MX2025003192A - Metodo de produccion de componente electronico y componente electronico - Google Patents
Metodo de produccion de componente electronico y componente electronicoInfo
- Publication number
- MX2025003192A MX2025003192A MX2025003192A MX2025003192A MX2025003192A MX 2025003192 A MX2025003192 A MX 2025003192A MX 2025003192 A MX2025003192 A MX 2025003192A MX 2025003192 A MX2025003192 A MX 2025003192A MX 2025003192 A MX2025003192 A MX 2025003192A
- Authority
- MX
- Mexico
- Prior art keywords
- electronic component
- production method
- curable composition
- composition layer
- circuit board
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/25—Constructional features of resonators using surface acoustic waves
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/60—Seals
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022164725 | 2022-10-13 | ||
| PCT/JP2023/037079 WO2024080335A1 (ja) | 2022-10-13 | 2023-10-12 | 電子部品の製造方法、及び電子部品 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MX2025003192A true MX2025003192A (es) | 2025-05-02 |
Family
ID=90669765
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MX2025003192A MX2025003192A (es) | 2022-10-13 | 2025-03-19 | Metodo de produccion de componente electronico y componente electronico |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JPWO2024080335A1 (https=) |
| KR (1) | KR20250088420A (https=) |
| CN (1) | CN119452470A (https=) |
| MX (1) | MX2025003192A (https=) |
| TW (1) | TW202437475A (https=) |
| WO (1) | WO2024080335A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4179038B2 (ja) * | 2002-06-03 | 2008-11-12 | 株式会社村田製作所 | 表面弾性波装置 |
| JP2010278971A (ja) | 2009-06-01 | 2010-12-09 | Murata Mfg Co Ltd | 弾性波装置 |
| WO2014050688A1 (ja) * | 2012-09-27 | 2014-04-03 | 積水化学工業株式会社 | インクジェット用硬化性組成物及び電子部品の製造方法 |
| US10333493B2 (en) * | 2016-08-25 | 2019-06-25 | General Electric Company | Embedded RF filter package structure and method of manufacturing thereof |
| MX2023009977A (es) * | 2021-03-26 | 2023-09-06 | Sekisui Chemical Co Ltd | Adhesivo de inyeccion de tinta, metodo para producir un componente electronico y componente electronico. |
-
2023
- 2023-10-12 CN CN202380053289.0A patent/CN119452470A/zh active Pending
- 2023-10-12 KR KR1020247042489A patent/KR20250088420A/ko active Pending
- 2023-10-12 JP JP2024551752A patent/JPWO2024080335A1/ja active Pending
- 2023-10-12 WO PCT/JP2023/037079 patent/WO2024080335A1/ja not_active Ceased
- 2023-10-13 TW TW112139123A patent/TW202437475A/zh unknown
-
2025
- 2025-03-19 MX MX2025003192A patent/MX2025003192A/es unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2024080335A1 (https=) | 2024-04-18 |
| CN119452470A (zh) | 2025-02-14 |
| KR20250088420A (ko) | 2025-06-17 |
| TW202437475A (zh) | 2024-09-16 |
| WO2024080335A1 (ja) | 2024-04-18 |
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