MX9102602A - Resistores de via dentro de substratos o estructuras tridimensionales, multicapa. - Google Patents
Resistores de via dentro de substratos o estructuras tridimensionales, multicapa.Info
- Publication number
- MX9102602A MX9102602A MX9102602A MX9102602A MX9102602A MX 9102602 A MX9102602 A MX 9102602A MX 9102602 A MX9102602 A MX 9102602A MX 9102602 A MX9102602 A MX 9102602A MX 9102602 A MX9102602 A MX 9102602A
- Authority
- MX
- Mexico
- Prior art keywords
- multilayer
- structures
- via resistors
- dimensional substrates
- substrates
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/647—Resistive arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/08—Cooling, heating or ventilating arrangements
- H01C1/084—Cooling, heating or ventilating arrangements using self-cooling, e.g. fins, heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5384—Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/628,813 US5164699A (en) | 1990-12-17 | 1990-12-17 | Via resistors within-multi-layer, 3 dimensional structures substrates |
Publications (1)
Publication Number | Publication Date |
---|---|
MX9102602A true MX9102602A (es) | 1992-06-01 |
Family
ID=24520412
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX9102602A MX9102602A (es) | 1990-12-17 | 1991-12-17 | Resistores de via dentro de substratos o estructuras tridimensionales, multicapa. |
Country Status (6)
Country | Link |
---|---|
US (1) | US5164699A (es) |
EP (1) | EP0491543A3 (es) |
JP (1) | JP2552046B2 (es) |
KR (1) | KR960000908B1 (es) |
CA (1) | CA2056737C (es) |
MX (1) | MX9102602A (es) |
Families Citing this family (43)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5539186A (en) * | 1992-12-09 | 1996-07-23 | International Business Machines Corporation | Temperature controlled multi-layer module |
US5468936A (en) * | 1993-03-23 | 1995-11-21 | Philip Morris Incorporated | Heater having a multiple-layer ceramic substrate and method of fabrication |
WO1994027336A1 (en) * | 1993-05-07 | 1994-11-24 | Brasscorp Limited | Temperature responsive battery tester |
EP0658937A1 (en) * | 1993-12-08 | 1995-06-21 | Hughes Aircraft Company | Vertical IC chip stack with discrete chip carriers formed from dielectric tape |
JPH08228064A (ja) * | 1994-12-22 | 1996-09-03 | Kanto Kasei Kogyo Kk | プリント回路基板 |
US5587696A (en) * | 1995-06-28 | 1996-12-24 | Taiwan Semiconductor Manufacturing Company Ltd. | High resistance polysilicon resistor for integrated circuits and method of fabrication thereof |
JP3304754B2 (ja) | 1996-04-11 | 2002-07-22 | 三菱電機株式会社 | 集積回路の多段埋め込み配線構造 |
US5856775A (en) * | 1996-06-18 | 1999-01-05 | Pico Systems, Inc. | Programmable thin film filament resistor and method of constructing same |
US6100787A (en) * | 1997-05-28 | 2000-08-08 | Motorola, Inc. | Multilayer ceramic package with low-variance embedded resistors |
US6333255B1 (en) * | 1997-08-21 | 2001-12-25 | Matsushita Electronics Corporation | Method for making semiconductor device containing low carbon film for interconnect structures |
US5994997A (en) * | 1997-11-24 | 1999-11-30 | Motorola, Inc. | Thick-film resistor having concentric terminals and method therefor |
US6047463A (en) | 1998-06-12 | 2000-04-11 | Intermedics Inc. | Embedded trimmable resistors |
JP2001257471A (ja) | 2000-03-10 | 2001-09-21 | Ngk Insulators Ltd | 多層配線基板及びその製造方法 |
JP3531808B2 (ja) * | 2000-10-31 | 2004-05-31 | シャープ株式会社 | 保護回路および半導体装置 |
IL141118A0 (en) | 2001-01-25 | 2002-02-10 | Cerel Ceramics Technologies Lt | A method for the implementation of electronic components in via-holes of a multi-layer multi-chip module |
US6621012B2 (en) * | 2001-02-01 | 2003-09-16 | International Business Machines Corporation | Insertion of electrical component within a via of a printed circuit board |
US7049929B1 (en) * | 2001-05-01 | 2006-05-23 | Tessera, Inc. | Resistor process |
US6757152B2 (en) * | 2001-09-05 | 2004-06-29 | Avx Corporation | Cascade capacitor |
US6737749B2 (en) * | 2001-12-20 | 2004-05-18 | Sun Microsystems, Inc. | Resistive vias for controlling impedance and terminating I/O signals at the package level |
US6720859B2 (en) * | 2002-01-10 | 2004-04-13 | Lamina Ceramics, Inc. | Temperature compensating device with embedded columnar thermistors |
US20040163234A1 (en) * | 2003-02-24 | 2004-08-26 | Terry Provo | Resistive vias in a substrate |
US20050062587A1 (en) * | 2003-09-24 | 2005-03-24 | Wei-Chun Yang | Method and structure of a substrate with built-in via hole resistors |
US6969903B2 (en) * | 2004-01-19 | 2005-11-29 | International Business Machines Corporation | High tolerance TCR balanced high current resistor for RF CMOS and RF SiGe BiCMOS applications and cadenced based hierarchical parameterized cell design kit with tunable TCR and ESD resistor ballasting feature |
US6981239B2 (en) * | 2004-04-29 | 2005-12-27 | Dell Products L.P. | Method, system and apparatus for constructing resistive vias |
TWI246379B (en) * | 2004-05-12 | 2005-12-21 | Advanced Semiconductor Eng | Method for forming printed circuit board |
US20050266651A1 (en) * | 2004-05-28 | 2005-12-01 | Texas Instruments Incorporated | Integrated via resistor |
TWI323622B (en) * | 2004-09-30 | 2010-04-11 | Watlow Electric Mfg | Modular layered heater system |
US20060213686A1 (en) * | 2004-12-28 | 2006-09-28 | Shin-Hsien Wu | Cut Via Structure For And Manufacturing Method Of Connecting Separate Conductors |
US7310036B2 (en) | 2005-01-10 | 2007-12-18 | International Business Machines Corporation | Heat sink for integrated circuit devices |
JP4907274B2 (ja) * | 2005-09-01 | 2012-03-28 | 日本特殊陶業株式会社 | 配線基板、キャパシタ |
US7982475B2 (en) * | 2006-02-24 | 2011-07-19 | International Business Machines Corporation | Structure and method for reliability evaluation of FCPBGA substrates for high power semiconductor packaging applications |
US20080040920A1 (en) * | 2006-08-18 | 2008-02-21 | Honeywell International, Inc. | Printed wiring board having multiple instersitial resistors of different electrical resistance values and method of making the same |
US7680328B2 (en) | 2006-11-01 | 2010-03-16 | Mtekvision Co., Ltd. | Histogram generating device |
US7570493B2 (en) * | 2006-11-16 | 2009-08-04 | Sony Ericsson Mobile Communications | Printed circuit board with embedded circuit component |
DE102007026880A1 (de) * | 2007-06-08 | 2008-11-20 | Siemens Ag | Leiterplatte und Verfahren zur Herstellung einer Leiterplatte |
KR101141401B1 (ko) * | 2010-05-06 | 2012-05-03 | 삼성전기주식회사 | 병렬 구조의 저항기와 그 제조 방법 |
US9059168B2 (en) * | 2012-02-02 | 2015-06-16 | Taiwan Semiconductor Manufacturing Company, Ltd. | Adjustable meander line resistor |
US8890222B2 (en) | 2012-02-03 | 2014-11-18 | Taiwan Semiconductor Manufacturing Company, Ltd. | Meander line resistor structure |
US9633768B2 (en) | 2013-06-13 | 2017-04-25 | Rohm Co., Ltd. | Chip resistor and mounting structure thereof |
US20180164001A1 (en) * | 2016-12-12 | 2018-06-14 | Palo Alto Research Center Incorporated | Electrocaloric system |
CN106686887A (zh) * | 2017-02-14 | 2017-05-17 | 江苏普诺威电子股份有限公司 | 内埋电阻线路板制作方法 |
US11514300B2 (en) * | 2019-06-14 | 2022-11-29 | Macronix International Co., Ltd. | Resistor circuit, artificial intelligence chip and method for manufacturing the same |
FR3108228B1 (fr) * | 2020-03-12 | 2023-07-28 | St Microelectronics Grenoble 2 | Dispositif électronique comprenant des dipôles du type composant monté en surface, et procédé d’assemblage correspondant. |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4956167A (es) * | 1972-09-29 | 1974-05-31 | ||
JPS51147763A (en) * | 1975-06-14 | 1976-12-18 | Fujitsu Ltd | Method of making resistors and capacitors |
US4300115A (en) * | 1980-06-02 | 1981-11-10 | The United States Of America As Represented By The Secretary Of The Army | Multilayer via resistors |
JPS59145065U (ja) * | 1983-03-17 | 1984-09-28 | 株式会社東芝 | 両面印刷配線板の抵抗器 |
JPH0632378B2 (ja) * | 1985-06-14 | 1994-04-27 | 株式会社村田製作所 | 電子部品内蔵多層セラミック基板 |
JPS63107128A (ja) * | 1986-10-24 | 1988-05-12 | Nec Corp | チツプキヤリア |
JPS63229735A (ja) * | 1987-03-18 | 1988-09-26 | Nec Corp | 半導体装置 |
JP2712295B2 (ja) * | 1988-05-26 | 1998-02-10 | 株式会社デンソー | 混成集積回路 |
JPH0210797A (ja) * | 1988-06-29 | 1990-01-16 | Oki Electric Ind Co Ltd | 多層印刷配線板 |
JPH02148889A (ja) * | 1988-11-30 | 1990-06-07 | Toshiba Corp | セラミックス多層基板 |
JPH02219298A (ja) * | 1989-02-20 | 1990-08-31 | Fujitsu General Ltd | 多層回路基板における放熱装置 |
JPH02239697A (ja) * | 1989-03-13 | 1990-09-21 | Nippon Cement Co Ltd | 回路基板の製造方法 |
JPH02229403A (ja) * | 1989-09-25 | 1990-09-12 | Nec Corp | 抵抗アレーの製造方法 |
-
1990
- 1990-12-17 US US07/628,813 patent/US5164699A/en not_active Expired - Fee Related
-
1991
- 1991-11-29 CA CA002056737A patent/CA2056737C/en not_active Expired - Fee Related
- 1991-12-16 KR KR1019910023099A patent/KR960000908B1/ko active IP Right Grant
- 1991-12-16 EP EP19910311674 patent/EP0491543A3/en not_active Withdrawn
- 1991-12-16 JP JP3351795A patent/JP2552046B2/ja not_active Expired - Fee Related
- 1991-12-17 MX MX9102602A patent/MX9102602A/es unknown
Also Published As
Publication number | Publication date |
---|---|
CA2056737A1 (en) | 1992-06-18 |
EP0491543A2 (en) | 1992-06-24 |
US5164699A (en) | 1992-11-17 |
JP2552046B2 (ja) | 1996-11-06 |
KR920013489A (ko) | 1992-07-29 |
JPH04313297A (ja) | 1992-11-05 |
EP0491543A3 (en) | 1992-10-28 |
CA2056737C (en) | 1996-11-05 |
KR960000908B1 (ko) | 1996-01-15 |
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