MX2018015564A - Blindaje semiconductor sin lineas de soldadura y protrusiones. - Google Patents

Blindaje semiconductor sin lineas de soldadura y protrusiones.

Info

Publication number
MX2018015564A
MX2018015564A MX2018015564A MX2018015564A MX2018015564A MX 2018015564 A MX2018015564 A MX 2018015564A MX 2018015564 A MX2018015564 A MX 2018015564A MX 2018015564 A MX2018015564 A MX 2018015564A MX 2018015564 A MX2018015564 A MX 2018015564A
Authority
MX
Mexico
Prior art keywords
protrusions
semiconductive shield
weld lines
polymer
ethylene
Prior art date
Application number
MX2018015564A
Other languages
English (en)
Inventor
Li Wei
Sun Yabin
Chen Hongyu
Song Xiaomei
Wu Youjun
Miao Xiaoxiong
Original Assignee
Dow Global Technologies Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Global Technologies Llc filed Critical Dow Global Technologies Llc
Publication of MX2018015564A publication Critical patent/MX2018015564A/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B9/00—Power cables
    • H01B9/02—Power cables with screens or conductive layers, e.g. for avoiding large potential gradients
    • H01B9/027—Power cables with screens or conductive layers, e.g. for avoiding large potential gradients composed of semi-conducting layers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/08—Copolymers of ethene
    • C08L23/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
    • C08L23/0869—Acids or derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/06—Polyethene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/08—Copolymers of ethene
    • C08L23/0807—Copolymers of ethene with unsaturated hydrocarbons only containing more than three carbon atoms
    • C08L23/0815—Copolymers of ethene with aliphatic 1-olefins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/002—Inhomogeneous material in general
    • H01B3/004—Inhomogeneous material in general with conductive additives or conductive layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/441—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from alkenes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/02—Disposition of insulation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/202—Applications use in electrical or conductive gadgets use in electrical wires or wirecoating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Conductive Materials (AREA)
  • Insulated Conductors (AREA)
  • Sealing Material Composition (AREA)

Abstract

Las capas de blindaje semiconductor para las construcciones de cables eléctricos están hechas de una composición que comprende: (A) Un polímero no polar a base de etileno que tiene una densidad mayor de (>) 0.90 g/cc y un índice de fusión de >20 g/10 min a 190°C/2.16 kg; (B) Un polímero polar que consiste en etileno y un éster alquílico insaturado que tiene de 4 a 20 átomos de carbono; (C) Negro de humo de acetileno; y (D) Un agente de curado; con la condición de que (1) la composición tiene una estructura separada en fases, y (2) la relación en peso del polímero no polar con respecto al polímero polar es de 0.25 a 4.
MX2018015564A 2016-06-30 2016-06-30 Blindaje semiconductor sin lineas de soldadura y protrusiones. MX2018015564A (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2016/087870 WO2018000314A1 (en) 2016-06-30 2016-06-30 Semiconductive shield free of weld lines and protrusions

Publications (1)

Publication Number Publication Date
MX2018015564A true MX2018015564A (es) 2019-11-28

Family

ID=60784945

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2018015564A MX2018015564A (es) 2016-06-30 2016-06-30 Blindaje semiconductor sin lineas de soldadura y protrusiones.

Country Status (10)

Country Link
US (1) US10726976B2 (es)
EP (1) EP3478760B1 (es)
JP (1) JP6960418B2 (es)
KR (1) KR102580573B1 (es)
CN (1) CN109348719B (es)
BR (1) BR112018077213A2 (es)
CA (1) CA3029340C (es)
MX (1) MX2018015564A (es)
TW (1) TWI734792B (es)
WO (1) WO2018000314A1 (es)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110698752A (zh) * 2019-10-08 2020-01-17 深圳市晖耀电线电缆有限公司 一种导电屏蔽膜材料及其制备方法、屏蔽数据线
CN112724500B (zh) * 2020-12-29 2022-08-23 浙江万马高分子材料集团有限公司 一种半导电屏蔽料及其制备方法和应用

Family Cites Families (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE607527A (es) 1960-08-29 1900-01-01
US4150193A (en) * 1977-12-19 1979-04-17 Union Carbide Corporation Insulated electrical conductors
JPH03255143A (ja) * 1990-03-05 1991-11-14 Sumitomo Electric Ind Ltd 半導電性組成物
US5272236A (en) 1991-10-15 1993-12-21 The Dow Chemical Company Elastic substantially linear olefin polymers
US5246783A (en) 1991-08-15 1993-09-21 Exxon Chemical Patents Inc. Electrical devices comprising polymeric insulating or semiconducting members
US5783638A (en) 1991-10-15 1998-07-21 The Dow Chemical Company Elastic substantially linear ethylene polymers
US5278272A (en) 1991-10-15 1994-01-11 The Dow Chemical Company Elastic substantialy linear olefin polymers
JPH11172057A (ja) * 1997-12-15 1999-06-29 Nippon Unicar Co Ltd 水架橋性の良好な半導電性樹脂組成物及びこれを用いて製造した電力ケーブル
US6277303B1 (en) * 1998-07-10 2001-08-21 Pirelli Cable Corporation Conductive polymer composite materials and methods of making same
EP1052654B1 (en) * 1999-05-13 2004-01-28 Union Carbide Chemicals & Plastics Technology Corporation Cable semiconducting shield
US6496629B2 (en) 1999-05-28 2002-12-17 Tycom (Us) Inc. Undersea telecommunications cable
JP2001229732A (ja) 2000-02-15 2001-08-24 Fujikura Ltd 半導電性樹脂組成物
US6455771B1 (en) * 2001-03-08 2002-09-24 Union Carbide Chemicals & Plastics Technology Corporation Semiconducting shield compositions
JP2002313137A (ja) * 2001-04-13 2002-10-25 Yazaki Corp 電力ケーブル用半導電性樹脂組成物
US6714707B2 (en) 2002-01-24 2004-03-30 Alcatel Optical cable housing an optical unit surrounded by a plurality of gel layers
US7504347B2 (en) 2004-03-17 2009-03-17 Dow Global Technologies Inc. Fibers made from copolymers of propylene/α-olefins
US7582716B2 (en) 2004-03-17 2009-09-01 Dow Global Technologies Inc. Compositions of ethylene/α-olefin multi-block interpolymer for blown films with high hot tack
US7579408B2 (en) 2004-03-17 2009-08-25 Dow Global Technologies Inc. Thermoplastic vulcanizate comprising interpolymers of ethylene/α-olefins
US7514517B2 (en) 2004-03-17 2009-04-07 Dow Global Technologies Inc. Anti-blocking compositions comprising interpolymers of ethylene/α-olefins
US7355089B2 (en) 2004-03-17 2008-04-08 Dow Global Technologies Inc. Compositions of ethylene/α-olefin multi-block interpolymer for elastic films and laminates
US7524911B2 (en) 2004-03-17 2009-04-28 Dow Global Technologies Inc. Adhesive and marking compositions made from interpolymers of ethylene/α-olefins
EP1978040B1 (en) 2004-09-10 2015-06-17 Borealis Technology Oy Semiconductive polymer composition
EP1984445B1 (en) * 2006-02-06 2010-08-25 Dow Global Technologies Inc. Semiconductive compositions
EP2016127B1 (en) * 2006-05-02 2010-03-17 Dow Global Technologies Inc. High-density polyethylene compositions, method of making the same, articles made therefrom, and method of making such articles
EP1916673A1 (en) * 2006-10-27 2008-04-30 Borealis Technology Oy Semiconductive polyolefin composition
EP2065900A1 (en) 2007-10-23 2009-06-03 Borealis Technology Oy Semiconductive polymer composition
ATE503797T1 (de) * 2008-05-27 2011-04-15 Borealis Ag Ablösbare halbleitende zusammensetzung mit bei niedriger temperatur schmelzenden polyolefinen
KR101311230B1 (ko) * 2009-03-24 2013-09-24 에스케이종합화학 주식회사 전력케이블용 비 가교 폴리에틸렌 조성물
JP5364502B2 (ja) * 2009-08-28 2013-12-11 昭和電線ケーブルシステム株式会社 電線・ケーブル用半導電性樹脂組成物および電線・ケーブル
US8388868B2 (en) * 2010-02-01 2013-03-05 General Cable Technologies Corporation Vulcanizable copolymer semiconductive shield compositions
EP2577683B1 (en) * 2010-05-27 2018-01-03 Prysmian Cables and Systems USA, LLC Electrical cable with semi-conductive outer layer distinguishable from jacket
CN102532635A (zh) 2010-12-09 2012-07-04 浙江万马高分子材料股份有限公司 超光滑屏蔽材料
JP2012220662A (ja) * 2011-04-07 2012-11-12 Toyobo Co Ltd 視野角向上フィルム及び液晶表示装置
KR102056952B1 (ko) * 2011-05-04 2019-12-17 보레알리스 아게 전기 장치용 중합체 조성물
CN104080853B (zh) 2012-02-16 2017-04-26 博里利斯股份公司 半导电聚合物组合物
EP2832786B8 (en) * 2012-03-26 2017-03-01 Asahi Glass Company, Limited Fluorinated elastomer composition and method for its production, molded product, cross-linked product, and covered electric wire
EP2703445B1 (en) * 2012-08-31 2017-05-17 Borealis AG A conductive jacket
MX359177B (es) * 2012-09-27 2018-09-18 Dow Global Technologies Llc Proceso para la reduccion de la migracion de peroxido en composiciones de polimero a base de etileno reticulable.
JP6322650B2 (ja) * 2012-12-21 2018-05-09 ダウ グローバル テクノロジーズ エルエルシー 収縮を低減しかつ加工性を高めたケーブル外被用ポリオレフィン系化合物
CN105705571B (zh) * 2013-10-30 2018-04-10 日本聚乙烯株式会社 导电性聚乙烯树脂组合物和使用其的成形品与层叠体

Also Published As

Publication number Publication date
US20190156973A1 (en) 2019-05-23
KR102580573B1 (ko) 2023-09-21
JP2019527249A (ja) 2019-09-26
WO2018000314A1 (en) 2018-01-04
CA3029340A1 (en) 2018-01-04
CA3029340C (en) 2023-09-26
TWI734792B (zh) 2021-08-01
EP3478760A4 (en) 2020-02-26
CN109348719B (zh) 2021-12-10
KR20190025628A (ko) 2019-03-11
CN109348719A (zh) 2019-02-15
JP6960418B2 (ja) 2021-11-05
TW201809106A (zh) 2018-03-16
EP3478760A1 (en) 2019-05-08
BR112018077213A2 (pt) 2019-04-09
US10726976B2 (en) 2020-07-28
EP3478760B1 (en) 2021-01-20

Similar Documents

Publication Publication Date Title
MX2018015564A (es) Blindaje semiconductor sin lineas de soldadura y protrusiones.
DE602008005863D1 (de) Ablösbare halbleitende Zusammensetzung mit bei niedriger Temperatur schmelzenden Polyolefinen
GB201306675D0 (en) A composite phase change material
JP2012521632A5 (es)
BR112017025746A2 (pt) isolamento de cabo compreendendo uma mistura de ldpe e polipropileno
MX2015009304A (es) Evoh flexible modificado para peliculas de alto rendimiento.
MX2015000862A (es) Cubierta conductora.
WO2013022206A3 (ko) 가교 폴리에틸렌 조성물
MX364654B (es) Tanque para equipo electrico.
MX2018002459A (es) Aislamiento de cable reticulado flexible y metodos para hacer el aislamiento de cable reticulado flexible.
MX2020002912A (es) Composiciones de polietileno modificado y metodo para elaborarlas.
MX2015009805A (es) Composicion aislante, articulo aislante, metodo de preparacion y accesorio para cables electricos de los mismos.
MX2017010191A (es) Compuestos de poliolefina para recubrimientos de cable.
MX2019004899A (es) Composiciones de revestimiento curadas contra el medio ambiente para cables y accesorios de cables.
PH12018502129A1 (en) Improved resin-rich mica tape
MX2016007940A (es) Una nueva composicion de polimero reticulado, aislamiento del cable de alimentacion y cable de alimentacion.
MX348910B (es) Composición aislante libre de halógenos resistente a la flama y al goteo.
MX2017007122A (es) Composiciones de polimero de polietileno de baja opacidad.
PH12016500977B1 (en) Solvent composition for producing electric device
MX2018011919A (es) Composiciones poliméricas reticulables con barredores de radicales metilo y artículos elaborados de estas.
MY189883A (en) Modified polyethylenes
BR112019005767A2 (pt) filmes tendo propriedades mecânicas desejáveis e artigos feitos dos mesmos
MX2019005240A (es) Composiciones de compuestos de polimeros conductores multifase.
CN105551627A (zh) 一种钼合金高性能电缆
MX2019005087A (es) Composicion con equilibrio de factor de disipacion y aceptacion de aditivos.