TW202437475A - 電子零件之製造方法、及電子零件 - Google Patents

電子零件之製造方法、及電子零件 Download PDF

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Publication number
TW202437475A
TW202437475A TW112139123A TW112139123A TW202437475A TW 202437475 A TW202437475 A TW 202437475A TW 112139123 A TW112139123 A TW 112139123A TW 112139123 A TW112139123 A TW 112139123A TW 202437475 A TW202437475 A TW 202437475A
Authority
TW
Taiwan
Prior art keywords
electronic component
curable composition
connecting portion
layer
manufacturing
Prior art date
Application number
TW112139123A
Other languages
English (en)
Chinese (zh)
Inventor
杉沢佳史
渡邉貴志
谷川満
長野翔
Original Assignee
日商積水化學工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商積水化學工業股份有限公司 filed Critical 日商積水化學工業股份有限公司
Publication of TW202437475A publication Critical patent/TW202437475A/zh

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/25—Constructional features of resonators using surface acoustic waves
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
TW112139123A 2022-10-13 2023-10-13 電子零件之製造方法、及電子零件 TW202437475A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-164725 2022-10-13
JP2022164725 2022-10-13

Publications (1)

Publication Number Publication Date
TW202437475A true TW202437475A (zh) 2024-09-16

Family

ID=90669765

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112139123A TW202437475A (zh) 2022-10-13 2023-10-13 電子零件之製造方法、及電子零件

Country Status (6)

Country Link
JP (1) JPWO2024080335A1 (https=)
KR (1) KR20250088420A (https=)
CN (1) CN119452470A (https=)
MX (1) MX2025003192A (https=)
TW (1) TW202437475A (https=)
WO (1) WO2024080335A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4179038B2 (ja) * 2002-06-03 2008-11-12 株式会社村田製作所 表面弾性波装置
JP2010278971A (ja) 2009-06-01 2010-12-09 Murata Mfg Co Ltd 弾性波装置
WO2014050688A1 (ja) * 2012-09-27 2014-04-03 積水化学工業株式会社 インクジェット用硬化性組成物及び電子部品の製造方法
US10333493B2 (en) * 2016-08-25 2019-06-25 General Electric Company Embedded RF filter package structure and method of manufacturing thereof
MX2023009977A (es) * 2021-03-26 2023-09-06 Sekisui Chemical Co Ltd Adhesivo de inyeccion de tinta, metodo para producir un componente electronico y componente electronico.

Also Published As

Publication number Publication date
JPWO2024080335A1 (https=) 2024-04-18
CN119452470A (zh) 2025-02-14
KR20250088420A (ko) 2025-06-17
MX2025003192A (es) 2025-05-02
WO2024080335A1 (ja) 2024-04-18

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