MX385404B - Sistema de resina para fundición de epoxi de múltiples funciones. - Google Patents

Sistema de resina para fundición de epoxi de múltiples funciones.

Info

Publication number
MX385404B
MX385404B MX2015010995A MX2015010995A MX385404B MX 385404 B MX385404 B MX 385404B MX 2015010995 A MX2015010995 A MX 2015010995A MX 2015010995 A MX2015010995 A MX 2015010995A MX 385404 B MX385404 B MX 385404B
Authority
MX
Mexico
Prior art keywords
casting resin
epoxy casting
resin system
function epoxy
epoxy
Prior art date
Application number
MX2015010995A
Other languages
English (en)
Other versions
MX2015010995A (es
Inventor
Stameson James
Forney Michael
Original Assignee
Plasma Systems Holdings Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Plasma Systems Holdings Inc filed Critical Plasma Systems Holdings Inc
Publication of MX2015010995A publication Critical patent/MX2015010995A/es
Publication of MX385404B publication Critical patent/MX385404B/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Organic Insulating Materials (AREA)

Abstract

La presente invención generalmente se refiere a las modalidades de un sistema de resina de fundición de epoxi que puede utilizarse para cubrir al menos parcialmente un componente o mecanismo electrónico. En alguna modalidades, la resina epoxi tiene una viscosidad baja, mientras mantiene propiedades físicas ventajosas, térmicas y eléctricas. Además se describen métodos para elaborar modalidades de la resina de fundición de epoxi.
MX2015010995A 2013-03-15 2014-03-13 Sistema de resina para fundición de epoxi de múltiples funciones. MX385404B (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201361799248P 2013-03-15 2013-03-15
PCT/US2014/025503 WO2014151337A1 (en) 2013-03-15 2014-03-13 Multi-function epoxy casting resin system

Publications (2)

Publication Number Publication Date
MX2015010995A MX2015010995A (es) 2016-06-02
MX385404B true MX385404B (es) 2025-03-18

Family

ID=51528343

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2015010995A MX385404B (es) 2013-03-15 2014-03-13 Sistema de resina para fundición de epoxi de múltiples funciones.

Country Status (6)

Country Link
US (1) US9629254B2 (es)
EP (1) EP2970651B1 (es)
CN (1) CN105229078A (es)
CA (1) CA2902617C (es)
MX (1) MX385404B (es)
WO (1) WO2014151337A1 (es)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012158292A1 (en) * 2011-05-13 2012-11-22 Dow Global Technologies Llc Insulation formulations
WO2016175789A1 (en) * 2015-04-29 2016-11-03 Hewlett Packard Enterprise Development Lp Physical barrier to inhibit a penetration attack
CN113573525B (zh) * 2021-07-28 2023-02-28 Oppo广东移动通信有限公司 壳体组件、其制备方法及电子设备

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0459951A3 (en) 1990-05-30 1993-09-15 Ciba-Geigy Ag Char forming nonhalogenated flame retardant epoxy composition
HU220297B (hu) * 1994-07-01 2001-11-28 Robert Bosch Gmbh. Epoxi öntőgyanta készítmény
US20040143079A1 (en) * 2003-01-21 2004-07-22 Simion Coca Compositions containing copolymers of isobutylene type monomers
US6946503B2 (en) * 2002-04-12 2005-09-20 Huntsman Petrochemical Corporation Amine blend accelerators for polyoxyalkylenepolyamine cured epoxy resins
EP1810985A1 (en) * 2006-01-24 2007-07-25 Huntsman Advanced Materials (Switzerland) GmbH Curable composition
EP2133381A1 (de) * 2008-06-13 2009-12-16 Sika Technology AG Wasserverdünnbares Amin und dessen Anwendungen
JP2012518707A (ja) * 2009-02-24 2012-08-16 ダウ グローバル テクノロジーズ エルエルシー 硬化性エポキシ樹脂組成物及びその硬化体生成物
EP2295487A1 (en) * 2009-09-11 2011-03-16 Elantas GMBH Epoxy resin curing indicator composition
ES2388809T3 (es) * 2009-12-08 2012-10-18 Sika Technology Ag Composición de resina epoxídica poco viscosa con bajo " blushing"
US9840588B2 (en) 2009-12-18 2017-12-12 Hexion Inc. Epoxy resin curing compositions and epoxy resin systems including same
EP2465842A1 (de) * 2010-12-17 2012-06-20 Sika Technology AG Amine mit sekundären aliphatischen Aminogruppen
WO2012158292A1 (en) * 2011-05-13 2012-11-22 Dow Global Technologies Llc Insulation formulations
US9145488B2 (en) * 2011-05-19 2015-09-29 Chemtura Corporation Aluminum phosphorus acid salts as epoxy resin cure inhibitors
EP2592100A1 (de) * 2011-11-10 2013-05-15 Sika Technology AG Härter für epoxidharz-beschichtungen
EP2592101A1 (de) * 2011-11-10 2013-05-15 Sika Technology AG Härter für Epoxidharz-Beschichtungen
CN102533192A (zh) * 2011-12-28 2012-07-04 烟台德邦电子材料有限公司 一种阻燃的高导热环氧树脂电子粘接胶
CN102863936B (zh) * 2012-10-09 2014-07-02 株洲时代新材料科技股份有限公司 一种加热固化型双组分环氧灌封胶及其制备方法

Also Published As

Publication number Publication date
CN105229078A (zh) 2016-01-06
MX2015010995A (es) 2016-06-02
US20140272328A1 (en) 2014-09-18
CA2902617A1 (en) 2014-09-25
WO2014151337A1 (en) 2014-09-25
CA2902617C (en) 2021-03-02
EP2970651B1 (en) 2025-02-26
EP2970651A4 (en) 2016-09-21
EP2970651A1 (en) 2016-01-20
US9629254B2 (en) 2017-04-18
EP2970651C0 (en) 2025-02-26

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