MX2008014770A - Sistema y metodo de refabricacion de ensamble electronico. - Google Patents

Sistema y metodo de refabricacion de ensamble electronico.

Info

Publication number
MX2008014770A
MX2008014770A MX2008014770A MX2008014770A MX2008014770A MX 2008014770 A MX2008014770 A MX 2008014770A MX 2008014770 A MX2008014770 A MX 2008014770A MX 2008014770 A MX2008014770 A MX 2008014770A MX 2008014770 A MX2008014770 A MX 2008014770A
Authority
MX
Mexico
Prior art keywords
housing
electronic assembly
affixed
component
assembly
Prior art date
Application number
MX2008014770A
Other languages
English (en)
Inventor
Paul C Gottshall
Guerrero Ernesto Nicanor Santillan
Original Assignee
Caterpillar Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Caterpillar Inc filed Critical Caterpillar Inc
Publication of MX2008014770A publication Critical patent/MX2008014770A/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0034—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having an overmolded housing covering the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0047—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0763—Treating individual holes or single row of holes, e.g. by nozzle
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/176—Removing, replacing or disconnecting component; Easily removable component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/225—Correcting or repairing of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Un método para refabricar un ensamble electrónico incluye remover una primera porción de un alojamiento de ensamble para exponer un lado inferior de un ensamble de circuitos delimitado; una o más uniones de soldadura en el lado inferior del ensamble de circuitos se relacionan con al menos un componente que también se fija a una porción del alojamiento; el ensamble electrónico abierto se baja en un accesorio para desoldar que tiene una pluralidad de crisoles configurados para abarcar, y de esta manera desoldar, las uniones de soldadura relacionadas con el componente que se fija a una porción del alojamiento; una vez que se funden las uniones de soldaduras afectadas, la porción restante del alojamiento y el componente fijo al mismo pueden elevarse, exponiendo la superficie superior del ensamble de circuito para análisis, reparación y/o ajuste.
MX2008014770A 2007-11-20 2008-11-19 Sistema y metodo de refabricacion de ensamble electronico. MX2008014770A (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/943,219 US7681778B2 (en) 2007-11-20 2007-11-20 Electronic assembly remanufacturing system and method

Publications (1)

Publication Number Publication Date
MX2008014770A true MX2008014770A (es) 2009-05-27

Family

ID=40640855

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2008014770A MX2008014770A (es) 2007-11-20 2008-11-19 Sistema y metodo de refabricacion de ensamble electronico.

Country Status (3)

Country Link
US (1) US7681778B2 (es)
CN (1) CN101442896B (es)
MX (1) MX2008014770A (es)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6260814B2 (ja) * 2011-06-02 2018-01-17 パナソニックＩｐマネジメント株式会社 電子部品実装方法、電子部品搭載装置および電子部品実装システム
SG11201403228RA (en) * 2011-12-15 2014-07-30 Advanced Tech Materials Apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment
WO2013192222A2 (en) 2012-06-18 2013-12-27 Hzo, Inc. Systems and methods for applying protective coatings to internal surfaces of fully assembled electronic devices
US10449568B2 (en) 2013-01-08 2019-10-22 Hzo, Inc. Masking substrates for application of protective coatings
JP2015507852A (ja) * 2013-01-08 2015-03-12 エイチズィーオー・インコーポレーテッド 改修又は再製品化電子デバイスに耐湿被覆を備え付けるためのシステム及び方法
CN104994965A (zh) 2013-01-08 2015-10-21 Hzo股份有限公司 用于施涂保护性涂层的掩蔽基底
US9894776B2 (en) 2013-01-08 2018-02-13 Hzo, Inc. System for refurbishing or remanufacturing an electronic device
WO2016022755A2 (en) 2014-08-06 2016-02-11 Greene Lyon Group, Inc. Rotational removal of electronic chips and other components from printed wire boards using liquid heat media

Family Cites Families (29)

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GB1297138A (es) * 1969-06-27 1972-11-22
US3815806A (en) * 1972-11-24 1974-06-11 Singer Co Desoldering fixture
US4101066A (en) * 1977-08-31 1978-07-18 Western Electric Co., Inc. Soldering method and apparatus utilizing dual solder waves of different variable velocities
US4162034A (en) * 1978-05-03 1979-07-24 Western Electric Company, Incorporated Ejector controlled soldering device
DE3040274C2 (de) * 1980-10-23 1983-06-09 ERSA Ernst Sachs KG, GmbH & Co, 6980 Wertheim Vorrichtung zum Auslöten elektronischer Bauteile aus Leiterplatten
US4456163A (en) * 1981-10-23 1984-06-26 Micro Electronic Systems Inc. Multi-faced solder pot
DE3232368A1 (de) 1982-08-31 1984-03-01 Siemens AG, 1000 Berlin und 8000 München Loetgeraet fuer leiterplatten
US4506820A (en) * 1983-07-29 1985-03-26 Brucker John P Desoldering device
US4659002A (en) * 1985-08-08 1987-04-21 Pace, Incorporated Apparatus for replacement of through-hole mounted PCB components
US4769083A (en) * 1986-01-27 1988-09-06 Gould Inc. Method for removing excess solder from printed circuit boards
US4979662A (en) * 1989-09-05 1990-12-25 Kim Henry I Desoldering vat
US5024366A (en) * 1989-09-05 1991-06-18 Kim Henry I Desoldering vat
US5072874A (en) * 1991-01-31 1991-12-17 Microelectronics And Computer Technology Corporation Method and apparatus for using desoldering material
US5176312A (en) * 1991-08-12 1993-01-05 Brian Lowenthal Selective flow soldering apparatus
JP2714520B2 (ja) * 1992-08-28 1998-02-16 株式会社日立製作所 実装部品着脱装置
US5340013A (en) * 1993-12-10 1994-08-23 International Business Machines Corporation Rework process for printed circuit cards and solder fountain having gas blanket for carrying out the process
US5617990A (en) * 1995-07-03 1997-04-08 Micron Electronics, Inc. Shield and method for selective wave soldering
DE29621604U1 (de) * 1996-12-12 1998-01-02 Cooper Tools GmbH, 74354 Besigheim Löt-/Entlötvorrichtung
US5847938A (en) * 1996-12-20 1998-12-08 Ericsson Inc. Press-fit shields for electronic assemblies, and methods for assembling the same
US6305596B1 (en) * 1998-06-18 2001-10-23 Asustek Computer Inc. Apparatus and method for soldering through-hole components on circuit board
US6142357A (en) * 1998-10-15 2000-11-07 Mcms, Inc. Molded selective solder pallet
US6256478B1 (en) * 1999-02-18 2001-07-03 Eastman Kodak Company Dynamic packet sizing in an RF communications system
US6343732B1 (en) * 1999-10-01 2002-02-05 International Business Machines Corporation Passive and active heat retention device for solder fountain rework
US6750845B2 (en) * 2001-10-19 2004-06-15 Gregory S. Hopper Computer pointing device
JP2005005148A (ja) * 2003-06-12 2005-01-06 Denso Corp 電動式アクチュエータ用コネクタ
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CN2781715Y (zh) * 2005-02-02 2006-05-17 倚天资讯股份有限公司 遮蔽盖拆卸装置
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TWI315970B (en) * 2006-02-03 2009-10-11 Quanta Comp Inc Lead-free soldering reworking system and method thereof

Also Published As

Publication number Publication date
CN101442896A (zh) 2009-05-27
US7681778B2 (en) 2010-03-23
CN101442896B (zh) 2013-07-17
US20090127321A1 (en) 2009-05-21

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Legal Events

Date Code Title Description
HH Correction or change in general
FG Grant or registration