CN113618191A

CN113618191A - PCB soldering device

Info

Publication number: CN113618191A
Application number: CN202110972330.7A
Authority: CN
Inventors: 姚俊
Original assignee: Anhui Institute of Information Engineering
Current assignee: Anhui Institute of Information Engineering
Priority date: 2021-08-24
Filing date: 2021-08-24
Publication date: 2021-11-09

Abstract

The invention discloses a PCB soldering device, relating to the field of circuit board welding machinery, comprising a base, the base is of a concave frame structure, the elastic ejection mechanism is arranged in the base and is used for ejecting and fixing the power supply element on the circuit board, a circuit board is arranged on the ejection mechanism, each electrical element on the circuit board is welded by a welding chuck, the welding chuck comprises a first chuck and a second chuck, the first chuck is elastically connected with the second chuck, the welding chuck is electrically connected with an external power supply through a wire holder at the top end, the invention can ensure that the quantity of the tin wire conveyed each time is basically the same by conveying the tin wire through the micro motor, then the tin wire flows into the profiling groove after the welding head is melted, the melted tin material is cooled and shaped, enough tin material is ensured to be welded, and the standardization of the shape of the welding flux at the welding position is realized while the welding quality is ensured.

Description

PCB soldering device

Technical Field

The invention relates to the field of printed circuit board soldering devices, in particular to a PCB soldering device.

Background

In the soldering work of the printed circuit board, a common operation mode is to hold a welding gun with one hand and hold a tin wire with the other hand and melt the tin wire by using a high-temperature welding gun head for soldering, in the process, pins of each electrical element are inserted from the front side of the printed circuit board through manual operation, then the whole printed circuit board is turned over, and each electrical element is welded and fixed through soldering, but after long-time soldering operation, the inserted electrical elements are easy to fall off, in the soldering process, the falling point and the shape of molten tin are difficult to accurately control by hands, the situation that the shape of the solder formed after soldering is irregular or the solder is too much or too little and the like to solder the electrical elements and the circuit board often occurs, and the phenomenon of false soldering is formed, and the soldering points of the solder with various shapes are unqualified products, the production cost of enterprises is increased, and the service life of the circuit board is influenced by the non-standard solder at the welding position, so that a device capable of realizing the solder standardization of the welding point is urgently needed.

Disclosure of Invention

The present invention is directed to a PCB soldering apparatus to solve the above problems of the related art.

In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a PCB board soldering device, the base is concave frame structure, the base includes that bearing bottom plate, symmetry set up side stand and rubber cushion, the upper surface of bearing bottom plate is equipped with the recess, be equipped with the spring hole in the recess, side stand welded fastening is at the both ends of bearing bottom plate, the top surface at the side stand is fixed respectively to the rubber cushion, set up in the bearing bottom plate and play a mechanism and be used for withstanding and give electrical components on the fixed circuit board, the circuit board has been placed on the mechanism to bullet top, each electrical components is responsible for the welding by the welding chuck on the circuit board, the welding chuck includes first chuck and second chuck, it makes the two elastic connection to be equipped with compression spring between first chuck and the second chuck, the welding chuck passes through the connection terminal seat electric connection on top on the external power source.

Preferably, the ejection mechanism comprises an ejection pin fixing plate, a supporting plate and a spring, the ejection pin fixing plate is placed in the groove, the bottom of the ejection pin fixing plate is elastically installed in the bearing bottom plate through the spring, a plurality of ejection pins are uniformly arranged on the ejection pin fixing plate, the top of the ejection pins is fixed below the supporting plate, and a sponge pad is fixed on the upper surface of the supporting plate.

Preferably, the first chuck comprises a first chuck support, a first insulating sleeve and a first welding head, the first insulating sleeve is sleeved at the upper end of the first chuck support, the first welding head and the first chuck support are integrally formed and are located at the lower end of the first chuck support, and a welding surface of the first welding head is provided with a conductive synapse.

Preferably, the second chuck comprises a second chuck support, a second insulating sleeve and a second welding head, the second insulating sleeve is sleeved at the upper end of the second chuck support, the second welding head is fixed below the second chuck support, and the second chuck support comprises a first chuck support and a second chuck support which are fixed through square pins.

Preferably, the first second chuck support and the second chuck support are integrally formed, the first second chuck support comprises a micro motor, a first friction wheel, a first welding wire groove, a profile groove and a conductive groove, the micro motor is mounted on the first second chuck support through a motor frame, the first friction wheel is mounted on an output shaft of the micro motor and located in a first mounting frame of the first second chuck support, the first welding wire groove is located on the inner side face of the first second chuck support, the profile groove and the conductive groove are located on the welding face of the first second chuck support, and a square pin mounting hole is formed in the rear of the first second chuck support.

Preferably, second chuck support two includes friction pulley two, second welding wire groove and square pin couple, friction pulley two is installed on the rotation axis and is located the installing frame two of second chuck support two, second welding wire groove is located the medial surface of second chuck support two, the medial surface rear at second chuck support two is fixed to the square pin couple, and two about containing.

Compared with the prior art, the invention has the beneficial effects that:

the invention can ensure that the quantity of the tin wire conveyed each time is basically the same by conveying the tin wire through the micro motor, then the tin wire flows into the profiling groove after the welding head is melted, the melted tin material is cooled and shaped, enough tin material is ensured to be welded, and the standardization of the shape of the welding flux at the welding position is realized while the welding quality is ensured.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of a base structure according to the present invention;

FIG. 3 is a schematic structural view of the ejection mechanism of the present invention;

FIG. 4 is a schematic diagram of a circuit board structure according to the present invention;

FIG. 5 is a schematic view of a welding chuck according to the present invention;

FIG. 6 is a schematic view of a first chuck of the present invention;

FIG. 7 is a schematic view of a second chuck of the present invention;

FIG. 8 is an enlarged view of the structure at A in FIG. 7;

FIG. 9 is a schematic view of a second chuck support according to the present invention.

In the figure: 1-a base; 11-a load-bearing floor; 12-side uprights; 13-a rubber cushion; 14-a groove; 15-spring hole;

2-ejection mechanism; 21-spring thimble fixing plate; 22-a support plate; 23-a spring; 24-a sponge cushion; 25-ejecting the thimble;

3-welding a chuck; 31-a first collet; 311-a first collet holder; 312-insulating sleeve one; 313-a first weld head; 314-conductive synapse;

32-a second collet; 321-a second collet holder; 322-insulating sleeve two; 323-second weld head;

324-a second collet holder one; 3241-micro motor; 3242-Friction wheel one; 3243-first wire groove; 3244-profile groove; 3245-conductive grooves; 3246-motor frame; 3247-mounting frame one; 3248-square pin mounting holes;

325-second chuck support two; 3251-Friction wheel two; 3252-second wire groove; 3253-square pin hook; 3254-rotation axis; 3255-mounting a second frame;

33-wire holder, 34-compression spring;

4-circuit board.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1 to 9, the present invention provides a technical solution: the utility model provides a PCB board soldering device, base 1 is concave frame structure, base 1 includes that bearing bottom plate 11, symmetry set up side stand 12 and rubber cushion 13, the upper surface of bearing bottom plate 11 is equipped with recess 14, be equipped with spring hole 15 in the recess 14, side stand 12 welded fastening is at the both ends of bearing bottom plate 11, rubber cushion 13 is fixed respectively at the top surface of side stand 12, set up in the bearing bottom plate 11 and bounce a mechanism 2 and be used for withstanding and fixed circuit board on giving electrical components, circuit board 4 has been placed on the bounce mechanism 2, each electrical components is responsible for the welding by welding chuck 3 on the circuit board, welding chuck 3 includes first chuck 31 and second chuck 32, be equipped with compression spring 34 between first chuck 31 and the second chuck 32 and make the two elastic connection, welding chuck 3 is through the connection terminal 33 electric connection on top on the external power source, when the first chuck 31 and the second chuck 32 are not stressed, the first chuck 31 and the second chuck 32 are naturally flicked under the action of the compression spring 34, the whole welding chuck 3 is electrified after the first chuck 31 and the second chuck 32 are contacted, accidental injury caused by the fact that the welding chuck 3 is electrified all the time is avoided, and electric power can be saved.

In this embodiment, the ejection mechanism 2 includes an ejection pin fixing plate 21, a supporting plate 22 and a spring 23, the ejection pin fixing plate 21 is placed in the groove 14, the bottom of the ejection pin fixing plate 21 is elastically installed in the bearing bottom plate 11 through the spring 23, a plurality of ejection pins 25 are uniformly arranged on the ejection pin fixing plate 21, the top of the ejection pins 25 is fixed below the supporting plate 22, a foam rubber mat 24 is fixed on the upper surface of the supporting plate 22, because the electrical component is installed on the circuit board 4 through pins, the supporting plate 22 and the foam rubber mat 24 can be jacked up by setting the ejection pins 22, the installed electrical component is dragged by the foam rubber mat 24, and thus the electrical component can be prevented from falling off from the circuit board 4 when not being welded.

In this embodiment, the first chuck 31 includes a first chuck support 311, a first insulating sleeve 312 and a first welding head 313, the first insulating sleeve 312 is sleeved on the upper end of the first chuck support 311, the first welding head 313 and the first chuck support 311 are integrally formed and located at the lower end of the first chuck support 311, a conductive synapse 314 is disposed on a welding surface of the first welding head 313, and the first insulating sleeve 312 is held by a human hand, so as to prevent electric leakage from hurting people.

In this embodiment, the second chuck 32 includes a second chuck support 321, an insulating sleeve second 322, and a second welding head 323, the insulating sleeve second 322 is sleeved on the upper end of the second chuck support 321, the second welding head 323 is fixed below the second chuck support 321, and the second chuck support 321 includes a second chuck support first 324 and a second chuck support second 325, and the two are fixed by a square pin.

In this embodiment, the second cartridge holder 324 is integrally formed with the second cartridge holder 321, the second cartridge holder 324 includes a micro motor 3241, a friction wheel 3242, a first wire groove 3243, a contour groove 3244, and a conductive groove 3245, the micro motor 3241 is mounted on the second cartridge holder 324 through a motor frame 3246, the friction wheel 3242 is mounted on an output shaft of the micro motor 3241 and is located in a mounting frame 3247 of the second cartridge holder 324, the first wire groove 3243 is located on an inner side surface of the second cartridge holder 324, the contour groove 3244 and the conductive groove 3245 are located on a welding surface of the second cartridge holder 324, a square pin mounting hole 3248 is disposed behind the second cartridge holder 324, after the conductive synapse 316 contacts the conductive groove 3245, the first welding head 313 and the second welding head 323 are heated, the micro motor 3241 is powered to drive the friction wheel 3242 to feed the solder wire from the first wire groove 3243 to the front, the heated first solder joint 313 is melted when contacted and flows into the contoured groove 3244, forming a standard solder that helps to solder the electrical components of the circuit board.

In this embodiment, the second chuck support 325 includes a second friction wheel 3251, a second welding wire groove 3252 and a square pin hook 3253, the second friction wheel 3251 is mounted on the rotating shaft 3254 and is located in a second mounting frame 3255 of the second chuck support 325, the second welding wire groove 3252 is located on the inner side surface of the second chuck support 325, and the square pin hook 3253 is fixed behind the inner side surface of the second chuck support 325 and includes an upper branch and a lower branch, and the square pin hook 3253 is inserted into the square pin mounting hole 3248 and then is used for hanging the side surface of the second chuck support 324 by the square pin hook 3253, so that the second chuck support 325 can be easily disassembled and assembled, the first friction wheel 3242 and the second friction wheel 3251 can be conveniently cleaned, and the tin wire can be conveniently replaced.

The working principle is as follows: when the tin wire soldering machine is used, firstly, a circuit board provided with a plurality of electric elements is placed on the side upright post 12 in a mode that the electric elements are arranged below and the array pins are arranged above, and is squeezed tightly by the rubber cushions 13 on two sides, because the electric elements are arranged on the circuit board 4 through pins, the supporting plate 22 and the sponge cushion 24 can be jacked up through the spring ejector pins 22, the arranged electric elements are dragged by the sponge cushion 24, so that the electric elements can be prevented from falling off from the circuit board 4 when the electric elements are not welded, after the operation is finished, the second chuck bracket I324 is detached from the second chuck bracket I324 by pressing the square pin hooks 3253, the tin wire is placed into the first tin wire groove 3243, the head of the tin wire is placed on the side surface of the friction wheel I3242, the second chuck bracket II 325 is arranged on the second chuck bracket I324 through the square pin hooks 3253, and at the moment, the tin wire is positioned in a cavity formed by the first tin wire groove 3243 and the second tin wire groove 3252, and the head of the friction wheel I3251 is squeezed by the friction wheel I3242 and the friction wheel II 3251 And then, the welding chuck 3 is powered on, when the welding chuck 3 is not pressed, the conductive synapse 316 is not communicated with the conductive groove 3245, the first chuck 31 and the second chuck 32 are not electrified, then the welding chuck 3 is held by one hand, a pair of tweezers is held by one hand to place a pin of an electrical element in the first wire guide groove 314, the welding chuck 3 is pressed to enable the conductive synapse 316 to be communicated with the conductive groove 3245, the first welding head 313 and the second welding head 323 are electrified and heated, the micro motor 3241 is electrified to drive the friction wheel 3242 to convey a tin wire from the first welding groove 3243, the tin wire is melted after contacting the first welding head 313 heated, the tin wire flows to the standard solder formed in the groove 3244 until the profile groove is filled, the electrical element of the circuit board is welded, then, the welding chuck 3 is immediately loosened, and the first welding head 313 and the second welding head 323 are separated under the elasticity, and the welding of one pin is completed.

Based on the above, the invention can ensure that the quantity of the tin wire conveyed each time is basically the same by conveying the tin wire through the micro motor, then the tin wire flows into the profiling groove after the welding head is melted, the melted tin material is cooled and shaped, enough tin material is ensured to be welded, and the standardization of the shape of the welding material at the welding position is realized while the welding quality is ensured.

It will be appreciated by those skilled in the art that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The embodiments disclosed above are therefore to be considered in all respects as illustrative and not restrictive. All changes which come within the scope of or equivalence to the invention are intended to be embraced therein.

Claims

1. A PCB board soldering device, includes base (1), its characterized in that: the base (1) is a concave frame structure, the base (1) comprises a bearing bottom plate (11) and side upright columns (12) and rubber cushions (13) which are symmetrically arranged, a groove (14) is arranged on the upper surface of the bearing bottom plate (11), spring holes (15) are arranged in the groove (14), the side upright columns (12) are welded and fixed at two ends of the bearing bottom plate (11), the rubber cushions (13) are respectively fixed on the top surface of the side upright columns (12), an elastic ejection mechanism (2) is arranged in the bearing bottom plate (11) and used for ejecting and fixing electrical components on a circuit board, a circuit board (4) is placed on the elastic ejection mechanism (2), each electrical component on the circuit board is responsible for welding by a welding chuck (3), the welding chuck (3) comprises a first chuck (31) and a second chuck (32), a compression spring (34) is arranged between the first chuck (31) and the second chuck (32) to enable the two to be elastically connected, the welding chuck (3) is electrically connected to an external power supply through a wire holder (33) at the top end.

2. A PCB soldering apparatus according to claim 1, wherein: the ejection mechanism (2) comprises an ejection thimble fixing plate (21), a supporting plate (22) and a spring (23), the ejection thimble fixing plate (21) is placed in the groove (14), the bottom of the ejection thimble fixing plate (21) is elastically installed in the bearing bottom plate (11) through the spring (23), a plurality of ejection thimbles (25) are uniformly arranged on the ejection thimble fixing plate (21), the top of the ejection thimbles (25) is fixed below the supporting plate (22), and a sponge pad (24) is fixed on the upper surface of the supporting plate (22).

3. A PCB soldering apparatus according to claim 1, wherein: the first chuck (31) comprises a first chuck support (311), an insulating sleeve I (312) and a first welding head (313), the insulating sleeve I (312) is sleeved on the upper end of the first chuck support (311), the first welding head (313) and the first chuck support (311) are integrally formed and are located at the lower end of the first chuck support (311), and a conductive synapse (314) is arranged on a welding surface of the first welding head (313).

4. A PCB soldering apparatus according to claim 1, wherein: the second chuck (32) comprises a second chuck support (321), a second insulating sleeve (322) and a second welding head (323), the second insulating sleeve (322) is sleeved on the upper end of the second chuck support (321), the second welding head (323) is fixed below the second chuck support (321), and the second chuck support (321) comprises a first second chuck support (324) and a second chuck support (325) which are fixed through square pins.

5. A PCB soldering apparatus according to claim 4, wherein: the second chuck support I (324) and the second chuck support (321) are integrally formed, the second chuck support I (324) comprises a micro motor (3241), a friction wheel I (3242), a first welding wire groove (3243), a profiling groove (3244) and a conductive groove (3245), the micro motor (3241) is installed on the second chuck support I (324) through a motor frame (3246), the friction wheel I (3242) is installed on an output shaft of the micro motor (3241) and is located in a first installation frame (3247) of the second chuck support I (324), the first welding wire groove (3243) is located on the inner side face of the second chuck support I (324), the profiling groove (3244) and the conductive groove (3245) are located on the welding face of the second chuck support I (324), and a square pin installation hole (3248) is formed in the rear of the second chuck support I (324).

6. A PCB soldering apparatus according to claim 5, wherein: second chuck support two (325) includes friction pulley two (3251), second welding wire groove (3252) and square pin couple (3253), friction pulley two (3251) is installed on rotation axis (3254) and is located second chuck support two (325) installing frame two (3255), second welding wire groove (3252) is located the medial surface of second chuck support two (325), square pin couple (3253) are fixed in the medial surface rear of second chuck support two (325), and contain two branch about.