MX392979B - Sistema y método para el monitoreo de circuito eléctrico. - Google Patents

Sistema y método para el monitoreo de circuito eléctrico.

Info

Publication number
MX392979B
MX392979B MX2018014786A MX2018014786A MX392979B MX 392979 B MX392979 B MX 392979B MX 2018014786 A MX2018014786 A MX 2018014786A MX 2018014786 A MX2018014786 A MX 2018014786A MX 392979 B MX392979 B MX 392979B
Authority
MX
Mexico
Prior art keywords
electrical circuit
circuit monitoring
monitor
sensor
printed circuit
Prior art date
Application number
MX2018014786A
Other languages
English (en)
Other versions
MX2018014786A (es
Inventor
David T Lober
Jason Edward Tynes
Mark Taylor McMeen
Michael L Bixenman
Original Assignee
Kyzen Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyzen Corp filed Critical Kyzen Corp
Publication of MX2018014786A publication Critical patent/MX2018014786A/es
Publication of MX392979B publication Critical patent/MX392979B/es

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2817—Environmental-, stress-, or burn-in tests
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D21/00—Measuring or testing not otherwise provided for
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/04—Casings
    • G01J5/046—Materials; Selection of thermal materials
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G01J5/20—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/16—Special arrangements for conducting heat from the object to the sensitive element
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
    • G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
    • G01L1/2206—Special supports with preselected places to mount the resistance strain gauges; Mounting of supports
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/147—Details about the mounting of the sensor to support or covering means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/148—Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
    • G01N27/12—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluid; of a solid body in dependence upon reaction with a fluid, for detecting components in the fluid
    • G01N27/128—Microapparatus
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/22—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating capacitance
    • G01N27/223—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating capacitance for determining moisture content, e.g. humidity
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • G01N27/28—Electrolytic cell components
    • G01N27/30—Electrodes, e.g. test electrodes; Half-cells
    • G01N27/333—Ion-selective electrodes or membranes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • G01N27/403—Cells and electrode assemblies
    • G01N27/414—Ion-sensitive or chemical field-effect transistors, i.e. ISFETS or CHEMFETS
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2812—Checking for open circuits or shorts, e.g. solder bridges; Testing conductivity, resistivity or impedance
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2813—Checking the presence, location, orientation or value, e.g. resistance, of components or conductors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
    • G01R31/2836—Fault-finding or characterising
    • G01R31/2843—In-circuit-testing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
    • G01R31/2836—Fault-finding or characterising
    • G01R31/2849—Environmental or reliability testing, e.g. burn-in or validation tests
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2881—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to environmental aspects other than temperature, e.g. humidity or vibrations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/22—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating capacitance
    • G01N27/221—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating capacitance by investigating the dielectric properties
    • G01N2027/222—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating capacitance by investigating the dielectric properties for analysing gases
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G01R31/52—Testing for short-circuits, leakage current or ground faults
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0753—Insulation
    • H05K2201/0761—Insulation resistance, e.g. of the surface of the PCB between the conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09772—Conductors directly under a component but not electrically connected to the component

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Immunology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Electrochemistry (AREA)
  • Pathology (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Nonlinear Science (AREA)
  • Toxicology (AREA)
  • Molecular Biology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Maintenance And Management Of Digital Transmission (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Management, Administration, Business Operations System, And Electronic Commerce (AREA)

Abstract

Se describe un sistema y un método para monitorear una característica de un ambiente de un dispositivo electrónico. El dispositivo electrónico puede incluir un tablero (100) de circuito impreso y un componente. Un sensor (140) está colocado en el tablero (100) de circuito impreso y puede estar dispuesto entre el componente y el tablero (100), y se conecta con un monitor (160), o detector (160). El dispositivo (170) del usuario final se puede utilizar para almacenar, avaluar, presentar y entender los datos recibidos desde el sensor (140) a través del monitor (160).
MX2018014786A 2016-06-01 2017-05-31 Sistema y método para el monitoreo de circuito eléctrico. MX392979B (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/170,710 US10677837B2 (en) 2016-06-01 2016-06-01 System and method for electrical circuit monitoring
PCT/US2017/035239 WO2017210310A1 (en) 2016-06-01 2017-05-31 System and method for electrical circuit monitoring

Publications (2)

Publication Number Publication Date
MX2018014786A MX2018014786A (es) 2019-08-29
MX392979B true MX392979B (es) 2025-03-04

Family

ID=60477854

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2018014786A MX392979B (es) 2016-06-01 2017-05-31 Sistema y método para el monitoreo de circuito eléctrico.

Country Status (12)

Country Link
US (2) US10677837B2 (es)
EP (2) EP3901586A1 (es)
JP (1) JP7088847B2 (es)
KR (1) KR102413262B1 (es)
CN (1) CN109315065B (es)
CA (1) CA3025873A1 (es)
IL (1) IL263271B (es)
MX (1) MX392979B (es)
MY (1) MY194949A (es)
SG (1) SG11201810493WA (es)
TW (1) TWI771300B (es)
WO (1) WO2017210310A1 (es)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20200311327A1 (en) 2018-01-03 2020-10-01 Halliburton Energy Services, Inc. Method and system for non-intrusively determining deposits in a fluidic channel
US20200064291A1 (en) 2018-08-22 2020-02-27 AerNos, Inc. Pattern recognition algorithm for identifying and quantifying single and mixed contaminants in air with an array of nanomaterial-based gas sensors
US11371976B2 (en) 2018-08-22 2022-06-28 AerNos, Inc. Systems and methods for an SoC based electronic system for detecting multiple low concentration gas levels
FR3088714A1 (fr) * 2018-11-16 2020-05-22 Continental Automotive France Circuit imprime comportant une jauge de deformation
US11102921B2 (en) 2019-02-19 2021-08-24 IEC Electronics Corp. Electrically testing cleanliness of a panel having an electronic assembly
US10955372B2 (en) 2019-04-10 2021-03-23 Nokia Technologies Oy Integrated environmental sensor for damage sensing
US11037429B2 (en) * 2019-05-09 2021-06-15 Oracle International Corporation Embedded active environmental contaminant monitor
CN111975171B (zh) * 2019-05-22 2025-08-22 伊利诺斯工具制品有限公司 具有未知停机时间禁用的焊接监视系统
KR102315828B1 (ko) * 2019-09-05 2021-10-22 국방과학연구소 금속성 또는 반도체성을 갖는 나노 재료를 액티브 소재로 이용하는 정전용량변화 검지형 나노화학센서
DE102019216327A1 (de) * 2019-10-23 2021-04-29 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Sensor mit einer festkörper-schichtstruktur und verfahren zur herstellung eines sensors
US11493565B2 (en) * 2019-12-03 2022-11-08 International Business Machines Corporation Leakage characterization and management for electronic circuit enhancement
US11531056B2 (en) * 2020-04-15 2022-12-20 Infineon Technologies Ag Predictive chip-maintenance
WO2022104315A1 (en) * 2020-11-11 2022-05-19 Lam Research Corporation Substrate processing system tools for monitoring, assessing and responding based on health including sensor mapping and triggered datalogging
DE102021110346A1 (de) * 2021-04-22 2022-10-27 Federnfabrik Schmid Ag Überwachte Feder-Baugruppe sowie Verfahren zu ihrer Herstellung und ihrem Betrieb
US11768237B2 (en) 2022-05-10 2023-09-26 Google Llc Leakage screening based on use-case power prediction
US12282371B2 (en) * 2022-06-24 2025-04-22 Microsoft Technology Licensing, Llc Devices, systems, and methods for monitoring an electronic device in transit
US20240085310A1 (en) * 2022-09-12 2024-03-14 Antony Trueman Resistance-Based Sensor System for Measuring Atmospheric Corrosion
US20250076156A1 (en) * 2023-08-29 2025-03-06 SK Hynix NAND Product Solutions Corp. (dba Solidigm) Thermal-mechanical testing device for platform integration
CN119996450A (zh) * 2025-02-06 2025-05-13 深圳市揽胜科技有限公司 一种用于智能锁多数据并行处理的云平台监控方法

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2728561B2 (ja) * 1990-11-30 1998-03-18 株式会社日立製作所 プリント板絶縁劣化検出手段を備えた電子装置
JPH07249840A (ja) * 1994-03-10 1995-09-26 Toshiba Corp プリント基板及びその劣化診断方法
JPH08220158A (ja) * 1995-02-08 1996-08-30 Shibafu Eng Kk 沿面絶縁劣化検出装置
JPH10239374A (ja) * 1997-02-24 1998-09-11 Kyocera Corp プリント基板の絶縁劣化検出装置
JPH11211684A (ja) * 1998-01-20 1999-08-06 Hioki Ee Corp マイグレーション検査装置
JP2003254923A (ja) * 2002-02-28 2003-09-10 Espec Corp マイグレーション測定方法および測定装置
CN2831113Y (zh) 2005-05-25 2006-10-25 友力微系统制造股份有限公司 多功能无线检测装置
TW200724881A (en) 2005-12-16 2007-07-01 Kuender & Co Ltd Circuit board monitoring system
CN101038263A (zh) * 2006-03-13 2007-09-19 华为技术有限公司 一种评估电路板腐蚀风险的方法和系统
US9051814B2 (en) * 2010-10-05 2015-06-09 Baker Hughes Incorporated Real-time prognostic on downhole printed circuit board assembly of measurement-while-drilling/logging-while-drilling
CN102565878A (zh) 2010-12-18 2012-07-11 西安迅腾科技有限责任公司 一种高精度可移动式环境数据采集装置
US8784952B2 (en) 2011-08-19 2014-07-22 Earthone Circuit Technologies Corporation Method of forming a conductive image on a non-conductive surface
US20130092843A1 (en) * 2011-10-18 2013-04-18 Marcos de Azambuja Turqueti Miniature Radiation Detector Module Configured as Smart Mobile Device/Phone Ad-On
US9582035B2 (en) * 2014-02-25 2017-02-28 Medibotics Llc Wearable computing devices and methods for the wrist and/or forearm
ITTO20120516A1 (it) * 2012-06-14 2013-12-15 St Microelectronics Srl Metodo di fabbricazione di un sensore elettrochimico basato su grafene e sensore elettrochimico
US20130344609A1 (en) * 2012-06-21 2013-12-26 Felix Mayer Chemical sensor in a portable electronic device
US9167325B2 (en) * 2012-10-23 2015-10-20 Apple Inc. Electronic devices with environmental sensors
DE112014002066T5 (de) * 2013-04-21 2015-12-31 Kerstan Hoobler Eric lonensensitive Vorrichtung und Herstellungsverfahren
US9080932B2 (en) * 2013-05-13 2015-07-14 Apple Inc. Electronic device with printed circuit board stress monitoring
JP2015031666A (ja) * 2013-08-06 2015-02-16 日本電信電話株式会社 センサ素子
US10321844B2 (en) * 2013-12-16 2019-06-18 Medtronic Minimed, Inc. In-vivo electrochemical impedance spectroscopy (EIS)-based calibration
JP5792332B2 (ja) 2014-02-04 2015-10-07 ファナック株式会社 プリント基板の劣化検出機能を有する電子装置
GB2523173A (en) 2014-02-17 2015-08-19 Nokia Technologies Oy An apparatus and associated methods
KR101882118B1 (ko) 2014-02-19 2018-07-25 인피니언 테크놀로지스 아게 파급 고장의 검출
KR102228782B1 (ko) * 2014-10-22 2021-03-18 삼성전자주식회사 전자 장치 및 전자 장치에서의 이상 여부 판단 방법

Also Published As

Publication number Publication date
JP7088847B2 (ja) 2022-06-21
CA3025873A1 (en) 2017-12-07
US20170350936A1 (en) 2017-12-07
TW201812327A (zh) 2018-04-01
MX2018014786A (es) 2019-08-29
IL263271B (en) 2022-06-01
EP3473065A1 (en) 2019-04-24
MY194949A (en) 2022-12-28
CN109315065B (zh) 2021-10-08
IL263271A (en) 2018-12-31
KR102413262B1 (ko) 2022-06-27
US10677837B2 (en) 2020-06-09
US11073548B2 (en) 2021-07-27
SG11201810493WA (en) 2018-12-28
TWI771300B (zh) 2022-07-21
KR20190013842A (ko) 2019-02-11
EP3901586A1 (en) 2021-10-27
US20200264226A1 (en) 2020-08-20
WO2017210310A1 (en) 2017-12-07
JP2019519924A (ja) 2019-07-11
CN109315065A (zh) 2019-02-05
EP3473065A4 (en) 2020-04-08

Similar Documents

Publication Publication Date Title
MX392979B (es) Sistema y método para el monitoreo de circuito eléctrico.
WO2016040378A3 (en) Environmental monitoring devices and methods
EP3886448A4 (en) VIDEO PROCESSING PROCESS AND DEVICE, ELECTRONIC DEVICE AND COMPUTER READABLE MEDIA
EP3797685B8 (en) Communication systems between a sensor electronics unit and a display device of an analyte monitoring system
MY200756A (en) Method for controlling camera and electronic device therefor
MY187656A (en) Visualisation system and method for electronic vapour provision systems
EP3680853A4 (en) IMAGE PROCESSING PROCESS AND DEVICE, ELECTRONIC DEVICE AND COMPUTER READABLE INFORMATION MEDIA
MX359776B (es) Sistema industrial para supervision de ruido de audio.
CA2959075C (en) Methods and systems for chemical vapour sensing
AR096833A1 (es) Múltiples sensores para monitorear la salud y el bienestar de un animal
EP3367209A3 (en) Method and apparatus for surface and ambient temperature estimation for portable devices
WO2014140906A3 (en) Systems and methods for providing feedback based on the state of an object
MX2016006276A (es) Medicion de deformacion en dispositivos flexibles.
GB2550704A (en) System and method for providing freshness information
GB2561778A (en) Device for real time equipment tracking at a construction site
EP3546934A4 (en) SENSOR PCB, SENSOR HOUSING AND SENSOR DEVICE
WO2014146011A3 (en) Determining activities from sensed motion signals
EP3149657A4 (en) Electronic device with fingerprint sensing system and conducting housing
EP3624006A4 (en) IMAGE PROCESSING, DEVICE, COMPUTER-READABLE STORAGE MEDIA AND ELECTRONIC DEVICE
EP4477276A3 (en) Fall detection alert/alarm device and method
EP3680857A4 (en) IMAGE PROCESSING PROCESS AND APPARATUS, ELECTRONIC DEVICE AND COMPUTER READABLE STORAGE MEDIA
EP2894406A3 (en) Method and apparatus for controlling cooking device
EP3654152A4 (en) PIEZORESISTIVE DETECTION CIRCUIT, PIEZORESISTIVE DETECTION SUBSTRATE, DISPLAY PANEL, AND DISPLAY DEVICE
WO2014145112A3 (en) Methods and architecture for determining activity and activity types from sensed motion signals
MX362599B (es) Sistema y método para monitoreo de transporte de un dispositivo de transporte de personas o de una unidad de transporte.