MX2022014325A - Instalacion para unir conjuntos electronicos. - Google Patents
Instalacion para unir conjuntos electronicos.Info
- Publication number
- MX2022014325A MX2022014325A MX2022014325A MX2022014325A MX2022014325A MX 2022014325 A MX2022014325 A MX 2022014325A MX 2022014325 A MX2022014325 A MX 2022014325A MX 2022014325 A MX2022014325 A MX 2022014325A MX 2022014325 A MX2022014325 A MX 2022014325A
- Authority
- MX
- Mexico
- Prior art keywords
- module
- electronic assemblies
- soldering
- sintering
- heat source
- Prior art date
Links
- 230000000712 assembly Effects 0.000 title abstract 6
- 238000000429 assembly Methods 0.000 title abstract 6
- 238000005245 sintering Methods 0.000 abstract 5
- 238000005476 soldering Methods 0.000 abstract 5
- 238000001816 cooling Methods 0.000 abstract 4
- 238000000034 method Methods 0.000 abstract 2
- 238000010438 heat treatment Methods 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
- 238000007711 solidification Methods 0.000 abstract 1
- 230000008023 solidification Effects 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/085—Cooling, heat sink or heat shielding means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/003—Apparatus, e.g. furnaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/703—Cooling arrangements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/38—Selection of media, e.g. special atmospheres for surrounding the working area
- B23K35/383—Selection of media, e.g. special atmospheres for surrounding the working area mainly containing noble gases or nitrogen
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
La invención se refiere a una instalación (10) para unir conjuntos electrónicos (12), en particular a una instalación de soldadura y/o de sinterización (10a), con un dispositivo de transporte para transportar los conjuntos electrónicos (12) por la instalación (10), que comprende varios módulos (16) separables de manera hermética al gas para unir los conjuntos electrónicos (12) entre sí, estando configurado al menos un módulo (16) como módulo de soldadura y/o de sinterización (18) y un módulo (16) como módulo de refrigeración (20). La invención se caracteriza por que entre el módulo de soldadura o de sinterización (18) y el módulo de refrigeración (20) está dispuesto otro módulo (16) que está configurado como módulo de refrigeración suave (22) para el enfriamiento entre una temperatura de proceso del módulo de soldadura o de sinterización (18) y una temperatura intermedia, en particular inferior a una temperatura de solidificación del material de soldadura. En un aspecto secundario se propone disponer en un módulo (16), configurado, en particular, como módulo de soldadura o de sinterización (18), en una cámara de proceso (52) con cierre hermético al gas, en particular en el módulo de refrigeración suave (22), al menos una fuente de calor (50) que se pueda poner en contacto con los conjuntos electrónicos (12) para calentar los conjuntos electrónicos (12) y al menos una trampa fría (46) que en funcionamiento presente una temperatura superficial inferior a una temperatura de funcionamiento de la fuente de calor (50). (Figura 1).
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102020113320 | 2020-05-15 | ||
| DE102020119527 | 2020-07-23 | ||
| PCT/EP2021/062871 WO2021229073A1 (de) | 2020-05-15 | 2021-05-14 | Anlage zum verbinden von elektronischen baugruppen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MX2022014325A true MX2022014325A (es) | 2022-12-08 |
Family
ID=76076317
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MX2022014325A MX2022014325A (es) | 2020-05-15 | 2021-05-14 | Instalacion para unir conjuntos electronicos. |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP4149708B1 (es) |
| JP (1) | JP7486234B2 (es) |
| KR (1) | KR102572094B1 (es) |
| CN (1) | CN115605310A (es) |
| MX (1) | MX2022014325A (es) |
| WO (1) | WO2021229073A1 (es) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4032648A1 (en) * | 2021-01-25 | 2022-07-27 | Infineon Technologies AG | Arrangement for forming a connection |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0714353Y2 (ja) * | 1988-07-08 | 1995-04-05 | 中外炉工業株式会社 | ローラハース型熱処理炉 |
| DE3843191C2 (de) * | 1988-12-22 | 1994-09-15 | Broadcast Television Syst | Vorrichtung zum Löten |
| DE4032328A1 (de) * | 1989-11-06 | 1991-09-19 | Wls Karl Heinz Grasmann Weichl | Verfahren und vorrichtung zur verarbeitung von zu verloetenden fuegepartnern |
| JP3924668B2 (ja) | 1999-03-01 | 2007-06-06 | 光洋サーモシステム株式会社 | リフロー装置 |
| DE19953654A1 (de) * | 1999-11-08 | 2001-05-23 | Pink Gmbh Vakuumtechnik | Verfahren und Vorrichtung zur Herstellung einer Lotverbindung |
| DE10237494B4 (de) | 2002-08-16 | 2005-08-18 | IBL-Löttechnik GmbH | Verfahren und Vorrichtung für das Löten in der Dampfphase |
| DE102007005345B4 (de) * | 2007-02-02 | 2014-06-18 | Seho Systemtechnik Gmbh | Verfahren zum Reflow-Löten sowie Vorrichtung zur Durchführung des Verfahrens |
| JP5247060B2 (ja) | 2007-04-27 | 2013-07-24 | 株式会社タムラ製作所 | リフロー装置およびフラックスの除去方法 |
| DE102008009510B3 (de) | 2008-02-15 | 2009-07-16 | Danfoss Silicon Power Gmbh | Verfahren zum Niedertemperatur-Drucksintern |
| DE102008021240B4 (de) * | 2008-04-28 | 2012-11-22 | Ersa Gmbh | Vorrichtung zur thermischen Behandlung von Werkstücken und Verfahren zur Bestimmung der thermischen Prozessstabilität in einer solchen Vorrichtung |
| DE202011107022U1 (de) | 2011-10-21 | 2012-04-05 | Asscon Systemtechnik-Elektronik Gmbh | Vorrichtung zum Löten |
| DE102014106631B4 (de) * | 2013-05-10 | 2021-12-02 | Seho Systemtechnik Gmbh | Vorrichtung und Verfahren zum Herstellen von Lötverbindungen |
-
2021
- 2021-05-14 CN CN202180035333.6A patent/CN115605310A/zh active Pending
- 2021-05-14 KR KR1020227040317A patent/KR102572094B1/ko active IP Right Grant
- 2021-05-14 MX MX2022014325A patent/MX2022014325A/es unknown
- 2021-05-14 EP EP21727397.8A patent/EP4149708B1/de active Active
- 2021-05-14 WO PCT/EP2021/062871 patent/WO2021229073A1/de active Application Filing
- 2021-05-14 JP JP2022569040A patent/JP7486234B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2023518120A (ja) | 2023-04-27 |
| EP4149708C0 (de) | 2024-01-10 |
| KR102572094B1 (ko) | 2023-08-30 |
| CN115605310A (zh) | 2023-01-13 |
| US20230191518A1 (en) | 2023-06-22 |
| EP4149708A1 (de) | 2023-03-22 |
| KR20220158868A (ko) | 2022-12-01 |
| EP4149708B1 (de) | 2024-01-10 |
| JP7486234B2 (ja) | 2024-05-17 |
| WO2021229073A1 (de) | 2021-11-18 |
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