樹脂の低反応性のためダイ
ボンディング材の反応も遅く十分な特性を出すためには
長時間の硬化時間を要していた。In order to solve these problems, the present inventor proposed a die bonding material based on a silicone-modified epoxy resin in Japanese Patent Application Laid-Open No. Hei 7-22441.
However, it has been found that the die bonding material obtained by this method has the following problems. During curing, the resin component bleeds out due to the surface condition of the lead frame (chemical treatment, surface roughness, dirt, etc.). The curing is slow and it takes a long time to obtain sufficient properties. As a result of investigating these causes, the reaction between the epoxy resin represented by the formula (1) and the bifunctional phenol resulted in the formation of an adduct of 1: 1 mainly, and there was almost no high molecular weight component. It was found by gel permeation chromatography (GPC) that it did not depend on the catalyst, and it was found that the unreacted epoxy resin of the formula (1) remained.
Therefore, this unreacted material is liable to bleed out during curing of the die bonding material, particularly depending on the surface state of the lead frame, and the reaction of the die bonding material is slow due to the low reactivity of the epoxy resin, so that sufficient characteristics are obtained. Required a long curing time.
【０００４】[0004]
【発明が解決しようとする課題】本発明は、これらの問
題を解決するため鋭意検討した結果、上記問題点を解決
し、かつ低応力性、接着性及び低吸水性に優れたダイボ
ンディング材を提供するものである。DISCLOSURE OF THE INVENTION The present invention has been studied diligently to solve these problems, and as a result, a die bonding material which solves the above problems and is excellent in low stress, adhesiveness and low water absorption. To provide.
【０００５】[0005]
【課題を解決するための手段】すなわち本発明は、
（Ａ）全エポキシ樹脂中に、下記の式（１）で示される
エポキシ樹脂（ａ）とビスフェノール類（ｂ）とのモル
比［（ａ）のエポキシ基／（ｂ）の水酸基］が１．１〜
１．６の範囲で反応してなる生成物を３０重量％以上含
み、（Ｂ）全硬化剤中に３核体以上のフェノールノボラ
ック樹脂を１０〜８０重量％含み、（Ｃ）無機フィラー
を必須成分とする組成物からなることを特徴とするダイ
ボンディング材である。 That is, the present invention provides:
(A) In all epoxy resins, the molar ratio of epoxy resin (a) represented by the following formula (1) to bisphenols (b) [epoxy group of (a) / hydroxyl group of (b)] is 1. 1 to
(B) 10 to 80% by weight of a phenol novolak resin having three or more nuclei in the total curing agent, and (C) an inorganic filler is essential. A die bonding material comprising a composition as a component.
【０００６】[0006]
【発明の実施の形態】本発明に用いる式（１）のエポキ
シ樹脂は、低弾性率、低吸水性の特徴を有する。式中の
Ｒ1 、Ｒ2 の２価の脂肪族基は、炭素数６以上のものは
工業化されていない。本発明のＲ1 、Ｒ2 としてはプロ
ピレンが好ましい。本発明に用いる式（１）のエポキシ
樹脂とビスフェノール類の反応例としては、式（１）の
エポキシ樹脂（ａ）とビスフェノール類（ｂ）とのモル
比〔（ａ）のエポキシ基／（ｂ）の水酸基〕が１．１〜
１．６でエポキシ樹脂とビスフェノール類を混合し、必
要により溶媒を加え１００℃以上の条件で反応させる。
当量比が１．６を越えると未反応物のためブリードが大
きくなる。１．１未満だと反応物の粘度が高すぎ、ダイ
ボンディング材としての粒度、糸ひき等の作業特性が著
しく悪くなる。DESCRIPTION OF THE PREFERRED EMBODIMENTS The epoxy resin of the formula (1) used in the present invention has characteristics of low elastic modulus and low water absorption. The divalent aliphatic group represented by R 1 and R 2 in the formula has not been industrialized if it has 6 or more carbon atoms. R 1 and R 2 in the present invention are preferably propylene. Examples of the reaction between the epoxy resin of the formula (1) and the bisphenol used in the present invention include a molar ratio of the epoxy resin (a) of the formula (1) to the bisphenol (b) [epoxy group / (b) )) Is from 1.1 to
In 1.6, the epoxy resin and the bisphenol are mixed, and a solvent is added if necessary, and the mixture is reacted at 100 ° C. or higher.
If the equivalent ratio exceeds 1.6, bleed will increase due to unreacted substances. If it is less than 1.1, the viscosity of the reaction product is too high, and the working characteristics such as particle size and stringing as a die bonding material are significantly deteriorated.
【０００７】なお、この反応を促進するために、必要に
より触媒を添加してもよい。触媒の例としてはトリフェ
ニルフォスフィン、トリブチルフォスフィン等の有機フ
ォスフィン類、これらの有機ボレート塩、１，８−ジア
ザビシクロウンデセン等のジアザ化合物等が挙げられ
る。[0007] In order to accelerate this reaction, a catalyst may be added if necessary. Examples of the catalyst include organic phosphines such as triphenylphosphine and tributylphosphine, organic borate salts thereof, and diaza compounds such as 1,8-diazabicycloundecene.
【０００８】本発明に用いるビスフェノール類として
は、ビスフェノールＡ、ビスフェノールＦ、ビスフェノ
ールＳ、テトラメチルビスフェノールＡ、テトラメチル
ビスフェノールＦ、テトラメチルビスフェノールＳ、ジ
ヒドロキシジフェニルエーテル、ジヒドロキシベンゾフ
ェノン、ｏ−ヒドロキシフェノール、ｍ−ヒドロキシフ
ェノール、ｐ−ヒドロキシフェノール、ビフェノール、
テトラメチルビフェノール、エチリデンビスフェノー
ル、メチルエチリデンビス（メチルフェノール）、α−
メチルベンジリデンビスフェノール、シクロヘキシリデ
ンビスフェノール等が挙げられ、これらは単独でも混合
して用いてもよい。The bisphenols used in the present invention include bisphenol A, bisphenol F, bisphenol S, tetramethylbisphenol A, tetramethylbisphenol F, tetramethylbisphenol S, dihydroxydiphenyl ether, dihydroxybenzophenone, o-hydroxyphenol and m-hydroxyphenol. Phenol, p-hydroxyphenol, biphenol,
Tetramethylbiphenol, ethylidenebisphenol, methylethylidenebis (methylphenol), α-
Methyl benzylidene bisphenol, cyclohexylidene bisphenol and the like can be mentioned, and these may be used alone or as a mixture.
【０００９】反応生成物と混合する場合の他のエポキシ
樹脂としては、例えばビスフェノールＡ、ビスフェノー
ルＦ、フェノールノボラック樹脂等とエピクロルヒドリ
ンとの反応で得られるジグリシジルエーテルで常温で液
状のもの、ビニルシクロヘキセンジオキシド、ジシクロ
ペンタジエンオキシド、アリサイクリックジエポキシド
−アジペイトのような脂環式エポキシ等が挙げられる。
この反応生成物の混合量は全エポキシ樹脂量中３０重量
％以上で、より好ましくは５０重量％以上である。３０
重量％未満だと接着後のチップの反りが急激に大きくな
り、低応力性の特徴が生かせなくなる。Other epoxy resins to be mixed with the reaction product include, for example, diglycidyl ether obtained by the reaction of bisphenol A, bisphenol F, phenol novolak resin and the like with epichlorohydrin, and liquid at room temperature, vinylcyclohexenediene. And alicyclic epoxies such as oxides, dicyclopentadiene oxides, and alicyclic diepoxide-adipates.
The amount of the reaction product is at least 30% by weight, more preferably at least 50% by weight, based on the total amount of the epoxy resin. 30
If the amount is less than the weight percentage, the warpage of the chip after bonding becomes sharply large, and the characteristic of low stress cannot be utilized.
【００１０】硬化剤としては３核体以上のフェノールノ
ボラック樹脂を１０〜８０重量％含むことが必須であ
る。８０重量％を越えるとブリード、硬化性は良好だが
作業性が大巾に悪くなる。逆に、１０重量％未満だとブ
リードが出易くなりかつ反応性が遅くなる。また３核体
より小さいとブリード、硬化性に劣る。また残りの硬化
剤としては二ないし三官能のフェノール類、ジシアンシ
アミドイミダゾール等が挙げられる。また全エポキシ当
量に対する硬化剤の全当量比は１〜２の範囲が好まし
い。１未満又は２を越えるとダイボンディング剤として
粘度が著しく高くなるため実用的でない。It is essential that the curing agent contains 10 to 80% by weight of a phenol novolak resin having three or more nuclei. If it exceeds 80% by weight, bleeding and curability are good, but workability is greatly deteriorated. Conversely, if it is less than 10% by weight, bleeding is likely to occur and the reactivity becomes slow. On the other hand, if it is smaller than a trinuclear body, bleeding and curability are poor. The remaining curing agents include di- or tri-functional phenols, dicyansiamidimidazole and the like. The ratio of the total equivalent of the curing agent to the total epoxy equivalent is preferably in the range of 1 to 2. If it is less than 1 or more than 2, the viscosity as a die bonding agent becomes extremely high, which is not practical.
【００１１】本発明で用いる無機フィラーの例として
は、炭酸カルシウム、シリカ、アルミナ等の絶縁フィラ
ー、銀粉、金粉、ニッケル粉、銅粉等の導電性フィラー
が挙げられ、用途によりこれらを複数混合してもよい。
更に、ニードル詰りを防止するため、これらの粒径は５
０μｍ以下のものが好ましい。本発明の樹脂組成物は、
反応生成物、又はこれらを含むエポキシ樹脂混合物と硬
化剤、無機フィラー、必要に応じて反応性希釈剤、硬化
促進剤、顔料、染料、消泡剤等の添加剤を予備混合し、
３本ロールを用いて混練し、ペーストを得て真空脱泡す
ることにより製造することができる。Examples of the inorganic filler used in the present invention include insulating fillers such as calcium carbonate, silica, and alumina, and conductive fillers such as silver powder, gold powder, nickel powder, and copper powder. You may.
Furthermore, to prevent needle clogging, these particle sizes are 5
Those having a thickness of 0 μm or less are preferred. The resin composition of the present invention,
Reaction products, or epoxy resin mixture containing these and curing agent, inorganic filler, if necessary reactive diluent, curing accelerator, pigment, dye, pre-mixed additives such as defoamer,
It can be manufactured by kneading using three rolls, obtaining a paste, and degassing in vacuo.
【００１２】[0012]
《反応生成物の製造例１》下記式（２）のエポキシ樹脂
（エポキシ当量１８１）１００ｇ、ビスフェノールＦ
（水酸基当量１００）５０ｇに触媒として１，８−ジア
ザビシクロ（５，４，０）ウンデセン−７を１ｇ添加
し、１８０℃で２時間反応させた。この生成物を反応生
成物（１）とする。 << Production Example 1 of Reaction Product >> 100 g of an epoxy resin of the following formula (2) (epoxy equivalent: 181), bisphenol F
To 50 g of (hydroxyl equivalent 100), 1 g of 1,8-diazabicyclo (5,4,0) undecene-7 was added as a catalyst and reacted at 180 ° C. for 2 hours. This product is referred to as a reaction product (1).
【００１３】《反応生成物の製造例２》上記式（２）の
エポキシ樹脂１００ｇをビスフェノールＦ（水酸基当量
１００）４０ｇにした以外は製造例１と同様に反応生成
物を得た。その生成物を反応生成物（２）とする。 《反応生成物の製造例３》上記式（２）のエポキシ樹脂
１００ｇ、ビスフェノールＦ（水酸基当量１００）３２
ｇにした以外は製造例１と同様に反応生成物を得た。そ
の生成物を反応生成物（３）とする。 《反応生成物の製造例４》上記式（２）のエポキシ樹脂
１００ｇ、ビスフェノールＦ５５ｇとした以外は製造例
１と同様に反応生成物を得た。その生成物を反応生成物
（４）とする。<< Production Example 2 of Reaction Product >> A reaction product was obtained in the same manner as in Production Example 1 except that 100 g of the epoxy resin of the above formula (2) was changed to 40 g of bisphenol F (hydroxyl equivalent: 100). The product is referred to as reaction product (2). << Production Example 3 of Reaction Product >> 100 g of epoxy resin of the above formula (2), bisphenol F (hydroxyl equivalent 100) 32
A reaction product was obtained in the same manner as in Production Example 1 except that the amount was changed to g. The product is referred to as reaction product (3). << Production Example 4 of Reaction Product >> A reaction product was obtained in the same manner as in Production Example 1 except that 100 g of the epoxy resin of the above formula (2) and 55 g of bisphenol F were used. The product is referred to as reaction product (4).
【００１４】本発明を実施例で具体的に説明する。 実施例１〜６、比較例１〜７ 表１及び表２の処方に従って三本ロールを用いて混練し
ダイボンディング材を調製した。次にこれらのダイボン
ディング材を評価するために以下の実験を行った。これ
らのダイボンディング材を用い銀めっき付銅フレームに
２×２ｍｍ角のシリコンチップを１７５℃、３０分で硬
化接着させ（比較例７のみ１７５℃９０分）、２５０℃
における熱時接着力をプッシュプルゲージで測定した。
同様に１５×６×０．３ｍｍ（厚さ）のシリコンチップ
を厚さ５０μｍの銀めっき付銅リードフレームに１７５
℃、３０分で硬化接着させ、低応力性の尺度としてチッ
プの長手方向を表面粗さ計を用いて上下方向の変位（反
り）の最大値を求めた。 又、ダイボンディング材硬化
物の弾性率、及び８５℃、８５％ＲＨ下での飽和吸水率
を測定した。又、ブリード性を調べるために銀めっき付
銅リードフレームにペーストを約半径１ｍｍに塗布し常
温で３時間放置後オーブンで硬化させ発生するブリード
の最大長さを調べた。作業性に関しては内径０．４ｍｍ
のシングルニードルを用い２５０点のディスペンスを行
い、ドットの形状（糸ひきの有無）の数を調べた。比較
例３は粘度が高く評価ができなかった。The present invention will be specifically described with reference to examples. Examples 1 to 6 and Comparative Examples 1 to 7 According to the prescriptions in Tables 1 and 2, kneading was performed using three rolls to prepare a die bonding material. Next, the following experiments were performed to evaluate these die bonding materials. Using these die bonding materials, a 2 × 2 mm square silicon chip is cured and adhered to a silver-plated copper frame at 175 ° C. for 30 minutes (175 ° C. for 90 minutes only in Comparative Example 7), and 250 ° C.
Was measured with a push-pull gauge.
Similarly, a silicon chip of 15 × 6 × 0.3 mm (thickness) is placed on a 50 μm-thick silver-plated copper lead frame by 175 mm.
The adhesive was cured at 30 ° C. for 30 minutes, and the maximum value of the displacement (warpage) in the vertical direction was determined using a surface roughness meter in the longitudinal direction of the chip as a measure of low stress. Further, the elastic modulus of the cured die bonding material and the saturated water absorption at 85 ° C. and 85% RH were measured. Further, in order to examine the bleeding property, the paste was applied to a silver-plated copper lead frame to a radius of about 1 mm, left at room temperature for 3 hours, cured in an oven, and the maximum length of bleed generated was examined. 0.4 mm inside diameter for workability
Was dispensed at 250 points using the single needle, and the number of dot shapes (with or without stringing) was examined. Comparative Example 3 had a high viscosity and could not be evaluated.
【００１５】使用した原材料は下記のとおり。 ・ビスフェノールＦエポキシ樹脂：エポキシ当量１７０ ・tert−ブチルフェニルグリシジルエーテル（ＴＧ
Ｅ）：反応希釈剤 ・フェノールノボラック樹脂（１）：硬化剤、水酸基当
量１０５、６.３核体 ・フェノールノボラック樹脂（２）：硬化剤、水酸基当
量１０５、２.３核体 ・ジシアンジアミド：硬化剤、活性水素当量２１ ・２−フェニル−４−メチルイミダゾール（２Ｐ４Ｍ
Ｉ）：硬化促進剤 ・銀粉：平均粒径５μｍ、フレーク状 ・シリカ粉：平均粒径３μｍ、球状The raw materials used are as follows.・ Bisphenol F epoxy resin: Epoxy equivalent 170 ・ tert-butylphenyl glycidyl ether (TG
E): Reaction diluent ・ Phenol novolak resin (1): curing agent, hydroxyl equivalent 105, 6.3 nucleus ・ Phenol novolak resin (2): curing agent, hydroxyl equivalent 105, 2.3 nucleus ・ Dicyandiamide: curing Agent, active hydrogen equivalent 21 · 2-phenyl-4-methylimidazole (2P4M
I): Hardening accelerator ・ Silver powder: average particle size 5 μm, flake shape ・ Silica powder: average particle size 3 μm, spherical
【００１６】 表 １ 実 施 例 １ ２ ３ ４ ５ ６ 配合（重量部） 反応生成物（１） 40 40 20 40 反応生成物（２） 40 40 ヒ゛スフェノ-ルＦエホ゜キシ樹脂 30 30 30 30 50 30 ＴＧＥ 30 30 30 30 30 30 フェノ-ルノホ゛ラック樹脂（１） 2 4 6 6 6 6 フェノ-ルノホ゛ラック樹脂（２） 8 6 4 4 4 4 ジシアンジアミド 1 1 1 1 1 1 ２Ｐ４ＭＩ 0.2 0.2 0.2 0.2 0.2 0.2 銀粉 333 333 333 333 シリカ粉 111 111 特性 熱時接着力（gf／chip） 1200 1450 1400 1500 1600 1500 反り（μｍ） 50 55 60 50 70 60 弾性率（kgf／mm2） 350 420 250 200 480 350 吸水率（重量％） 0.12 0.11 0.10 0.10 0.15 0.13 ブリード性（μｍ） 100 20 0 0 0 0 作業性 0 0 0 0 0 0 Table 1 Example 1 2 3 4 5 6 Mixing (parts by weight) Reaction product (1) 40 40 20 40 Reaction product (2) 40 40 Basephenol F ethoxy resin 30 30 30 30 50 30 TGE 30 30 30 30 30 30 Phenol-no-Polac resin (1) 2 4 6 6 6 6 Phenol-no-Polac resin (2) 8 6 4 4 4 4 Dicyandiamide 1 1 1 1 1 1 2P4MI 0.2 0.2 0.2 0.2 0.2 0.2 Silver powder 333 333 333 333 333 Silica powder 111 111 Characteristics Adhesive strength at heat (gf / chip) 1200 1450 1400 1500 1600 1500 Warpage (μm) 50 55 60 50 70 60 Elasticity (kgf / mm 2 ) 350 420 250 200 480 350 Water absorption (% by weight) 0.12 0.11 0.10 0.10 0.15 0.13 Bleedability (μm) 100 20 0 0 0 0 Workability 0 0 0 0 0 0
【００１７】 表 ２ 比 較 例 １ ２ ３ ４ ５ ６ ７ 配合（重量部） 反応生成物（１） 40 15 40 40 40 反応生成物（３） 40 反応生成物（４） 40 ヒ゛スフェノ-ルＦエホ゜キシ樹脂 30 30 30 50 30 30 30 ＴＧＥ 30 30 30 35 30 30 30 フェノ-ルノホ゛ラック樹脂（１） 1 6 2 2 10 フェノ-ルノホ゛ラック樹脂（２） 9 4 8 8 10 10 ジシアンジアミド 1 1 1 1 1 1 1 ２Ｐ４ＭＩ 0.2 0.2 0.2 0.2 0.2 0.2 0.2 銀粉 333 333 333 333 333 333 333 特性 熱時接着力（gf／chip） 620 1350 ∧ 1300 1400 460 1200 反り（μｍ） 40 45 評 95 90 20 50 弾性率（kgf／mm2） 280 250 価 550 650 150 330 吸水率（重量％） 0.15 0.12 不 0.21 0.16 0.18 0.12 ブリード性（μｍ） 350 250 可 300 0 600 600 作業性 0 0 ∨ 0 53 0 ー Table 2 Comparative Example 1 2 3 4 5 6 7 Blended (parts by weight) Reaction product (1) 40 15 40 40 40 Reaction product (3) 40 Reaction product (4) 40 Hyphenphenol F ethoxy resin 30 30 30 50 30 30 30 TGE 30 30 30 35 30 30 30 Phenolnophorac resin (1) 1 6 2 2 10 Phenolnophorac resin (2) 9 4 8 8 10 10 Dicyandiamide 1 1 1 1 1 1 1 2P4MI 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 Silver powder 333 333 333 333 333 333 333 333 Properties Adhesive strength at heat (gf / chip) 620 1350 ∧ 1300 1400 460 1200 Warpage (μm) 40 45 Rating 95 90 20 50 Modulus of elasticity (kgf / mm 2 ) 280 250 Value 550 650 150 330 Water absorption (% by weight) 0.15 0.12 Non 0.21 0.16 0.18 0.12 Bleedability (μm) 350 250 Possible 300 0 600 600 Workability 0 0 ∨ 0 53 0 ー
【００１８】[0018]
【発明の効果】本発明によると低応力性、低吸水性をそ
こなわずにかつ硬化時のブリードが抑えられ更には硬化
時間の短縮が可能であり、工業的に有用なダイボンディ
ング材である。Industrial Applicability According to the present invention, it is an industrially useful die bonding material which does not impair low stress and low water absorption, suppresses bleeding during curing, and can further shorten the curing time. .
Claims (1)
（１）で示されるエポキシ樹脂（ａ）とビスフェノール
類（ｂ）とのモル比［（ａ）のエポキシ基／（ｂ）の水
酸基］が１．１から１．６の範囲で反応してなる生成物
を３０重量％以上含み、（Ｂ）全硬化剤中に３核体以上
のフェノールノボラック樹脂を１０〜８０重量％含み、
（Ｃ）無機フィラーを必須成分とする組成物からなるこ
とを特徴とするダイボンディング材。 (A) In all epoxy resins, a molar ratio of an epoxy resin (a) represented by the following formula (1) to a bisphenol (b) [epoxy group of (a) / (b) (Hydroxyl group) reacts in the range of 1.1 to 1.6 in an amount of 30% by weight or more, (B) 10 to 80% by weight of a phenol novolak resin having three or more nuclei in the total curing agent,
(C) A die bonding material comprising a composition containing an inorganic filler as an essential component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7326078A JP2726251B2 (en) | 1995-12-14 | 1995-12-14 | Die bonding material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7326078A JP2726251B2 (en) | 1995-12-14 | 1995-12-14 | Die bonding material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09165566A JPH09165566A (en) | 1997-06-24 |
| JP2726251B2 true JP2726251B2 (en) | 1998-03-11 |
Family
ID=18183872
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7326078A Expired - Fee Related JP2726251B2 (en) | 1995-12-14 | 1995-12-14 | Die bonding material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2726251B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3343210B2 (en) * | 1997-12-26 | 2002-11-11 | 株式会社ジャパンエナジー | Epoxy bleed-out inhibitor and prevention method |
| JP6371148B2 (en) * | 2014-07-16 | 2018-08-08 | ナミックス株式会社 | Adhesive for camera modules |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52144099A (en) * | 1976-05-26 | 1977-12-01 | Hitachi Ltd | Epoxy resin compositions |
| JPH05217702A (en) * | 1992-01-31 | 1993-08-27 | Hitachi Chem Co Ltd | Epoxy resin molding material for sealing electronic part |
| JPH06100665A (en) * | 1992-09-18 | 1994-04-12 | Mitsui Toatsu Chem Inc | Epoxy resin composition |
| JP2695598B2 (en) * | 1993-06-30 | 1997-12-24 | 住友ベークライト株式会社 | Die bonding material |
| JP3035135B2 (en) * | 1993-10-25 | 2000-04-17 | 住友ベークライト株式会社 | Die bonding material |
-
1995
- 1995-12-14 JP JP7326078A patent/JP2726251B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH09165566A (en) | 1997-06-24 |
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