MX2020004269A - Composicion que comprende fluidos no newtonianos para revestimientos hidrofobicos, oleofobicos, y oleofilicos, y metodos para sus usos. - Google Patents

Composicion que comprende fluidos no newtonianos para revestimientos hidrofobicos, oleofobicos, y oleofilicos, y metodos para sus usos.

Info

Publication number
MX2020004269A
MX2020004269A MX2020004269A MX2020004269A MX2020004269A MX 2020004269 A MX2020004269 A MX 2020004269A MX 2020004269 A MX2020004269 A MX 2020004269A MX 2020004269 A MX2020004269 A MX 2020004269A MX 2020004269 A MX2020004269 A MX 2020004269A
Authority
MX
Mexico
Prior art keywords
oleophobic
hydrophobic
composition
methods
same
Prior art date
Application number
MX2020004269A
Other languages
English (en)
Inventor
Syed Taymur Ahmad
Justin Kleingartner
Sruti Balasubramanian
Original Assignee
Syed Taymur Ahmad
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Syed Taymur Ahmad filed Critical Syed Taymur Ahmad
Publication of MX2020004269A publication Critical patent/MX2020004269A/es

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/346—Clay
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/02—Homopolymers or copolymers of hydrocarbons
    • C08L25/04—Homopolymers or copolymers of styrene
    • C08L25/08—Copolymers of styrene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
    • C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L91/00—Compositions of oils, fats or waxes; Compositions of derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D1/00—Coating compositions, e.g. paints, varnishes or lacquers, based on inorganic substances
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/20—Diluents or solvents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/46—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes silicones
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0162—Silicon containing polymer, e.g. silicone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Dispersion Chemistry (AREA)
  • Paints Or Removers (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

Se describe una composición para formar un recubrimiento protector en un dispositivo electrónico que tiene la forma de un fluido no-Newtoniano que exhibe propiedades tanto viscosas como elásticas, y que forma al menos un recubrimiento que es hidrofóbico, oleofóbico, u oleofílico. Las propiedades viscosas y elásticas asociadas con el fluido no-Newtoniano permiten que la composición se redistribuya después de aplicarse como un recubrimiento a un dispositivo electrónico. También se describen métodos para proteger un dispositivo electrónico de contaminantes líquidos mediante la aplicación de la composición descrita y dispositivos electrónicos que comprenden la composición. También se describe un dispositivo electrónico, como una placa de circuito impreso, que tiene una película hecha de la composición.
MX2020004269A 2017-10-26 2018-10-26 Composicion que comprende fluidos no newtonianos para revestimientos hidrofobicos, oleofobicos, y oleofilicos, y metodos para sus usos. MX2020004269A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201762577471P 2017-10-26 2017-10-26
PCT/US2018/057741 WO2019084423A1 (en) 2017-10-26 2018-10-26 COMPOSITION COMPRISING NON-NEWTONIAN FLUIDS FOR HYDROPHOBIC, OLEOPHOBIC AND OLEOPHILIC COATINGS, AND METHODS OF USE THEREOF

Publications (1)

Publication Number Publication Date
MX2020004269A true MX2020004269A (es) 2020-07-29

Family

ID=64607287

Family Applications (1)

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MX2020004269A MX2020004269A (es) 2017-10-26 2018-10-26 Composicion que comprende fluidos no newtonianos para revestimientos hidrofobicos, oleofobicos, y oleofilicos, y metodos para sus usos.

Country Status (9)

Country Link
US (4) US11149150B2 (es)
EP (1) EP3701549A1 (es)
JP (3) JP7104161B2 (es)
KR (1) KR102445179B1 (es)
CN (1) CN111527568B (es)
AU (1) AU2018355524B2 (es)
CA (1) CA3080321C (es)
MX (1) MX2020004269A (es)
WO (1) WO2019084423A1 (es)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MX2020004269A (es) * 2017-10-26 2020-07-29 Syed Taymur Ahmad Composicion que comprende fluidos no newtonianos para revestimientos hidrofobicos, oleofobicos, y oleofilicos, y metodos para sus usos.
US11302594B2 (en) * 2020-01-09 2022-04-12 Advanced Semiconductor Engineering, Inc. Semiconductor package and method of manufacturing the same
CN111205693A (zh) * 2020-02-20 2020-05-29 重庆市城投路桥管理有限公司 桥梁用防腐底漆及其制备方法
CN112080204B (zh) * 2020-09-15 2021-09-17 宁波太尔炊具有限公司 一种抗菌耐磨复合不粘锅涂层及其制备方法

Family Cites Families (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3652333A (en) * 1970-02-02 1972-03-28 Gen Dynamics Corp Encapsulating composition for electronic circuit boards and process for applying same
US4818784A (en) * 1986-04-28 1989-04-04 Nippondenso Co., Ltd. Insulating coating layer for electronic circuit board, insulating coating material for electronic circuit board, and method for forming insulating coating layer for electronic circuit board
US4728578A (en) 1986-08-13 1988-03-01 The Lubrizol Corporation Compositions containing basic metal salts and/or non-Newtonian colloidal disperse systems and vinyl aromatic containing polymers
US4803100A (en) * 1987-10-21 1989-02-07 International Business Machines Corporation Suspension and use thereof
US5108799A (en) 1988-07-14 1992-04-28 Union Carbide Chemicals & Plastics Technology Corporation Liquid spray application of coatings with supercritical fluids as diluents and spraying from an orifice
US5103812A (en) 1988-10-12 1992-04-14 Rochal Industries, Inc. Conformable bandage and coating material
FR2658828A1 (fr) * 1990-02-27 1991-08-30 Rhone Poulenc Chimie Composition organopolysiloxane a fonction cetiminoxy durcissable en elastomere sans catalyseur organometallique.
JP3280683B2 (ja) * 1991-01-14 2002-05-13 ジーイー東芝シリコーン株式会社 アノードキャップ用シリコーングリース
JPH09283956A (ja) * 1996-04-19 1997-10-31 Fujitsu General Ltd 回路基板の放熱構造
JPH1010741A (ja) * 1996-06-27 1998-01-16 Dow Corning Asia Kk 紫外線硬化性ポリシロキサン組成物およびこれを用いた硬化物パターンの製造方法
JPH11207470A (ja) * 1998-01-22 1999-08-03 Toshiba Battery Co Ltd 電池とリード材の溶接構造体およびその製造方法
JP3502778B2 (ja) * 1998-12-22 2004-03-02 Ｎｅｃトーキン富山株式会社 固体電解コンデンサ製造方法及び導電性高分子固体電解コンデンサ
CA2280519A1 (en) * 1999-08-20 2001-02-20 Csl Silicones Inc. One-part organopolysiloxane rubber composition for use as a corrosion protection coating
JP2003226753A (ja) * 2002-02-01 2003-08-12 Kansai Research Institute 熱可塑性ポリフェニルシルセスキオキサンおよびそれを用いた高分子量ポリフェニルシルセスキオキサンの製造方法
GB0328236D0 (en) * 2003-12-05 2004-01-07 Dow Corning Method of making kaolin containing silicone rubber compositions
JP4647321B2 (ja) * 2005-01-31 2011-03-09 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 室温硬化性ポリオルガノシロキサン組成物
FR2889850B1 (fr) * 2005-08-19 2007-11-02 Rhodia Chimie Sa Revetement silicone de faible constante dielectrique, procede de preparation et application aux circuits integres
US8258206B2 (en) * 2006-01-30 2012-09-04 Ashland Licensing And Intellectual Property, Llc Hydrophobic coating compositions for drag reduction
CN101395495B (zh) * 2006-02-01 2011-12-28 瓦里奥普蒂克公司 光学电润湿设备
KR100866575B1 (ko) * 2006-10-17 2008-11-03 삼성전기주식회사 실리콘 화합물을 이용한 인쇄회로기판의 커버레이 형성방법
JP2009051876A (ja) * 2007-08-23 2009-03-12 Three M Innovative Properties Co コーティング組成物及びそれを使用した物品
JP2009070722A (ja) * 2007-09-14 2009-04-02 Fujifilm Corp 絶縁膜形成用組成物および電子デバイス
US8017183B2 (en) * 2007-09-26 2011-09-13 Eastman Kodak Company Organosiloxane materials for selective area deposition of inorganic materials
JP2009215344A (ja) * 2008-03-07 2009-09-24 Central Glass Co Ltd 熱硬化性有機無機ハイブリッド透明材料
KR100997185B1 (ko) * 2008-09-17 2010-11-29 삼성전기주식회사 인쇄회로기판 수지의 표면 처리 방법 및 상기 방법에 의해처리된 인쇄회로기판 수지
JP5782673B2 (ja) * 2009-11-10 2015-09-24 株式会社エム光・エネルギー開発研究所 透明光酸化層薄膜形成方法
JP5704168B2 (ja) * 2010-05-18 2015-04-22 Jnc株式会社 新規有機ケイ素化合物、該有機ケイ素化合物を含む熱硬化性樹脂組成物、硬化樹脂および光半導体用封止材料
US10106598B2 (en) * 2010-12-01 2018-10-23 Merck Sharp & Dohme Corp. Surface, anchored Fc-bait antibody display system
EP2678400A4 (en) * 2011-02-21 2015-11-18 Ross Technology Corp SUPERHYDROPHOBIC AND OIL-REPELLENT COATINGS WITH BINDING SYSTEMS WITH A LOW CONTENT OF VOLATILE ORGANIC COMPOUNDS
WO2013118752A1 (ja) * 2012-02-10 2013-08-15 三菱樹脂株式会社 カバーレイフィルム、発光素子搭載用基板、及び光源装置
EP2937375B1 (en) * 2012-12-20 2020-08-05 Shin-Etsu Chemical Co., Ltd. Novel ethynyl-group-containing organopolysiloxane compound, method for producing straight-chain organopolysiloxane compound containing ethynyl group at both molecular chain ends, method for producing alkoxysilyl-ethynyl-group-terminated organosiloxane polymer, room-temperature-curable composition, and molded article that is cured product of same
CN105683304B (zh) * 2013-10-31 2018-05-22 埃西勒国际通用光学公司 在基材上具有涂层的制品、涂布组合物和涂布方法
WO2015087972A1 (ja) * 2013-12-13 2015-06-18 日産化学工業株式会社 反応性シリコーン化合物を含む重合性組成物及び絶縁膜
US20170274416A1 (en) * 2014-09-02 2017-09-28 Sung Wung YEOM Applying a Coating to a Substrate; Composite Structures formed by Application of a Coating
US20160355691A1 (en) * 2015-06-04 2016-12-08 Thomas Kim Process for protecting an electronic device with a hydrophobic coating
JP6436035B2 (ja) * 2015-09-25 2018-12-12 信越化学工業株式会社 熱軟化性熱伝導性シリコーングリース組成物、熱伝導性被膜の形成方法、放熱構造及びパワーモジュール装置
EP3349551A1 (en) * 2017-01-11 2018-07-18 Mitsubishi Electric R & D Centre Europe B.V. A printed circuit board embedding a power die and a method for manufacturing said printed circuit board
CN106893456A (zh) * 2017-04-05 2017-06-27 潍坊海通新材料科技有限公司 一种高稳定性聚噻吩抗静电涂布液及其制备方法
MX2020004269A (es) * 2017-10-26 2020-07-29 Syed Taymur Ahmad Composicion que comprende fluidos no newtonianos para revestimientos hidrofobicos, oleofobicos, y oleofilicos, y metodos para sus usos.

Also Published As

Publication number Publication date
JP2021501250A (ja) 2021-01-14
US11149150B2 (en) 2021-10-19
AU2018355524A1 (en) 2020-05-28
JP2024113007A (ja) 2024-08-21
CA3080321C (en) 2023-02-14
US11603473B2 (en) 2023-03-14
CA3080321A1 (en) 2019-05-02
JP2022106729A (ja) 2022-07-20
KR20200076717A (ko) 2020-06-29
JP7104161B2 (ja) 2022-07-20
US11603472B2 (en) 2023-03-14
EP3701549A1 (en) 2020-09-02
KR102445179B1 (ko) 2022-09-21
AU2018355524B2 (en) 2020-12-10
US20210380815A1 (en) 2021-12-09
CN111527568B (zh) 2023-03-24
US20230193045A1 (en) 2023-06-22
CN111527568A (zh) 2020-08-11
US20210371669A1 (en) 2021-12-02
WO2019084423A1 (en) 2019-05-02
US20190256715A1 (en) 2019-08-22

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