HUE051202T2 - Eljárás fém-minták elõállítására hordozón, dekorációs és/vagy funkcionális célra, tárgyak elõállítása ezzel az eljárással, és alkalmazott felhasználható eszköz készlet - Google Patents

Eljárás fém-minták elõállítására hordozón, dekorációs és/vagy funkcionális célra, tárgyak elõállítása ezzel az eljárással, és alkalmazott felhasználható eszköz készlet

Info

Publication number
HUE051202T2
HUE051202T2 HUE16709990A HUE16709990A HUE051202T2 HU E051202 T2 HUE051202 T2 HU E051202T2 HU E16709990 A HUE16709990 A HU E16709990A HU E16709990 A HUE16709990 A HU E16709990A HU E051202 T2 HUE051202 T2 HU E051202T2
Authority
HU
Hungary
Prior art keywords
decorative
manufacture
substrate
metal patterns
producing metal
Prior art date
Application number
HUE16709990A
Other languages
English (en)
Inventor
Samuel Stremsdoerfer
Arnaud Jammes
Des Gayets Edouard Mourier
Original Assignee
Jet Metal Tech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jet Metal Tech filed Critical Jet Metal Tech
Publication of HUE051202T2 publication Critical patent/HUE051202T2/hu

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1603Process or apparatus coating on selected surface areas
    • C23C18/1605Process or apparatus coating on selected surface areas by masking
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1655Process features
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1689After-treatment
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/1851Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2053Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
    • C23C18/206Use of metal other than noble metals and tin, e.g. activation, sensitisation with metals
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28Sensitising or activating
    • C23C18/30Activating or accelerating or sensitising with palladium or other noble metal
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/42Coating with noble metals
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/38Electroplating: Baths therefor from solutions of copper
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02Electroplating of selected surface areas
    • C25D5/022Electroplating of selected surface areas using masking means
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48After-treatment of electroplated surfaces
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54Electroplating of non-metallic surfaces
    • C25D5/56Electroplating of non-metallic surfaces of plastics

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
  • Printing Methods (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Laminated Bodies (AREA)
HUE16709990A 2015-02-12 2016-02-12 Eljárás fém-minták elõállítására hordozón, dekorációs és/vagy funkcionális célra, tárgyak elõállítása ezzel az eljárással, és alkalmazott felhasználható eszköz készlet HUE051202T2 (hu)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1551169A FR3032724B1 (fr) 2015-02-12 2015-02-12 Procede et dispositif de realisation de motifs metalliques sur un substrat a des fins decoratives et/ou fonctionnelles fabrication d'objets integrant cette realisation et ensemble de consommables utilises

Publications (1)

Publication Number Publication Date
HUE051202T2 true HUE051202T2 (hu) 2021-03-01

Family

ID=53541717

Family Applications (1)

Application Number Title Priority Date Filing Date
HUE16709990A HUE051202T2 (hu) 2015-02-12 2016-02-12 Eljárás fém-minták elõállítására hordozón, dekorációs és/vagy funkcionális célra, tárgyak elõállítása ezzel az eljárással, és alkalmazott felhasználható eszköz készlet

Country Status (13)

Country Link
US (1) US11168398B2 (hu)
EP (1) EP3256620B1 (hu)
JP (1) JP6845146B2 (hu)
KR (1) KR102628252B1 (hu)
CN (1) CN107250442B (hu)
BR (1) BR112017017268B1 (hu)
DK (1) DK3256620T3 (hu)
ES (1) ES2828691T3 (hu)
FR (1) FR3032724B1 (hu)
HR (1) HRP20201758T1 (hu)
HU (1) HUE051202T2 (hu)
MX (1) MX2017010460A (hu)
WO (1) WO2016128695A1 (hu)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180201010A1 (en) * 2017-01-18 2018-07-19 Microsoft Technology Licensing, Llc Screen printing liquid metal
US10676809B2 (en) * 2018-06-20 2020-06-09 Lockheed Martin Corporation Methods and systems for generating patterns on flexible substrates
DE102019005455A1 (de) * 2019-08-02 2021-02-04 Giesecke+Devrient Currency Technology Gmbh Verfahren zum Herstellen einer elektronischen Vorrichtung
US20210372044A1 (en) * 2020-01-28 2021-12-02 Noble Biomaterials, Inc. Methods for controlling color during a metallization process and resulting products
US11905648B2 (en) 2020-01-28 2024-02-20 Noble Biomaterials, Inc. Metalized fabric that dissipates and scatters infrared light and methods or making and using the same
CN114822992B (zh) * 2022-06-27 2022-09-13 江西理工大学南昌校区 一种电子线路用气溶胶喷涂工艺导电银浆的制备方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT310285B (de) * 1966-02-22 1973-09-25 Photocircuits Corp Verfahren zur Herstellung eines Schichtkörpers für gedruckte Schaltungen
US3514378A (en) * 1967-09-08 1970-05-26 Litton Systems Inc Electro-chemical method of producing thin metal flexures
JPS4817826B1 (hu) 1971-05-25 1973-06-01
JPS5050668A (hu) 1973-09-06 1975-05-07
JPS5822539B2 (ja) * 1975-04-25 1983-05-10 ソニー株式会社 樹脂成形体の部分的メッキ方法
JPS55158696A (en) 1979-05-30 1980-12-10 Hitachi Ltd Method of fabricating printed board
JPS59129766A (ja) * 1983-01-18 1984-07-26 Sanritsu Kogyo Kk 無電解メツキ法
US4699811A (en) * 1986-09-16 1987-10-13 Macdermid, Incorporated Chromium mask for electroless nickel or copper plating
JPH03123675A (ja) * 1989-10-05 1991-05-27 Kojima Press Co Ltd 樹脂成形体の塗装方法
JPH04136857A (ja) * 1990-09-28 1992-05-11 Hitachi Ltd 光硬化性レジスト組成物およびこれを用いたプリント回路板の製造方法およびプリント回路板
JPH10190216A (ja) * 1996-12-27 1998-07-21 Mitsutsu Kk 銅箔なし基板の製造法および該基板を用いたプリント基板の製造法
FR2763962B1 (fr) * 1997-05-29 1999-10-15 Guy Stremsdoerfer Procede non electrolytique de metallisation d'un substrat par voie de reduction de sel(s) metallique(s) et par projection d'aerosol(s)
US7320942B2 (en) * 2002-05-21 2008-01-22 Applied Materials, Inc. Method for removal of metallic residue after plasma etching of a metal layer
JP3945493B2 (ja) * 2004-04-16 2007-07-18 セイコーエプソン株式会社 半導体装置及びその製造方法
FR2909101B1 (fr) * 2006-11-24 2009-02-27 Samuel Stremsdoerfer Procede non electrolytique prefectionne de metallisation d'un substrat par voie de reduction de sel(s) metallique(s) et par projection d'aerosol(s)
FR2934609B1 (fr) 2008-07-30 2011-07-22 Jet Metal Technologies Procede non eletrolytique de metallisation en ligne de substrats par projection avec traitement de surface prealable et dispositif pour la mise en oeuvre du procede.
FR2934964B1 (fr) 2008-08-12 2010-10-22 Jet Metal Technologies Procede de traitement optophysique de surface de substrats polymere et dispositif pour la mise en oeuvre du procede
JP5472950B2 (ja) * 2012-06-19 2014-04-16 Jeインターナショナル株式会社 マスキング剤および表面処理基材の製造方法

Also Published As

Publication number Publication date
CN107250442B (zh) 2021-03-09
US11168398B2 (en) 2021-11-09
JP6845146B2 (ja) 2021-03-17
FR3032724A1 (fr) 2016-08-19
US20180030599A1 (en) 2018-02-01
ES2828691T3 (es) 2021-05-27
KR20170132132A (ko) 2017-12-01
WO2016128695A1 (fr) 2016-08-18
EP3256620A1 (fr) 2017-12-20
KR102628252B1 (ko) 2024-01-24
BR112017017268A2 (pt) 2018-04-17
DK3256620T3 (da) 2020-11-02
BR112017017268B1 (pt) 2022-05-03
JP2018506648A (ja) 2018-03-08
FR3032724B1 (fr) 2019-12-13
CN107250442A (zh) 2017-10-13
EP3256620B1 (fr) 2020-08-05
MX2017010460A (es) 2018-04-24
HRP20201758T1 (hr) 2021-03-19

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