MX353993B - Sistema de enfriamiento por inmersion de aparatos. - Google Patents

Sistema de enfriamiento por inmersion de aparatos.

Info

Publication number
MX353993B
MX353993B MX2015007601A MX2015007601A MX353993B MX 353993 B MX353993 B MX 353993B MX 2015007601 A MX2015007601 A MX 2015007601A MX 2015007601 A MX2015007601 A MX 2015007601A MX 353993 B MX353993 B MX 353993B
Authority
MX
Mexico
Prior art keywords
tank
dielectric fluid
primary
appliance
cooling system
Prior art date
Application number
MX2015007601A
Other languages
English (en)
Other versions
MX2015007601A (es
Inventor
L Boyd Christopher
P Koen James
Christopher Laguna David
R Turner Thomas
D Swinden Kenneth
Conti Garcia Mario
Charles Tribou John
Original Assignee
Midas Green Tech Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=51167290&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=MX353993(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Midas Green Tech Llc filed Critical Midas Green Tech Llc
Publication of MX2015007601A publication Critical patent/MX2015007601A/es
Publication of MX353993B publication Critical patent/MX353993B/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/44—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades

Abstract

La presente invención se refiere a un sistema de tanque de inmersión de aparatos que comprende un tanque generalmente rectangular que está adaptado para sumergir en un fluido dieléctrico una pluralidad de aparatos, cada uno en una respectiva ranura de aparato distribuida verticalmente a lo largo de, y extendiéndose en forma transversal a, el eje longitudinal del tanque; una instalación de circulación primaria que está adaptada para hacer circular el fluido dieléctrico a través del tanque; una instalación de circulación secundaria de fluido que está adaptada para extraer calor procedente del fluido dieléctrico que circula en la instalación de circulación primaria, y para disipar al medio ambiente el calor extraído de esta manera; y una instalación de control que está adaptada para coordinar la operación de las instalaciones de circulación de fluido primaria y secundaria como una función de la temperatura del fluido dieléctrico que se encuentra en el tanque.
MX2015007601A 2012-12-14 2013-12-13 Sistema de enfriamiento por inmersion de aparatos. MX353993B (es)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261737200P 2012-12-14 2012-12-14
US201361832211P 2013-06-07 2013-06-07
PCT/US2013/075126 WO2014109869A1 (en) 2012-12-14 2013-12-13 Appliance immersion cooling system

Publications (2)

Publication Number Publication Date
MX2015007601A MX2015007601A (es) 2016-03-21
MX353993B true MX353993B (es) 2018-02-07

Family

ID=51167290

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2015007601A MX353993B (es) 2012-12-14 2013-12-13 Sistema de enfriamiento por inmersion de aparatos.

Country Status (9)

Country Link
US (2) US10405457B2 (es)
EP (1) EP2932349B1 (es)
JP (1) JP6228228B2 (es)
ES (1) ES2642774T3 (es)
MX (1) MX353993B (es)
PL (1) PL2932349T3 (es)
RU (1) RU2645721C2 (es)
SA (1) SA515360586B1 (es)
WO (1) WO2014109869A1 (es)

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RU2643173C1 (ru) * 2016-12-30 2018-01-31 Общество с ограниченной ответственностью "НИЦ супер-ЭВМ и нейрокомпьютеров" Иммерсионная система охлаждения для электронных устройств
RU2663213C2 (ru) * 2017-01-27 2018-08-02 Сергей Михайлович Абрамов Устройство для охлаждения изделий электронной техники
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WO2019006437A1 (en) * 2017-06-30 2019-01-03 Midas Green Technologies, Llc ENHANCED APPROPER IMMERSION COOLING SYSTEM
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TWI659188B (zh) * 2017-11-22 2019-05-11 英業達股份有限公司 浸入式冷卻設備及其伺服器系統
RU2695089C2 (ru) * 2017-12-26 2019-07-19 Общество с ограниченной ответственностью "Научно-Технический Центр ИннТех" Система непосредственного жидкостного охлаждения электронных компонентов
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RU2692569C1 (ru) * 2019-02-19 2019-06-25 Кирилл Олегович Морозов Система иммерсионного охлаждения серверного оборудования
CN111669935B (zh) * 2019-03-08 2023-01-06 富联精密电子(天津)有限公司 冷却装置及应用所述冷却装置的电子装置冷却系统
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CA3042519C (en) * 2019-05-07 2020-12-22 Stephane Gauthier Cooling a computer processing unit
US10765033B1 (en) * 2019-05-23 2020-09-01 Microsoft Technology Licensing, Llc Immersion cooling enclosures with insulating liners
TWI715074B (zh) * 2019-06-21 2021-01-01 俄羅斯聯邦商塞恩堤芬克泰尼克中心宇太科技有限公司 冷卻電子元件之直液式冷卻系統
US20230037391A1 (en) * 2020-01-23 2023-02-09 Ivan KIRILLOV Cooling bath for multiprocessor circuit boards
AU2020459333A1 (en) 2020-07-20 2022-05-26 Ivan Kirillov Fast flow cooling bath for multiprocessor circuit boards
TWI738490B (zh) 2020-07-27 2021-09-01 劉劭祺 材料處理設備及其操作方法
USD998770S1 (en) 2020-10-19 2023-09-12 Green Revolution Cooling, Inc. Cooling system enclosure
USD982145S1 (en) 2020-10-19 2023-03-28 Green Revolution Cooling, Inc. Cooling system enclosure
US11696423B2 (en) * 2021-05-06 2023-07-04 Tyco Fire & Security Gmbh Liquid immersion cooling tank with variable flow for high density computer server equipment
EP4349145A1 (en) * 2021-06-04 2024-04-10 L'ecuyer, Charles Cooling system
RU208633U1 (ru) * 2021-07-29 2021-12-28 Алексей Дмитриевич Клементьев Устройство непосредственного жидкостного охлаждения изделий вычислительной техники
US20230080447A1 (en) * 2021-09-15 2023-03-16 Tmgcore, Inc. Liquid immersion cooling platform and components thereof
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Also Published As

Publication number Publication date
US10405457B2 (en) 2019-09-03
EP2932349B1 (en) 2017-08-30
EP2932349A4 (en) 2016-11-02
EP2932349A1 (en) 2015-10-21
MX2015007601A (es) 2016-03-21
US20190200482A1 (en) 2019-06-27
US20150181762A1 (en) 2015-06-25
RU2645721C2 (ru) 2018-02-28
RU2015128279A (ru) 2017-01-18
ES2642774T3 (es) 2017-11-20
WO2014109869A1 (en) 2014-07-17
SA515360586B1 (ar) 2018-08-16
JP2016509278A (ja) 2016-03-24
JP6228228B2 (ja) 2017-11-08
US10820446B2 (en) 2020-10-27
PL2932349T3 (pl) 2018-02-28

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