MX9703825A - Ensamble de diodo compresivo termicamente sensible. - Google Patents

Ensamble de diodo compresivo termicamente sensible.

Info

Publication number
MX9703825A
MX9703825A MX9703825A MX9703825A MX9703825A MX 9703825 A MX9703825 A MX 9703825A MX 9703825 A MX9703825 A MX 9703825A MX 9703825 A MX9703825 A MX 9703825A MX 9703825 A MX9703825 A MX 9703825A
Authority
MX
Mexico
Prior art keywords
compressive
diode assembly
thermally responsive
diode
contacts
Prior art date
Application number
MX9703825A
Other languages
English (en)
Inventor
Roy Burton Steele
Original Assignee
Gen Motors Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gen Motors Corp filed Critical Gen Motors Corp
Publication of MX9703825A publication Critical patent/MX9703825A/es

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/925—Bridge rectifier module

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Rectifiers (AREA)
  • Thermistors And Varistors (AREA)
  • Synchronous Machinery (AREA)

Abstract

Un rectificador de alimentacion tiene un diodo en bruto emparedado entre un par de contactos que aplican cargas compresivas progresivas en el diodo en bruto, conforme la temperatura del ensamble de diodo aumenta. Preferentemente, los contactos se forman con metales disímiles que tienen características de expansion térmica distintas y se acoplan operativamente de tal manera que el diferencial de expansion térmica se traduce en la característica de carga compresiva deseada.
MX9703825A 1996-06-06 1997-05-23 Ensamble de diodo compresivo termicamente sensible. MX9703825A (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/656,956 US5773885A (en) 1996-06-06 1996-06-06 Thermally responsive compressive diode assembly

Publications (1)

Publication Number Publication Date
MX9703825A true MX9703825A (es) 1997-12-31

Family

ID=24635286

Family Applications (1)

Application Number Title Priority Date Filing Date
MX9703825A MX9703825A (es) 1996-06-06 1997-05-23 Ensamble de diodo compresivo termicamente sensible.

Country Status (4)

Country Link
US (1) US5773885A (es)
EP (1) EP0812014A3 (es)
JP (1) JP2802268B2 (es)
MX (1) MX9703825A (es)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19856332A1 (de) * 1998-12-07 2000-06-15 Bosch Gmbh Robert Gehäuse für eletronisches Bauelement
US6642078B2 (en) * 2000-08-28 2003-11-04 Transpo Electronics, Inc. Method for manufacturing diode subassemblies used in rectifier assemblies of engine driven generators
JP2006269848A (ja) * 2005-03-25 2006-10-05 Hitachi Ltd 半導体装置
JP4875902B2 (ja) * 2006-02-08 2012-02-15 株式会社日立製作所 半導体装置
JP2015142018A (ja) * 2014-01-29 2015-08-03 三菱電機株式会社 電力用半導体装置
CN113271038B (zh) * 2021-04-16 2022-06-17 东南大学 桥式热整流器

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58161A (ja) * 1981-06-25 1983-01-05 Fujitsu Ltd 半導体装置
JPS58128758A (ja) * 1982-01-27 1983-08-01 Hitachi Ltd 半導体装置とその製造法
JP2858166B2 (ja) * 1990-10-08 1999-02-17 株式会社日立製作所 半導体整流素子及びそれを使った全波整流装置
JPH0851169A (ja) * 1994-08-08 1996-02-20 Fuji Electric Co Ltd 半導体装置

Also Published As

Publication number Publication date
EP0812014A2 (en) 1997-12-10
US5773885A (en) 1998-06-30
EP0812014A3 (en) 1999-09-22
JP2802268B2 (ja) 1998-09-24
JPH1074875A (ja) 1998-03-17

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