MX2017002443A - Control de enfriamiento para centros de datos con sistemas de aislamiento de pasillo frio. - Google Patents

Control de enfriamiento para centros de datos con sistemas de aislamiento de pasillo frio.

Info

Publication number
MX2017002443A
MX2017002443A MX2017002443A MX2017002443A MX2017002443A MX 2017002443 A MX2017002443 A MX 2017002443A MX 2017002443 A MX2017002443 A MX 2017002443A MX 2017002443 A MX2017002443 A MX 2017002443A MX 2017002443 A MX2017002443 A MX 2017002443A
Authority
MX
Mexico
Prior art keywords
data centers
cooling control
cold aisle
containment systems
aisle containment
Prior art date
Application number
MX2017002443A
Other languages
English (en)
Other versions
MX365728B (es
Inventor
Shrivastava Saurabh
Ibrahim Mahmoud
Muralidharan Bharathkrishnan
Original Assignee
Panduit Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panduit Corp filed Critical Panduit Corp
Publication of MX2017002443A publication Critical patent/MX2017002443A/es
Publication of MX365728B publication Critical patent/MX365728B/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
    • H05K7/1488—Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20745—Forced ventilation of a gaseous coolant within rooms for removing heat from cabinets, e.g. by air conditioning device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20836—Thermal management, e.g. server temperature control

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Air Conditioning Control Device (AREA)
  • Control Of Temperature (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Las modalidades de la presente invención son concernientes en general con el campo de enfriamiento de centro de datos y manejo de energía. En una modalidad de la presente invención, múltiples POD en un centro de datos son controlados por un controlador vía amortiguadores activos.
MX2017002443A 2014-09-10 2015-09-09 Control de enfriamiento para centros de datos con sistemas de aislamiento de pasillo frio. MX365728B (es)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201462048423P 2014-09-10 2014-09-10
US14/847,711 US9943011B2 (en) 2014-09-10 2015-09-08 Cooling control for data centers with cold aisle containment systems
PCT/US2015/049062 WO2016040407A1 (en) 2014-09-10 2015-09-09 Cooling control for data centers with cold aisle containment systems

Publications (2)

Publication Number Publication Date
MX2017002443A true MX2017002443A (es) 2017-05-23
MX365728B MX365728B (es) 2019-06-12

Family

ID=55438897

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2017002443A MX365728B (es) 2014-09-10 2015-09-09 Control de enfriamiento para centros de datos con sistemas de aislamiento de pasillo frio.

Country Status (5)

Country Link
US (2) US9943011B2 (es)
EP (1) EP3192339B1 (es)
CA (1) CA2960614C (es)
MX (1) MX365728B (es)
WO (1) WO2016040407A1 (es)

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Also Published As

Publication number Publication date
MX365728B (es) 2019-06-12
US20180192548A1 (en) 2018-07-05
CA2960614A1 (en) 2016-03-17
CA2960614C (en) 2020-09-22
EP3192339A1 (en) 2017-07-19
EP3192339B1 (en) 2021-11-03
WO2016040407A1 (en) 2016-03-17
US9943011B2 (en) 2018-04-10
US20160073555A1 (en) 2016-03-10

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