MX9703825A - Ensamble de diodo compresivo termicamente sensible. - Google Patents
Ensamble de diodo compresivo termicamente sensible.Info
- Publication number
- MX9703825A MX9703825A MX9703825A MX9703825A MX9703825A MX 9703825 A MX9703825 A MX 9703825A MX 9703825 A MX9703825 A MX 9703825A MX 9703825 A MX9703825 A MX 9703825A MX 9703825 A MX9703825 A MX 9703825A
- Authority
- MX
- Mexico
- Prior art keywords
- compressive
- diode assembly
- thermally responsive
- diode
- contacts
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
- Y10S257/925—Bridge rectifier module
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Rectifiers (AREA)
- Thermistors And Varistors (AREA)
- Synchronous Machinery (AREA)
Abstract
Un rectificador de alimentacion tiene un diodo en bruto emparedado entre un par de contactos que aplican cargas compresivas progresivas en el diodo en bruto, conforme la temperatura del ensamble de diodo aumenta. Preferentemente, los contactos se forman con metales disímiles que tienen características de expansion térmica distintas y se acoplan operativamente de tal manera que el diferencial de expansion térmica se traduce en la característica de carga compresiva deseada.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/656,956 US5773885A (en) | 1996-06-06 | 1996-06-06 | Thermally responsive compressive diode assembly |
Publications (1)
Publication Number | Publication Date |
---|---|
MX9703825A true MX9703825A (es) | 1997-12-31 |
Family
ID=24635286
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX9703825A MX9703825A (es) | 1996-06-06 | 1997-05-23 | Ensamble de diodo compresivo termicamente sensible. |
Country Status (4)
Country | Link |
---|---|
US (1) | US5773885A (es) |
EP (1) | EP0812014A3 (es) |
JP (1) | JP2802268B2 (es) |
MX (1) | MX9703825A (es) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19856332A1 (de) * | 1998-12-07 | 2000-06-15 | Bosch Gmbh Robert | Gehäuse für eletronisches Bauelement |
US6642078B2 (en) * | 2000-08-28 | 2003-11-04 | Transpo Electronics, Inc. | Method for manufacturing diode subassemblies used in rectifier assemblies of engine driven generators |
JP2006269848A (ja) * | 2005-03-25 | 2006-10-05 | Hitachi Ltd | 半導体装置 |
JP4875902B2 (ja) * | 2006-02-08 | 2012-02-15 | 株式会社日立製作所 | 半導体装置 |
JP2015142018A (ja) * | 2014-01-29 | 2015-08-03 | 三菱電機株式会社 | 電力用半導体装置 |
CN113271038B (zh) * | 2021-04-16 | 2022-06-17 | 东南大学 | 桥式热整流器 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58161A (ja) * | 1981-06-25 | 1983-01-05 | Fujitsu Ltd | 半導体装置 |
JPS58128758A (ja) * | 1982-01-27 | 1983-08-01 | Hitachi Ltd | 半導体装置とその製造法 |
JP2858166B2 (ja) * | 1990-10-08 | 1999-02-17 | 株式会社日立製作所 | 半導体整流素子及びそれを使った全波整流装置 |
JPH0851169A (ja) * | 1994-08-08 | 1996-02-20 | Fuji Electric Co Ltd | 半導体装置 |
-
1996
- 1996-06-06 US US08/656,956 patent/US5773885A/en not_active Expired - Lifetime
-
1997
- 1997-05-09 EP EP97201410A patent/EP0812014A3/en not_active Withdrawn
- 1997-05-23 MX MX9703825A patent/MX9703825A/es unknown
- 1997-06-06 JP JP9149478A patent/JP2802268B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US5773885A (en) | 1998-06-30 |
JPH1074875A (ja) | 1998-03-17 |
EP0812014A3 (en) | 1999-09-22 |
EP0812014A2 (en) | 1997-12-10 |
JP2802268B2 (ja) | 1998-09-24 |
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