CN108351675A - 利用液体浸没冷却的包括产热部件的装置 - Google Patents

利用液体浸没冷却的包括产热部件的装置 Download PDF

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CN108351675A
CN108351675A CN201680068050.0A CN201680068050A CN108351675A CN 108351675 A CN108351675 A CN 108351675A CN 201680068050 A CN201680068050 A CN 201680068050A CN 108351675 A CN108351675 A CN 108351675A
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迪尔克·鲁洛夫·布林克
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Eko Heath Co Ltd
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20236Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24FAIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F13/00Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
    • F24F13/08Air-flow control members, e.g. louvres, grilles, flaps or guide plates
    • F24F13/10Air-flow control members, e.g. louvres, grilles, flaps or guide plates movable, e.g. dampers
    • F24F13/14Air-flow control members, e.g. louvres, grilles, flaps or guide plates movable, e.g. dampers built up of tilting members, e.g. louvre
    • F24F13/15Air-flow control members, e.g. louvres, grilles, flaps or guide plates movable, e.g. dampers built up of tilting members, e.g. louvre with parallel simultaneously tiltable lamellae
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/44Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20245Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by natural convection; Thermosiphons
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20263Heat dissipaters releasing heat from coolant
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20627Liquid coolant without phase change
    • H05K7/20636Liquid coolant without phase change within sub-racks for removing heat from electronic boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763Liquid cooling without phase change
    • H05K7/20772Liquid cooling without phase change within server blades for removing heat from heat source
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20Indexing scheme relating to G06F1/20
    • G06F2200/201Cooling arrangements using cooling fluid

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Abstract

一种包括诸如服务器存储器板、处理器和/或开关的产热电子部件(2)的装置,所述装置包括:安装有所述产热部件的容器(1);在所述容器中的液体,所述部件被浸没在所述液体中以从所述部件吸取热量;至少一个热交换器(7),所述至少一个热交换器具有与所述液体接触并且布置成从所述液体吸取热量的表面,其中,在所述热交换器与所述部件之间存在用于引导并且分隔由所述液体中的温差引起的所述液体在所述容器中的竖直循环的竖直壁(6)。

Description

利用液体浸没冷却的包括产热部件的装置
本发明涉及包括诸如服务器存储器板、硬盘、处理器和/或开关的产热部件的装置,所述装置包括:安装有所述产热部件的容器;在所述容器中的液体,所述部件被浸没在所述液体中以从所述部件吸取热量;至少一个热交换器,所述至少一个热交换器具有与所述液体接触并且布置成从所述液体吸取热量的表面。本发明还可以适用于非电子产热部件。
电子部件的浸没冷却是公知的技术。油或任何其他合适的介电流体可以用作冷却液体。为了高效地冷却部件,油必须沿着部件并且沿着冷却热交换表面流动,用于转移来自冷却液体的热量。特别是在数据中心中,需要高效节能的冷却系统。
本发明以产热部件的浸入冷却的更高效、节能、节省空间、节约成本、鲁棒和/或免费维护的解决方案为目标。
为此,在所述热交换器与所述部件之间存在用于引导和分隔由所述液体中的温差引起的所述液体在所述容器中的竖直循环的竖直壁。以这种方式,通过对流以高效的方式引起冷却液体的自诱导双重且对称的竖直循环,其中,避免了热斑(hot spot)的危险,并且不需要机械驱动装置来引起装置中的必要的液体流动。系统是自调节的,这是因为如果部件变热,则液体将流动得更快,从而将更快地冷却。为了解释在所述装置的水平截面中看到的特征,所述部件被设置在至少两个所述热交换器及竖直壁之间,应当注意的是,所述至少两个所述热交换器和/或竖直壁也可以是一个连续的热交换器和/或竖直壁中的至少两个不同部分。优选地,容器具有绝热壁。
优选地,在所述装置的水平截面中看,所述部件被设置在至少两个所述热交换器及竖直壁之间。优选地,所述部件安装在多个片状板上,所述板以彼此平行的方式竖直地安装在所述容器中并且垂直于所述至少两个竖直壁。优选地,在所述壁的下边缘与容器的底部之间设置有第一空间,并且在所述壁的上边缘与容器的上壁之间设置有第二空间,以允许所述液体循环通过。优选地,在所述装置的水平截面中看,所述部件以对称配置被设置在所述热交换器及竖直壁之间。
优选地,所述冷却液体是具有足够大的膨胀系数的介电流体,例如油。优选地,所述热交换器是具有导管的散热器型热交换器,诸如水的冷却液体流过该导管。可替选地,所述热交换器可以是散热式热交换器,包括在与液体接触的所述表面的另一侧延伸的冷却片。
在另一优选实施方式中,在所述装置的水平截面中看,所述部件以同心配置被设置在所述热交换器及竖直壁之间。
在又一实施方式中,多个组的部件被水平间隔开地安装在所述容器中,每个组均被设置在至少两个所述热交换器及竖直壁之间,并且其中,至少一个所述热交换器被设置在至少两个所述壁及组之间。
优选地,所述竖直壁由绝热材料制成。所述容器的内部容积优选大于1L、更优选地大于50L、甚至更优选地大于1000L。优选地,所述容器的顶壁是可移除的盖件。
现在将参照附图借助于优选实施方式来说明本发明,在附图中:
图1是根据本发明的装置的立体图;
图2是图1的装置的另一立体图;
图3是图1的装置的示意性竖直截面;
图4是根据本发明的装置的另一实施方式的示意性竖直截面;
图5是根据本发明的装置的另一实施方式的示意性水平截面;以及
图6是根据本发明的装置的另一实施方式的示意性水平截面。
根据图1、图2和图3,该装置包括液体密封容器1,在液体密封容器1中,从顶侧悬挂有具有诸如存储器芯片、处理器和开关的产热电子部件的平行板(PCB)2的两个阵列。在使用时,板2完全浸没在合适的油3中。容器1的顶侧由一个或更多个可铰接的盖件封闭。板2通过电连接装置5连接至容器1的外侧。在板2的两个阵列的两个相对侧,竖直分隔壁6安装在容器1中。壁6垂直于板2延伸。在壁6的另一侧,散热器型热交换器7安装在容器1中,散热器型热交换器7也浸没在油3中。壁6使具有电子部件的板2延伸的空间与热交换器7延伸的空间基本上分隔开。
如可以在图3中所看到的,当电子部件在装置的使用期间变热时,容器中的油的双重且对称的竖直循环由油3中的温差引起,其中,油3在容器1中的受热部件2之间的中心处升高并且在容器1的侧面、在壁6的另一侧沿着冷却热交换器7下降。冷却水通过热交换器7的导管被泵送并且通过供给管8供应到装置并且通过排出管9从装置排出。由此吸取的热量可以被重新用于其他目的。
图4示出了装置的另一实施方式,其中,三个组的电子部件2被彼此间隔开地安装在容器1中。同样在每个组的两个相对侧,竖直分隔壁6安装在容器1中。在壁的另一侧,浸没热交换器7延伸,其中,组2之间的热交换器7是共同的。以这种方式,冷却油3的三个双重且对称的竖直循环以很高效的方式发生。
图5示出了装置的另一实施方式,其中,产热部件2位于圆形容器1的中心,竖直分隔壁6也是圆形的并且围绕电子部件2延伸,并且热交换器7在竖直分隔壁6与圆形容器壁1之间的环形空间中延伸,上述全部呈同心配置。以这种方式,冷却油的同心竖直循环发生。
图6示出了其中组合了图4和图5的实施方式的特征的又一实施方式。两个组的电子部件2以同心方式彼此间隔开地安装在容器1中。围绕中心组2安装有第一圆形竖直分隔壁,并且热交换器7在第一竖直分隔壁6与第二分隔壁6之间的环形空间中延伸。第二组2在围绕所述第二竖直分隔壁6并且在第三竖直分隔壁6内的空间中延伸。第一竖直分隔壁6与第二竖直分隔壁6之间以及组2之间的热交换器7是共同的。以这种方式,冷却油的两个同心竖直循环以很高效的方式发生。
将容易理解的是,可以做出如上述实施方式中所示的不同配置以及具有不同数目的组的各种组合。
因此已经借助于优选实施方式描述了本发明。然而,应当理解,本公开内容仅是说明性的。提出了结构和功能的各种细节,但其中所做出的通过所附权利要求被表达的术语的一般含义扩展的整个范围内的改变被理解为在本发明的原理内。说明书和附图应当用于解释权利要求书。权利要求书不应被解释为意味着所寻求的保护范围应当被理解为由权利要求书中使用的措词的严格的字面含义所限定的范围,说明书和附图仅用于解决权利要求书中发现的不明确性的目的。出于确定权利要求书所寻求的保护范围的目的,应当适当考虑与权利要求书中描述的要素等同的任何要素。

Claims (14)

1.一种包括产热部件的装置,所述产热部件例如为服务器存储器板、硬盘、处理器和/或开关,所述装置包括:安装有所述产热部件的容器;在所述容器中的液体,所述部件被浸没在所述液体中以从所述部件吸取热量;至少一个热交换器,所述至少一个热交换器具有与所述液体接触并且布置成从所述液体吸取热量的表面,
其中,在所述热交换器与所述部件之间存在用于引导并且分隔由所述液体中的温差引起的所述液体在所述容器中的竖直循环的竖直壁。
2.根据权利要求1所述的装置,其中,所述部件安装在多个片状板上,所述板以彼此平行的方式竖直地安装在所述容器中并且垂直于所述壁。
3.根据权利要求1或2所述的装置,其中,在所述壁的下边缘与所述容器的底部之间设置有第一空间,并且在所述壁的上边缘与所述容器的上壁之间设置有第二空间,以允许所述液体循环通过。
4.根据权利要求1、2或3所述的装置,其中,所述冷却液体是介电流体,例如油。
5.根据前述权利要求中任一项所述的装置,其中,所述热交换器是具有导管的散热器型热交换器,例如水或空气的冷却流体流过所述导管。
6.根据前述权利要求1至4中任一项所述的装置,其中,所述热交换器是散热式热交换器,包括在与所述液体接触的所述表面的另一侧延伸的冷却片。
7.根据前述权利要求中任一项所述的装置,其中,在所述装置的水平截面中看,所述部件以对称配置被设置在所述热交换器及竖直壁之间。
8.根据前述权利要求中任一项所述的装置,其中,在所述装置的水平截面中看,所述部件以同心配置被设置在所述热交换器及竖直壁之间。
9.根据前述权利要求中任一项所述的装置,其中,多个组的部件被水平间隔开地安装在所述容器中,每个组均被设置在至少两个所述热交换器及竖直壁之间,并且其中,至少一个所述热交换器被设置在至少两个所述壁及组之间。
10.根据前述权利要求中任一项所述的装置,其中,所述竖直壁由绝热材料制成。
11.根据前述权利要求中任一项所述的装置,其中,所述容器的内部容积大于1L、优选地大于50L、更优选地大于1000L。
12.根据前述权利要求中任一项所述的装置,其中,所述容器的顶壁是能够移除的盖件。
13.根据前述权利要求中任一项所述的装置,其中,所述部件是电子部件。
14.根据前述权利要求中任一项所述的装置,其中,在所述装置的水平截面中看,所述部件被设置在至少两个所述热交换器及竖直壁之间。
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GB201619987D0 (en) 2016-11-25 2017-01-11 Iceotope Ltd Fluid cooling system
JP6939034B2 (ja) * 2017-04-05 2021-09-22 富士通株式会社 冷却システム、冷却装置、及び電子システム
CN107690267B (zh) * 2017-09-30 2023-11-28 深圳绿色云图科技有限公司 一种数据中心冷却系统以及数据中心
CN107846822A (zh) * 2017-11-26 2018-03-27 北京中热能源科技有限公司 一种电子设备冷却系统
CN108882652B (zh) * 2018-08-21 2019-07-09 葛俊 高密度服务器的液体浸没冷却机柜、系统及维护方法
US10609839B1 (en) * 2018-09-28 2020-03-31 Liquidcool Solutions, Inc. Liquid submersion cooled electronic systems and devices
JP7295381B2 (ja) * 2019-02-14 2023-06-21 富士通株式会社 冷却装置、冷却システム及び冷却方法
TWI714037B (zh) * 2019-03-26 2020-12-21 緯創資通股份有限公司 用於儲液槽體的氣流產生系統、具有其之浸沒式冷卻設備以及其操作方法
CA3042519C (en) * 2019-05-07 2020-12-22 Stephane Gauthier Cooling a computer processing unit
US10765033B1 (en) * 2019-05-23 2020-09-01 Microsoft Technology Licensing, Llc Immersion cooling enclosures with insulating liners
US10939581B1 (en) * 2020-01-15 2021-03-02 Quanta Computer Inc. Immersion liquid cooling rack
CN113721718B (zh) * 2020-05-26 2024-06-25 富联精密电子(天津)有限公司 散热装置及服务器
US11392184B2 (en) * 2020-09-25 2022-07-19 Microsoft Technology Licensing, Llc Disaggregated computer systems
CN112051912B (zh) * 2020-09-30 2022-10-21 兰洋(宁波)科技有限公司 单相浸没式液态换热系统与换热方法
AU2022209683A1 (en) 2021-01-21 2023-08-03 Stem Technologies Ixora Holding B.V. Immersive cooling unit for cooling electronic components and method of using the same
NL2027361B9 (en) 2021-01-21 2022-09-12 Stem Tech | Ixora Holding B V Immersive cooling unit for cooling electronic components and method of using the same
EP4068926A1 (en) * 2021-04-01 2022-10-05 Ovh Hybrid immersion cooling system for rack-mounted electronic assemblies
EP4068930B1 (en) 2021-04-01 2024-03-13 Ovh A rack system for housing an electronic device
EP4093170A1 (en) * 2021-05-17 2022-11-23 Cgg Services Sas Methods and systems for fluid immersion cooling
CN114340332B (zh) * 2021-12-14 2023-08-29 深圳富联富桂精密工业有限公司 浸没式冷却系统
WO2023241824A1 (en) * 2022-06-13 2023-12-21 Eaton Intelligent Power Limited Passive cooling apparatus for cooling of immersion fluid and power conversion equipment and related systems

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2317686A (en) * 1996-09-26 1998-04-01 Gec Alsthom Ltd Power equipment for use underwater
CN1655666A (zh) * 2004-02-10 2005-08-17 日立电线株式会社 液体循环式冷却装置
CN102625639A (zh) * 2012-03-21 2012-08-01 华为技术有限公司 电子设备及其散热系统和散热方法
EP2487327A1 (en) * 2011-02-09 2012-08-15 Siemens Aktiengesellschaft Subsea electronic system
EP2846617A1 (en) * 2013-09-09 2015-03-11 ABB Technology Ltd Cooling arrangement for power electronics building blocks

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2886746A (en) * 1956-01-05 1959-05-12 Gen Electric Evaporative cooling system for electrical devices
US3091722A (en) * 1961-06-21 1963-05-28 Sylvania Electric Prod Electronic assembly packaging
US3435283A (en) * 1966-04-28 1969-03-25 Thomson Houston Comp Francaise Thermosyphonic heat exchange device for stabilizing the frequency of cavity resonators
US3512582A (en) * 1968-07-15 1970-05-19 Ibm Immersion cooling system for modularly packaged components
US3626080A (en) * 1969-12-10 1971-12-07 Allis Chalmers Mfg Co Means for circulating liquid coolants
US3828080A (en) * 1972-01-20 1974-08-06 Glaxo Lab Ltd Androstane-17beta-carboxylic acids and processes for the preparation thereof
DE2255646C3 (de) * 1972-11-14 1979-03-08 Danfoss A/S, Nordborg (Daenemark) ölgekühltes elektrisches Gerät
KR860000253B1 (ko) * 1981-04-07 1986-03-21 카다야마 히도하지로 비등 냉각장치(沸騰冷却裝置)
US4928206A (en) * 1988-11-23 1990-05-22 Ncr Corporation Foldable printed circuit board
US6019167A (en) * 1997-12-19 2000-02-01 Nortel Networks Corporation Liquid immersion cooling apparatus for electronic systems operating in thermally uncontrolled environments
DE19812117A1 (de) * 1998-03-19 1999-09-23 Knuerr Mechanik Ag Geräteschrank
ATE356961T1 (de) * 1998-11-02 2007-04-15 Sanyo Electric Co Stirling-vorrichtung
US6154584A (en) * 1999-02-03 2000-11-28 Lan-Hopper Systems, Inc. Optical analyzer with variable attenuators at inputs and outputs
FI108962B (fi) * 1999-08-20 2002-04-30 Nokia Corp Laitekaapin jäähdytysjärjestelmä
GB0518554D0 (en) * 2005-09-12 2005-10-19 Geola Technologies Ltd An image capture system for digital holograms
US20080101779A1 (en) * 2006-10-30 2008-05-01 Chia-Hsiung Wu Heat exchange system
CA2731994C (en) * 2008-08-11 2018-03-06 Green Revolution Cooling, Inc. Liquid submerged, horizontal computer server rack and systems and methods of cooling such a server rack
FR2943488B1 (fr) * 2009-03-23 2011-04-22 Converteam Technology Ltd Module electrique destine a etre immerge dans de l'eau
NO2487326T3 (zh) * 2011-02-09 2018-08-25
KR20150053265A (ko) * 2012-09-07 2015-05-15 데이비드 스미스 지하표면 환경에 설치되는 지열 냉각 전기장치 및 그 사용방법
EP2803813B1 (en) * 2013-05-16 2019-02-27 ABB Schweiz AG A subsea unit with conduction and convection cooling
EP2928275A1 (en) * 2014-04-04 2015-10-07 ABB Technology Ltd Arrangement for cooling components of a subsea electric system
EP2988311B1 (en) * 2014-08-22 2021-04-28 ABB Schweiz AG Pressure compensated subsea electrical system
NL2014466B1 (en) * 2015-03-16 2017-01-13 Nerdalize B V Module for cooling a heat generating component.
JP2018088433A (ja) * 2016-11-28 2018-06-07 富士通株式会社 冷却システム及び電子機器の冷却方法
CN111615291B (zh) * 2019-02-25 2023-04-11 富联精密电子(天津)有限公司 浸没式冷却装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2317686A (en) * 1996-09-26 1998-04-01 Gec Alsthom Ltd Power equipment for use underwater
CN1655666A (zh) * 2004-02-10 2005-08-17 日立电线株式会社 液体循环式冷却装置
EP2487327A1 (en) * 2011-02-09 2012-08-15 Siemens Aktiengesellschaft Subsea electronic system
CN102625639A (zh) * 2012-03-21 2012-08-01 华为技术有限公司 电子设备及其散热系统和散热方法
EP2846617A1 (en) * 2013-09-09 2015-03-11 ABB Technology Ltd Cooling arrangement for power electronics building blocks

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