MX2017010460A - Proceso y dispositivo para producir patrones metalicos en un substrato para fines decorativos y/o funcionales, fabricacion de objetos que incorporan dicha produccion y conjunto de consumibles utilizados. - Google Patents

Proceso y dispositivo para producir patrones metalicos en un substrato para fines decorativos y/o funcionales, fabricacion de objetos que incorporan dicha produccion y conjunto de consumibles utilizados.

Info

Publication number
MX2017010460A
MX2017010460A MX2017010460A MX2017010460A MX2017010460A MX 2017010460 A MX2017010460 A MX 2017010460A MX 2017010460 A MX2017010460 A MX 2017010460A MX 2017010460 A MX2017010460 A MX 2017010460A MX 2017010460 A MX2017010460 A MX 2017010460A
Authority
MX
Mexico
Prior art keywords
substrate
patterns
metal patterns
optionally
produced
Prior art date
Application number
MX2017010460A
Other languages
English (en)
Inventor
Stremsdoerfer Samuel
Jammes Arnaud
Mourier Des Gayets Edouard
Original Assignee
Jet Metal Tech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jet Metal Tech filed Critical Jet Metal Tech
Publication of MX2017010460A publication Critical patent/MX2017010460A/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1605—Process or apparatus coating on selected surface areas by masking
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1689—After-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
    • C23C18/206—Use of metal other than noble metals and tin, e.g. activation, sensitisation with metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
  • Printing Methods (AREA)
  • Laminated Bodies (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

El objetivo de la invención es proporcionar un proceso para producir patrones metálicos capaces de ser finos, precisos y complejos sobre cualquier tipo de sustrato, que sean fáciles de llevarse a cabo a escala industrial, puedan automatizarse y sean fáciles de implementar. Para este fin, el proceso de acuerdo con la invención se caracteriza porque comprende las siguientes etapas esenciales: A. opcionalmente preparar la superficie del sustrato destinada a recibir los patrones metálicos; B. depositar una protección temporal sobre la superficie del sustrato correspondiente al negativo de los patrones a ser producidos por medio de una máscara/plantilla de serigrafía cuyos recortes corresponden al negativo de los patrones a ser producidos; y/o por impresión directa, preferiblemente por inyección de tinta; C. opcionalmente activar de superficie del substrato, en particular las áreas correspondientes a los patrones a ser producidos; D. metalizar por deposición de al menos un metal en las áreas correspondientes a los patrones a ser producidos; E. eliminar la protección temporal de la etapa B; F. Opcionalmente enjuagar la superficie del sustrato que lleva los patrones metálicos; G. opcionalmente secar la superficie del sustrato que lleva los patrones metálicos; H. opcionalmente aplicar un tratamiento de acabado a la superficie del sustrato que lleva los patrones metálicos; y porque la etapa E de eliminar la protección temporal se realiza durante la etapa D, o al menos parcialmente durante la etapa D, y/o después de la etapa D, o al menos parcialmente durante y/o después de la etapa de metalización D y parcialmente antes de la etapa de metalización D. Los procesos para la producción de objetos decorativos u objetos funcionales tales como circuitos impresos, circuitos integrados, chips RFID, pictogramas de codificación electrónicos legibles por lector, etc. que incorporan esta producción de patrones metálicos, también forman parte de la invención, además de los conjuntos de consumibles utilizados para implementar dicha producción.
MX2017010460A 2015-02-12 2016-02-12 Proceso y dispositivo para producir patrones metalicos en un substrato para fines decorativos y/o funcionales, fabricacion de objetos que incorporan dicha produccion y conjunto de consumibles utilizados. MX2017010460A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1551169A FR3032724B1 (fr) 2015-02-12 2015-02-12 Procede et dispositif de realisation de motifs metalliques sur un substrat a des fins decoratives et/ou fonctionnelles fabrication d'objets integrant cette realisation et ensemble de consommables utilises
PCT/FR2016/050335 WO2016128695A1 (fr) 2015-02-12 2016-02-12 Procédé et dispositif de réalisation de motifs métalliques sur un substrat a des fins décoratives et/ou fonctionnelles fabrication d'objets intégrant cette réalisation et ensemble de consommables utilises

Publications (1)

Publication Number Publication Date
MX2017010460A true MX2017010460A (es) 2018-04-24

Family

ID=53541717

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2017010460A MX2017010460A (es) 2015-02-12 2016-02-12 Proceso y dispositivo para producir patrones metalicos en un substrato para fines decorativos y/o funcionales, fabricacion de objetos que incorporan dicha produccion y conjunto de consumibles utilizados.

Country Status (13)

Country Link
US (1) US11168398B2 (es)
EP (1) EP3256620B1 (es)
JP (1) JP6845146B2 (es)
KR (1) KR102628252B1 (es)
CN (1) CN107250442B (es)
BR (1) BR112017017268B1 (es)
DK (1) DK3256620T3 (es)
ES (1) ES2828691T3 (es)
FR (1) FR3032724B1 (es)
HR (1) HRP20201758T1 (es)
HU (1) HUE051202T2 (es)
MX (1) MX2017010460A (es)
WO (1) WO2016128695A1 (es)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180201010A1 (en) * 2017-01-18 2018-07-19 Microsoft Technology Licensing, Llc Screen printing liquid metal
US10676809B2 (en) * 2018-06-20 2020-06-09 Lockheed Martin Corporation Methods and systems for generating patterns on flexible substrates
DE102019005455A1 (de) * 2019-08-02 2021-02-04 Giesecke+Devrient Currency Technology Gmbh Verfahren zum Herstellen einer elektronischen Vorrichtung
US11905648B2 (en) 2020-01-28 2024-02-20 Noble Biomaterials, Inc. Metalized fabric that dissipates and scatters infrared light and methods or making and using the same
US20210372044A1 (en) * 2020-01-28 2021-12-02 Noble Biomaterials, Inc. Methods for controlling color during a metallization process and resulting products
CN114822992B (zh) * 2022-06-27 2022-09-13 江西理工大学南昌校区 一种电子线路用气溶胶喷涂工艺导电银浆的制备方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT310285B (de) * 1966-02-22 1973-09-25 Photocircuits Corp Verfahren zur Herstellung eines Schichtkörpers für gedruckte Schaltungen
US3514378A (en) * 1967-09-08 1970-05-26 Litton Systems Inc Electro-chemical method of producing thin metal flexures
JPS4817826B1 (es) 1971-05-25 1973-06-01
JPS5050668A (es) 1973-09-06 1975-05-07
JPS5822539B2 (ja) * 1975-04-25 1983-05-10 ソニー株式会社 樹脂成形体の部分的メッキ方法
JPS55158696A (en) 1979-05-30 1980-12-10 Hitachi Ltd Method of fabricating printed board
JPS59129766A (ja) * 1983-01-18 1984-07-26 Sanritsu Kogyo Kk 無電解メツキ法
US4699811A (en) * 1986-09-16 1987-10-13 Macdermid, Incorporated Chromium mask for electroless nickel or copper plating
JPH03123675A (ja) * 1989-10-05 1991-05-27 Kojima Press Co Ltd 樹脂成形体の塗装方法
JPH04136857A (ja) * 1990-09-28 1992-05-11 Hitachi Ltd 光硬化性レジスト組成物およびこれを用いたプリント回路板の製造方法およびプリント回路板
JPH10190216A (ja) * 1996-12-27 1998-07-21 Mitsutsu Kk 銅箔なし基板の製造法および該基板を用いたプリント基板の製造法
FR2763962B1 (fr) * 1997-05-29 1999-10-15 Guy Stremsdoerfer Procede non electrolytique de metallisation d'un substrat par voie de reduction de sel(s) metallique(s) et par projection d'aerosol(s)
US7320942B2 (en) * 2002-05-21 2008-01-22 Applied Materials, Inc. Method for removal of metallic residue after plasma etching of a metal layer
JP3945493B2 (ja) * 2004-04-16 2007-07-18 セイコーエプソン株式会社 半導体装置及びその製造方法
FR2909101B1 (fr) * 2006-11-24 2009-02-27 Samuel Stremsdoerfer Procede non electrolytique prefectionne de metallisation d'un substrat par voie de reduction de sel(s) metallique(s) et par projection d'aerosol(s)
FR2934609B1 (fr) 2008-07-30 2011-07-22 Jet Metal Technologies Procede non eletrolytique de metallisation en ligne de substrats par projection avec traitement de surface prealable et dispositif pour la mise en oeuvre du procede.
FR2934964B1 (fr) 2008-08-12 2010-10-22 Jet Metal Technologies Procede de traitement optophysique de surface de substrats polymere et dispositif pour la mise en oeuvre du procede
JP5472950B2 (ja) * 2012-06-19 2014-04-16 Ｊｅインターナショナル株式会社 マスキング剤および表面処理基材の製造方法

Also Published As

Publication number Publication date
JP2018506648A (ja) 2018-03-08
WO2016128695A1 (fr) 2016-08-18
EP3256620B1 (fr) 2020-08-05
HUE051202T2 (hu) 2021-03-01
BR112017017268A2 (pt) 2018-04-17
FR3032724B1 (fr) 2019-12-13
BR112017017268B1 (pt) 2022-05-03
US20180030599A1 (en) 2018-02-01
HRP20201758T1 (hr) 2021-03-19
FR3032724A1 (fr) 2016-08-19
US11168398B2 (en) 2021-11-09
KR102628252B1 (ko) 2024-01-24
CN107250442B (zh) 2021-03-09
KR20170132132A (ko) 2017-12-01
CN107250442A (zh) 2017-10-13
EP3256620A1 (fr) 2017-12-20
DK3256620T3 (da) 2020-11-02
JP6845146B2 (ja) 2021-03-17
ES2828691T3 (es) 2021-05-27

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