MX2020002096A - Estructura ecologica de capas multiples para alojar elementos electronicos y metodo de fabricacion relacionado. - Google Patents

Estructura ecologica de capas multiples para alojar elementos electronicos y metodo de fabricacion relacionado.

Info

Publication number
MX2020002096A
MX2020002096A MX2020002096A MX2020002096A MX2020002096A MX 2020002096 A MX2020002096 A MX 2020002096A MX 2020002096 A MX2020002096 A MX 2020002096A MX 2020002096 A MX2020002096 A MX 2020002096A MX 2020002096 A MX2020002096 A MX 2020002096A
Authority
MX
Mexico
Prior art keywords
substrate
manufacture
multilayer structure
related method
ecological
Prior art date
Application number
MX2020002096A
Other languages
English (en)
Spanish (es)
Inventor
Heikkinen Mikko
Heikkinen Tero
KERÃNEN Antti
SÃÃSKI Jarmo
Original Assignee
Tactotek Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tactotek Oy filed Critical Tactotek Oy
Publication of MX2020002096A publication Critical patent/MX2020002096A/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/038—Textiles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • F21Y2115/15—Organic light-emitting diodes [OLED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4632—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Textile Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Laminated Bodies (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • User Interface Of Digital Computer (AREA)
  • Semiconductor Lasers (AREA)
  • Producing Shaped Articles From Materials (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
MX2020002096A 2017-08-25 2018-08-23 Estructura ecologica de capas multiples para alojar elementos electronicos y metodo de fabricacion relacionado. MX2020002096A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/687,157 US10561019B2 (en) 2017-08-25 2017-08-25 Ecological multilayer structure for hosting electronics and related method of manufacture
PCT/FI2018/050600 WO2019038480A1 (en) 2017-08-25 2018-08-23 ECOLOGICAL MULTILAYER STRUCTURE FOR ACCOMMODATING ELECTRONIC COMPONENTS AND METHOD FOR MANUFACTURING THE SAME

Publications (1)

Publication Number Publication Date
MX2020002096A true MX2020002096A (es) 2020-03-24

Family

ID=63524310

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2020002096A MX2020002096A (es) 2017-08-25 2018-08-23 Estructura ecologica de capas multiples para alojar elementos electronicos y metodo de fabricacion relacionado.

Country Status (8)

Country Link
US (3) US10561019B2 (https=)
EP (1) EP3673718A1 (https=)
JP (1) JP7340516B2 (https=)
KR (1) KR102572055B1 (https=)
CN (1) CN111066377B (https=)
MX (1) MX2020002096A (https=)
TW (1) TWI785104B (https=)
WO (1) WO2019038480A1 (https=)

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KR102409393B1 (ko) * 2017-08-14 2022-06-15 삼성전자주식회사 도광판, 백라이트 유닛 및 이를 포함한 홀로그래픽 디스플레이 장치
JP6370519B1 (ja) * 2017-10-28 2018-08-08 ｍｕｉ Ｌａｂ株式会社 操作表示パネル組込物品
CN111556780B (zh) 2018-01-08 2021-08-27 克兹二世怡人合资有限公司 具有电容式触摸交互性的儿童玩具
US12210707B2 (en) 2018-01-08 2025-01-28 Kids Ii Hape Joint Venture Limited Toys with connected play
USD945535S1 (en) 2019-01-07 2022-03-08 Kids Ii Hape Joint Venture Limited Children's play table
US11800641B2 (en) 2019-06-14 2023-10-24 Hutchinson Aeronautique & Industrie Ltée. Composite panel comprising an integrated electrical circuit and manufacturing method thereof
IT201900016313A1 (it) * 2019-09-13 2021-03-13 Martur Italy Srl Pannello multistrato conduttivo per l’abitacolo di veicoli, in particolare autoveicoli
US11437526B2 (en) 2019-12-09 2022-09-06 Amkor Technology Singapore Holding Pte. Ltd. Electronic devices having a sensor and a translucent mold compound and methods of manufacturing electronic devices
US20210188193A1 (en) * 2019-12-24 2021-06-24 Inteva Products, Llc Vehicle interior trim part formed with intergrated electronics and method of making
WO2021211768A1 (en) * 2020-04-15 2021-10-21 Shanghai Yanfeng Jinqiao Automotive Trim Systems Co. Ltd. Vehicle interior component
US20230311804A1 (en) * 2020-04-15 2023-10-05 Shanghai Yanfeng Jinqiao Automotive Trim Systems Co. Ltd. Component for vehicle interior
CN111897454A (zh) * 2020-07-24 2020-11-06 业成科技（成都）有限公司 发光组件及其制作方法、电子装置
AU2021321929B2 (en) * 2020-08-05 2023-05-25 Smartflex Technology Pte Ltd Smart cards having LED and methods for fabrication thereof
USD979656S1 (en) 2020-12-11 2023-02-28 Kids Ii Hape Joint Venture Limited Toy drum
CN114725071A (zh) * 2021-01-06 2022-07-08 群创光电股份有限公司 电子装置
USD985677S1 (en) 2021-01-11 2023-05-09 Kids Ii Hape Joint Venture Limited Toy guitar
USD985676S1 (en) 2021-01-11 2023-05-09 Kids Ii Hape Joint Venture Limited Toy drum
US11719898B2 (en) * 2021-03-03 2023-08-08 Marvell Asia Pte Ltd. Methods for co-packaging optical modules on switch package substrate
EP4081005A1 (en) 2021-04-23 2022-10-26 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier
DE102021112435A1 (de) * 2021-05-12 2022-11-17 Homag Gmbh Verfahren zum Herstellen eines Möbel- oder Bauelements
KR102394587B1 (ko) * 2021-07-19 2022-05-06 인탑스 주식회사 다중 ime 구조 및 그 제조 방법
US11598911B1 (en) * 2021-08-31 2023-03-07 Arista Networks, Inc. Transporting light within circuit board profile
DE102021124300B3 (de) 2021-09-20 2022-10-27 Ofs - Beteiligungs - Gmbh Holding Elektronisches Bauelement aus pflanzlichem Material
CZ2022431A3 (cs) * 2022-10-12 2023-06-21 Západočeská Univerzita V Plzni Způsob elektrického kontaktování a zapouzdření elektronické komponenty na textilním substrátu chytré textilie, pouzdro pro provádění způsobu, a sestava pouzdra a textilního substrátu
WO2024118844A1 (en) 2022-11-30 2024-06-06 Yanfeng International Automotive Technology Co., Ltd. Component for vehicle interior
US20240349424A1 (en) * 2023-02-16 2024-10-17 John Simonetti Method and system for providing illuminating objects within substrate
WO2024180525A1 (en) * 2023-03-02 2024-09-06 Centitvc - Centro De Nanotecnologia E Materiais Tecnicos Funcionais E Inteligentes Sensoring wood base product, method for production and uses thereof
JP2025007333A (ja) * 2023-06-30 2025-01-17 新東工業株式会社 呼び出しシステム
CN121889759A (zh) * 2023-08-02 2026-04-17 雷蛇(亚太)私人有限公司 触控模组
FI20236158A1 (en) * 2023-10-18 2025-04-19 Teknologian Tutkimuskeskus Vtt Oy Laminate and its manufacturing method
FR3163524A1 (fr) * 2024-06-14 2025-12-19 Neophoria Materiau fonctionalisé comportant un circuit électronique imprimé sur cuir et encapsulé, son procédé de fabrication et article comportant un tel matériau

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JP6209874B2 (ja) * 2012-08-31 2017-10-11 日亜化学工業株式会社 発光装置及びその製造方法
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KR20190133289A (ko) 2015-09-28 2019-12-02 택토텍 오와이 다층 구조체 및 관련 전자 제품의 제조 방법
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Also Published As

Publication number Publication date
WO2019038480A1 (en) 2019-02-28
JP2020532125A (ja) 2020-11-05
JP7340516B2 (ja) 2023-09-07
TW201927085A (zh) 2019-07-01
US20210007222A1 (en) 2021-01-07
EP3673718A1 (en) 2020-07-01
CN111066377A (zh) 2020-04-24
US10827609B2 (en) 2020-11-03
KR102572055B1 (ko) 2023-08-29
US20190069403A1 (en) 2019-02-28
KR20200044029A (ko) 2020-04-28
US20200120793A1 (en) 2020-04-16
CN111066377B (zh) 2024-01-19
US10561019B2 (en) 2020-02-11
TWI785104B (zh) 2022-12-01

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