CN119452470A - 电子部件的制造方法和电子部件 - Google Patents

电子部件的制造方法和电子部件 Download PDF

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Publication number
CN119452470A
CN119452470A CN202380053289.0A CN202380053289A CN119452470A CN 119452470 A CN119452470 A CN 119452470A CN 202380053289 A CN202380053289 A CN 202380053289A CN 119452470 A CN119452470 A CN 119452470A
Authority
CN
China
Prior art keywords
electronic component
curable composition
adhesive portion
composition layer
compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380053289.0A
Other languages
English (en)
Chinese (zh)
Inventor
杉泽佳史
渡边贵志
谷川满
长野翔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of CN119452470A publication Critical patent/CN119452470A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/25—Constructional features of resonators using surface acoustic waves
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
CN202380053289.0A 2022-10-13 2023-10-12 电子部件的制造方法和电子部件 Pending CN119452470A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022-164725 2022-10-13
JP2022164725 2022-10-13
PCT/JP2023/037079 WO2024080335A1 (ja) 2022-10-13 2023-10-12 電子部品の製造方法、及び電子部品

Publications (1)

Publication Number Publication Date
CN119452470A true CN119452470A (zh) 2025-02-14

Family

ID=90669765

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380053289.0A Pending CN119452470A (zh) 2022-10-13 2023-10-12 电子部件的制造方法和电子部件

Country Status (6)

Country Link
JP (1) JPWO2024080335A1 (https=)
KR (1) KR20250088420A (https=)
CN (1) CN119452470A (https=)
MX (1) MX2025003192A (https=)
TW (1) TW202437475A (https=)
WO (1) WO2024080335A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4179038B2 (ja) * 2002-06-03 2008-11-12 株式会社村田製作所 表面弾性波装置
JP2010278971A (ja) 2009-06-01 2010-12-09 Murata Mfg Co Ltd 弾性波装置
WO2014050688A1 (ja) * 2012-09-27 2014-04-03 積水化学工業株式会社 インクジェット用硬化性組成物及び電子部品の製造方法
US10333493B2 (en) * 2016-08-25 2019-06-25 General Electric Company Embedded RF filter package structure and method of manufacturing thereof
MX2023009977A (es) * 2021-03-26 2023-09-06 Sekisui Chemical Co Ltd Adhesivo de inyeccion de tinta, metodo para producir un componente electronico y componente electronico.

Also Published As

Publication number Publication date
JPWO2024080335A1 (https=) 2024-04-18
KR20250088420A (ko) 2025-06-17
MX2025003192A (es) 2025-05-02
TW202437475A (zh) 2024-09-16
WO2024080335A1 (ja) 2024-04-18

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