SA518391580B1 - جهاز يضم مكونات منتجة للحرارة بالتبريد بالغمر في سائل - Google Patents
جهاز يضم مكونات منتجة للحرارة بالتبريد بالغمر في سائلInfo
- Publication number
- SA518391580B1 SA518391580B1 SA518391580A SA518391580A SA518391580B1 SA 518391580 B1 SA518391580 B1 SA 518391580B1 SA 518391580 A SA518391580 A SA 518391580A SA 518391580 A SA518391580 A SA 518391580A SA 518391580 B1 SA518391580 B1 SA 518391580B1
- Authority
- SA
- Saudi Arabia
- Prior art keywords
- liquid
- components
- heat
- heat producing
- producing components
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
- F24F13/08—Air-flow control members, e.g. louvres, grilles, flaps or guide plates
- F24F13/10—Air-flow control members, e.g. louvres, grilles, flaps or guide plates movable, e.g. dampers
- F24F13/14—Air-flow control members, e.g. louvres, grilles, flaps or guide plates movable, e.g. dampers built up of tilting members, e.g. louvre
- F24F13/15—Air-flow control members, e.g. louvres, grilles, flaps or guide plates movable, e.g. dampers built up of tilting members, e.g. louvre with parallel simultaneously tiltable lamellae
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/44—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20245—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by natural convection; Thermosiphons
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20263—Heat dissipaters releasing heat from coolant
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20627—Liquid coolant without phase change
- H05K7/20636—Liquid coolant without phase change within sub-racks for removing heat from electronic boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20772—Liquid cooling without phase change within server blades for removing heat from heat source
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
Abstract
يتعلق الاختراع الحالي بجهاز يضم مكونات إلكترونية منتجة للحرارة (2)، مثل لوحات ذاكرة خادم شبكة server memory boards، معالجات و/أو مفاتيح كهربائية، يضم الجهاز المذكور وعاء (1) فيه يتم تثبيت المكونات المذكورة المنتجة للحرارة، سائل في الوعاء المذكور حيث يتم غمر المكونات المذكورة في السائل لاستخراج حرارة من المكونات المذكورة، مبادل حرارة (7) heat exchanger واحد على الأقل له سطح في تماس مع السائل المذكور وهو مجهز لاستخراج حرارة من السائل المذكور، حيث يوجد بين مبادل الحرارة المذكور والمكونات المذكورة جدار رأسي (6) لتوجيه وفصل دورة رأسية للسائل المذكور في الوعاء المذكور يحدثها اختلاف درجة الحرارة في السائل المذكور. الشكل 1
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL2015841A NL2015841B1 (en) | 2015-11-23 | 2015-11-23 | A device comprising heat producing components with liquid submersion cooling. |
PCT/EP2016/078344 WO2017089313A1 (en) | 2015-11-23 | 2016-11-21 | A device comprising heat producing components with liquid submersion cooling |
Publications (1)
Publication Number | Publication Date |
---|---|
SA518391580B1 true SA518391580B1 (ar) | 2022-03-20 |
Family
ID=55443284
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SA518391580A SA518391580B1 (ar) | 2015-11-23 | 2018-05-15 | جهاز يضم مكونات منتجة للحرارة بالتبريد بالغمر في سائل |
Country Status (6)
Country | Link |
---|---|
US (1) | US10716238B2 (ar) |
EP (1) | EP3380907A1 (ar) |
CN (1) | CN108351675B (ar) |
NL (1) | NL2015841B1 (ar) |
SA (1) | SA518391580B1 (ar) |
WO (1) | WO2017089313A1 (ar) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB201619987D0 (en) | 2016-11-25 | 2017-01-11 | Iceotope Ltd | Fluid cooling system |
JP6939034B2 (ja) * | 2017-04-05 | 2021-09-22 | 富士通株式会社 | 冷却システム、冷却装置、及び電子システム |
CN107690267B (zh) * | 2017-09-30 | 2023-11-28 | 深圳绿色云图科技有限公司 | 一种数据中心冷却系统以及数据中心 |
CN107846822A (zh) * | 2017-11-26 | 2018-03-27 | 北京中热能源科技有限公司 | 一种电子设备冷却系统 |
CN108882652B (zh) * | 2018-08-21 | 2019-07-09 | 葛俊 | 高密度服务器的液体浸没冷却机柜、系统及维护方法 |
US10609839B1 (en) * | 2018-09-28 | 2020-03-31 | Liquidcool Solutions, Inc. | Liquid submersion cooled electronic systems and devices |
JP7295381B2 (ja) * | 2019-02-14 | 2023-06-21 | 富士通株式会社 | 冷却装置、冷却システム及び冷却方法 |
TWI714037B (zh) * | 2019-03-26 | 2020-12-21 | 緯創資通股份有限公司 | 用於儲液槽體的氣流產生系統、具有其之浸沒式冷卻設備以及其操作方法 |
CA3042519C (en) | 2019-05-07 | 2020-12-22 | Stephane Gauthier | Cooling a computer processing unit |
US10765033B1 (en) * | 2019-05-23 | 2020-09-01 | Microsoft Technology Licensing, Llc | Immersion cooling enclosures with insulating liners |
US10939581B1 (en) * | 2020-01-15 | 2021-03-02 | Quanta Computer Inc. | Immersion liquid cooling rack |
CN113721718A (zh) * | 2020-05-26 | 2021-11-30 | 鸿富锦精密电子(天津)有限公司 | 散热装置及服务器 |
US11392184B2 (en) * | 2020-09-25 | 2022-07-19 | Microsoft Technology Licensing, Llc | Disaggregated computer systems |
CN112051912B (zh) * | 2020-09-30 | 2022-10-21 | 兰洋(宁波)科技有限公司 | 单相浸没式液态换热系统与换热方法 |
NL2027361B9 (en) | 2021-01-21 | 2022-09-12 | Stem Tech | Ixora Holding B V | Immersive cooling unit for cooling electronic components and method of using the same |
EP4282235A1 (en) | 2021-01-21 | 2023-11-29 | Stem Technologies/Ixora Holding B.V. | Immersive cooling unit for cooling electronic components and method of using the same |
EP4068925A1 (en) * | 2021-04-01 | 2022-10-05 | Ovh | Scissor structure for cable/tube management of rack-mounted liquid-cooled electronic assemblies |
EP4093170A1 (en) * | 2021-05-17 | 2022-11-23 | Cgg Services Sas | Methods and systems for fluid immersion cooling |
CN114340332B (zh) * | 2021-12-14 | 2023-08-29 | 深圳富联富桂精密工业有限公司 | 浸没式冷却系统 |
WO2023241824A1 (en) * | 2022-06-13 | 2023-12-21 | Eaton Intelligent Power Limited | Passive cooling apparatus for cooling of immersion fluid and power conversion equipment and related systems |
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DE2255646C3 (de) * | 1972-11-14 | 1979-03-08 | Danfoss A/S, Nordborg (Daenemark) | ölgekühltes elektrisches Gerät |
KR860000253B1 (ko) * | 1981-04-07 | 1986-03-21 | 카다야마 히도하지로 | 비등 냉각장치(沸騰冷却裝置) |
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GB0518554D0 (en) * | 2005-09-12 | 2005-10-19 | Geola Technologies Ltd | An image capture system for digital holograms |
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JP2018088433A (ja) * | 2016-11-28 | 2018-06-07 | 富士通株式会社 | 冷却システム及び電子機器の冷却方法 |
CN111615291B (zh) * | 2019-02-25 | 2023-04-11 | 富联精密电子(天津)有限公司 | 浸没式冷却装置 |
-
2015
- 2015-11-23 NL NL2015841A patent/NL2015841B1/en active
-
2016
- 2016-11-21 CN CN201680068050.0A patent/CN108351675B/zh active Active
- 2016-11-21 EP EP16798513.4A patent/EP3380907A1/en active Pending
- 2016-11-21 US US15/775,281 patent/US10716238B2/en active Active
- 2016-11-21 WO PCT/EP2016/078344 patent/WO2017089313A1/en active Application Filing
-
2018
- 2018-05-15 SA SA518391580A patent/SA518391580B1/ar unknown
Also Published As
Publication number | Publication date |
---|---|
EP3380907A1 (en) | 2018-10-03 |
WO2017089313A1 (en) | 2017-06-01 |
US10716238B2 (en) | 2020-07-14 |
CN108351675A (zh) | 2018-07-31 |
US20180343770A1 (en) | 2018-11-29 |
NL2015841B1 (en) | 2017-06-07 |
CN108351675B (zh) | 2022-06-14 |
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