MX150708A - Mejoras en dispositivo semiconductor de alta potencia y metodo para fabricarlo - Google Patents
Mejoras en dispositivo semiconductor de alta potencia y metodo para fabricarloInfo
- Publication number
- MX150708A MX150708A MX191622A MX19162282A MX150708A MX 150708 A MX150708 A MX 150708A MX 191622 A MX191622 A MX 191622A MX 19162282 A MX19162282 A MX 19162282A MX 150708 A MX150708 A MX 150708A
- Authority
- MX
- Mexico
- Prior art keywords
- manufacture
- semiconductor device
- high power
- power semiconductor
- semiconductor
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US23879981A | 1981-02-27 | 1981-02-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MX150708A true MX150708A (es) | 1984-06-29 |
Family
ID=22899344
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MX191622A MX150708A (es) | 1981-02-27 | 1982-03-01 | Mejoras en dispositivo semiconductor de alta potencia y metodo para fabricarlo |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP0076802A4 (es) |
| JP (1) | JPS58500187A (es) |
| IT (1) | IT1156238B (es) |
| MX (1) | MX150708A (es) |
| WO (1) | WO1982002980A1 (es) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BR8400122A (pt) * | 1983-01-12 | 1984-08-21 | Allen Bradley Co | Modulo semicondutor e embalagem de semicondutor aperfeicoada |
| JPS59172759A (ja) * | 1983-03-22 | 1984-09-29 | Mitsubishi Electric Corp | ゲ−トタ−ンオフサイリスタモジユ−ル |
| FR2553231B1 (fr) * | 1983-10-10 | 1988-07-08 | Thomson Csf | Commutateur double pour onduleurs, encapsule en boitier a broches exterieures planes |
| IT1222152B (it) * | 1987-07-28 | 1990-09-05 | Sgs Microelettronica Spa | Dispositivo a piu' piastrine di materiale in contenitore di metallo e resina |
| WO1994005040A1 (en) * | 1992-08-24 | 1994-03-03 | Iversen Arthur H | Power semiconductor packaging |
| DE4446566A1 (de) * | 1994-12-24 | 1996-06-27 | Telefunken Microelectron | Mehrpoliges, oberflächenmontierbares, elektronisches Bauelement |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4106052A (en) * | 1975-04-19 | 1978-08-08 | Semikron Gesellschaft Fur Gleichrichterbau Und Elektronik M.B.H. | Semiconductor rectifier unit having a base plate with means for maintaining insulating wafers in a desired position |
| JPS5271625A (en) * | 1975-12-10 | 1977-06-15 | Semikron Gleichrichterbau | Semiconductor rectifier device |
| US4117508A (en) * | 1977-03-21 | 1978-09-26 | General Electric Company | Pressurizable semiconductor pellet assembly |
| JPS5432075A (en) * | 1977-08-15 | 1979-03-09 | Nec Corp | Semiconductor device |
| US4394530A (en) * | 1977-09-19 | 1983-07-19 | Kaufman Lance R | Power switching device having improved heat dissipation means |
| US4246697A (en) * | 1978-04-06 | 1981-01-27 | Motorola, Inc. | Method of manufacturing RF power semiconductor package |
| DE2819327C2 (de) * | 1978-05-03 | 1984-10-31 | SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg | Halbleiterbaueinheit |
| JPS5550650A (en) * | 1978-10-06 | 1980-04-12 | Mitsubishi Electric Corp | Semiconductor device |
| US4204248A (en) * | 1978-11-20 | 1980-05-20 | General Electric Company | Heat transfer mounting arrangement for a solid state device connected to a circuit board |
| US4278990A (en) * | 1979-03-19 | 1981-07-14 | General Electric Company | Low thermal resistance, low stress semiconductor package |
-
1982
- 1982-02-05 JP JP57500924A patent/JPS58500187A/ja active Pending
- 1982-02-05 EP EP19820900877 patent/EP0076802A4/en not_active Ceased
- 1982-02-05 WO PCT/US1982/000153 patent/WO1982002980A1/en not_active Application Discontinuation
- 1982-02-24 IT IT47859/82A patent/IT1156238B/it active
- 1982-03-01 MX MX191622A patent/MX150708A/es unknown
Also Published As
| Publication number | Publication date |
|---|---|
| EP0076802A1 (en) | 1983-04-20 |
| EP0076802A4 (en) | 1984-12-11 |
| WO1982002980A1 (en) | 1982-09-02 |
| IT1156238B (it) | 1987-01-28 |
| IT8247859A0 (it) | 1982-02-24 |
| JPS58500187A (ja) | 1983-02-03 |
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