PL2932349T3 - Zanurzeniowy system chłodzenia dla urządzeń - Google Patents

Zanurzeniowy system chłodzenia dla urządzeń

Info

Publication number
PL2932349T3
PL2932349T3 PL13870761T PL13870761T PL2932349T3 PL 2932349 T3 PL2932349 T3 PL 2932349T3 PL 13870761 T PL13870761 T PL 13870761T PL 13870761 T PL13870761 T PL 13870761T PL 2932349 T3 PL2932349 T3 PL 2932349T3
Authority
PL
Poland
Prior art keywords
cooling system
immersion cooling
appliance
appliance immersion
immersion
Prior art date
Application number
PL13870761T
Other languages
English (en)
Inventor
Christopher L. Boyd
James P. Koen
David Christopher Laguna
Thomas R. Turner
Kenneth D. Swinden
Mario Conti Garcia
John Charles Tribou
Original Assignee
Midas Green Technology, Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=51167290&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=PL2932349(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Midas Green Technology, Llc filed Critical Midas Green Technology, Llc
Publication of PL2932349T3 publication Critical patent/PL2932349T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/44—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
PL13870761T 2012-12-14 2013-12-13 Zanurzeniowy system chłodzenia dla urządzeń PL2932349T3 (pl)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201261737200P 2012-12-14 2012-12-14
US201361832211P 2013-06-07 2013-06-07
EP13870761.7A EP2932349B1 (en) 2012-12-14 2013-12-13 Appliance immersion cooling system
PCT/US2013/075126 WO2014109869A1 (en) 2012-12-14 2013-12-13 Appliance immersion cooling system

Publications (1)

Publication Number Publication Date
PL2932349T3 true PL2932349T3 (pl) 2018-02-28

Family

ID=51167290

Family Applications (1)

Application Number Title Priority Date Filing Date
PL13870761T PL2932349T3 (pl) 2012-12-14 2013-12-13 Zanurzeniowy system chłodzenia dla urządzeń

Country Status (9)

Country Link
US (2) US10405457B2 (pl)
EP (1) EP2932349B1 (pl)
JP (1) JP6228228B2 (pl)
ES (1) ES2642774T3 (pl)
MX (1) MX353993B (pl)
PL (1) PL2932349T3 (pl)
RU (1) RU2645721C2 (pl)
SA (1) SA515360586B1 (pl)
WO (1) WO2014109869A1 (pl)

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RU2643173C1 (ru) * 2016-12-30 2018-01-31 Общество с ограниченной ответственностью "НИЦ супер-ЭВМ и нейрокомпьютеров" Иммерсионная система охлаждения для электронных устройств
RU2663213C2 (ru) * 2017-01-27 2018-08-02 Сергей Михайлович Абрамов Устройство для охлаждения изделий электронной техники
JP6939034B2 (ja) 2017-04-05 2021-09-22 富士通株式会社 冷却システム、冷却装置、及び電子システム
WO2019006437A1 (en) * 2017-06-30 2019-01-03 Midas Green Technologies, Llc ENHANCED APPROPER IMMERSION COOLING SYSTEM
CN109757061B (zh) * 2017-11-03 2021-06-11 阿里巴巴集团控股有限公司 冷却机柜及冷却系统
TWI659188B (zh) * 2017-11-22 2019-05-11 英業達股份有限公司 浸入式冷卻設備及其伺服器系統
RU2695089C2 (ru) 2017-12-26 2019-07-19 Общество с ограниченной ответственностью "Научно-Технический Центр ИннТех" Система непосредственного жидкостного охлаждения электронных компонентов
RU2683425C1 (ru) * 2018-02-02 2019-03-28 Общество с ограниченной ответственностью "НИЦ супер-ЭВМ и нейрокомпьютеров" Система теплообмена для жидкостного охлаждения электронных устройств (варианты)
JP7052558B2 (ja) * 2018-05-22 2022-04-12 富士通株式会社 電子装置及びダミーユニット
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RU2692569C1 (ru) * 2019-02-19 2019-06-25 Кирилл Олегович Морозов Система иммерсионного охлаждения серверного оборудования
CN111669935B (zh) * 2019-03-08 2023-01-06 富联精密电子(天津)有限公司 冷却装置及应用所述冷却装置的电子装置冷却系统
EP3731611A1 (en) * 2019-04-24 2020-10-28 Hostkey B.V. Immersion cooling system
US10782751B1 (en) 2019-05-07 2020-09-22 Stephane Gauthier Cooling a computer processing unit
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US10765033B1 (en) * 2019-05-23 2020-09-01 Microsoft Technology Licensing, Llc Immersion cooling enclosures with insulating liners
TWI715074B (zh) * 2019-06-21 2021-01-01 俄羅斯聯邦商塞恩堤芬克泰尼克中心宇太科技有限公司 冷卻電子元件之直液式冷卻系統
EP4011182A1 (en) * 2020-01-23 2022-06-15 Ivan Kirillov Cooling bath for multiprocessor circuit boards
EP4185082A4 (en) * 2020-07-14 2024-08-07 Canaan Creative Co., Ltd. IMMERSION TYPE LIQUID COOLED HEAT DISSIPATION SYSTEM
WO2022019793A1 (en) * 2020-07-20 2022-01-27 Ivan Kirillov Fast flow cooling bath for multiprocessor circuit boards
US20220078942A1 (en) * 2020-09-10 2022-03-10 Scott Douglas Bennett Systems and methods for optimizing flow rates in immersion cooling
USD982145S1 (en) 2020-10-19 2023-03-28 Green Revolution Cooling, Inc. Cooling system enclosure
USD998770S1 (en) 2020-10-19 2023-09-12 Green Revolution Cooling, Inc. Cooling system enclosure
US12389566B2 (en) * 2020-11-12 2025-08-12 Green Revolution Cooling, Inc. Multi-rack immersion cooling distribution system
US11839053B2 (en) * 2021-03-26 2023-12-05 Taiwan Semiconductor Manufacturing Company Ltd. Fluid collecting apparatus, cooling system and method of operating the same
US11696423B2 (en) * 2021-05-06 2023-07-04 Tyco Fire & Security Gmbh Liquid immersion cooling tank with variable flow for high density computer server equipment
EP4349145A4 (en) * 2021-06-04 2025-04-09 L'ecuyer, Charles COOLING SYSTEM
JP7665436B2 (ja) * 2021-06-17 2025-04-21 三菱重工業株式会社 液浸冷却装置及びその制御方法
RU208633U1 (ru) * 2021-07-29 2021-12-28 Алексей Дмитриевич Клементьев Устройство непосредственного жидкостного охлаждения изделий вычислительной техники
US12010820B2 (en) * 2021-09-15 2024-06-11 Modine LLC Liquid immersion cooling platform and components thereof
US11805624B2 (en) 2021-09-17 2023-10-31 Green Revolution Cooling, Inc. Coolant shroud
US12317450B1 (en) 2021-11-08 2025-05-27 Rhodium Technologies LLC Fluid circulation systems and methods for cooling having a collector
US11991857B2 (en) * 2021-11-22 2024-05-21 Google Llc Modular liquid cooling architecture for liquid cooling
CN114096133B (zh) * 2021-12-22 2024-10-29 北京字节跳动网络技术有限公司 浸没式液冷装置及液冷系统
US12167569B2 (en) * 2022-01-11 2024-12-10 Davinci 3.0 Incorporated Mobile high performance computing platform for cryptocurrency mining
US20230247795A1 (en) 2022-01-28 2023-08-03 The Research Foundation For The State University Of New York Regenerative preheater for phase change cooling applications
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US20230389225A1 (en) * 2022-05-31 2023-11-30 Rykor Energy Solutions, LLC Mobile data center platform with immersion cooling
CN115474406A (zh) * 2022-09-14 2022-12-13 英业达科技有限公司 浸没式液冷装置
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CN115568172A (zh) * 2022-09-23 2023-01-03 东莞立讯技术有限公司 浸没式机柜及其散热系统
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AU2023377813A1 (en) * 2022-11-10 2025-06-26 Firmus Metal Technologies Singapore Pte Ltd Systems for cooling of computing devices using liquid immersion
WO2024138266A1 (en) * 2022-12-29 2024-07-04 Rosseau Group International Inc. Immersion cooling for electronic devices
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CN116761381A (zh) * 2023-04-12 2023-09-15 杭州大热若寒科技有限责任公司 集装箱式单向浸没液冷系统
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TWI860077B (zh) * 2023-09-04 2024-10-21 緯創資通股份有限公司 二循環浸潤式散熱系統及散熱組件
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Also Published As

Publication number Publication date
JP6228228B2 (ja) 2017-11-08
US10820446B2 (en) 2020-10-27
ES2642774T3 (es) 2017-11-20
EP2932349A1 (en) 2015-10-21
MX353993B (es) 2018-02-07
US10405457B2 (en) 2019-09-03
US20150181762A1 (en) 2015-06-25
RU2015128279A (ru) 2017-01-18
JP2016509278A (ja) 2016-03-24
US20190200482A1 (en) 2019-06-27
EP2932349A4 (en) 2016-11-02
EP2932349B1 (en) 2017-08-30
WO2014109869A1 (en) 2014-07-17
MX2015007601A (es) 2016-03-21
RU2645721C2 (ru) 2018-02-28
SA515360586B1 (ar) 2018-08-16

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