GB0312150D0 - A pallet for supporting a printed circuit board during soldering and a method for soldering a component to the printed circuit board - Google Patents

A pallet for supporting a printed circuit board during soldering and a method for soldering a component to the printed circuit board

Info

Publication number
GB0312150D0
GB0312150D0 GB0312150A GB0312150A GB0312150D0 GB 0312150 D0 GB0312150 D0 GB 0312150D0 GB 0312150 A GB0312150 A GB 0312150A GB 0312150 A GB0312150 A GB 0312150A GB 0312150 D0 GB0312150 D0 GB 0312150D0
Authority
GB
United Kingdom
Prior art keywords
circuit board
printed circuit
soldering
pallet
supporting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB0312150A
Other versions
GB2399310A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hi Key Ltd
Original Assignee
Hi Key Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from IE20030180A external-priority patent/IE20030180A1/en
Application filed by Hi Key Ltd filed Critical Hi Key Ltd
Publication of GB0312150D0 publication Critical patent/GB0312150D0/en
Publication of GB2399310A publication Critical patent/GB2399310A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/087—Soldering or brazing jigs, fixtures or clamping means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
GB0312150A 2003-03-11 2003-05-27 A pallet for supporting a printed circuit board during soldering Withdrawn GB2399310A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IE20030181 2003-03-11
IE20030180A IE20030180A1 (en) 2003-03-11 2003-03-11 A pallet for supporting a printed circuit board during soldering and a method for soldering a component to the printed circuit board

Publications (2)

Publication Number Publication Date
GB0312150D0 true GB0312150D0 (en) 2003-07-02
GB2399310A GB2399310A (en) 2004-09-15

Family

ID=32910518

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0312150A Withdrawn GB2399310A (en) 2003-03-11 2003-05-27 A pallet for supporting a printed circuit board during soldering

Country Status (1)

Country Link
GB (1) GB2399310A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113618191A (en) * 2021-08-24 2021-11-09 安徽信息工程学院 PCB soldering device

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101998775A (en) * 2010-12-01 2011-03-30 天津市中环电子计算机有限公司 Wave soldering clamp for circuit board with double-sided devices
CN102970832B (en) * 2011-08-31 2015-09-16 珠海格力电器股份有限公司 Technological equipment for wave soldering and technological method for wave soldering
CN103372702B (en) * 2012-04-18 2016-03-16 珠海格力电器股份有限公司 Welding auxiliary device
CN102922195B (en) * 2012-10-23 2015-07-15 京信通信系统（中国）有限公司 Sheeting fixture
CN107262869B (en) * 2017-07-26 2019-05-24 湖北兆元科技有限公司 Optical device wave soldering fixture and its welding method
CN109128420B (en) * 2018-08-29 2021-03-02 西安中科麦特电子技术设备有限公司 Full-automatic repair and unsolder method
CN112122725B (en) * 2020-09-02 2022-05-10 上海羽默电子科技有限公司 Circuit board welding auxiliary assembly
DE102021112047A1 (en) * 2021-05-07 2022-11-10 Ersa Gmbh Traversing unit for moving two soldering assemblies for processing printed circuit boards and soldering system for selective wave soldering with one traversing unit

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5593040A (en) * 1995-12-04 1997-01-14 Delco Electronics Corporation Rotary clip for solder pallet
US5820013A (en) * 1996-07-01 1998-10-13 Innovative Soldering Technologies Adjustable support apparatus for wave soldering of printed circuit boards
JPH11154787A (en) * 1997-11-21 1999-06-08 Advantest Corp Board presser tool for board carrier
AU3414500A (en) * 1999-04-06 2000-10-23 Christian Luthi Soldering frame
US6237832B1 (en) * 1999-10-18 2001-05-29 Henry Chung Wave soldering fixture

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113618191A (en) * 2021-08-24 2021-11-09 安徽信息工程学院 PCB soldering device

Also Published As

Publication number Publication date
GB2399310A (en) 2004-09-15

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)