KR970702319A - 얇은 경질판 강화용의 분무가능한 경화성 조성물(CURABLE, SPRAYABLE COMPOSITlONS FOR REINFORCING THIN RIGID PLATES) - Google Patents

얇은 경질판 강화용의 분무가능한 경화성 조성물(CURABLE, SPRAYABLE COMPOSITlONS FOR REINFORCING THIN RIGID PLATES)

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Publication number
KR970702319A
KR970702319A KR1019960705442A KR19960705442A KR970702319A KR 970702319 A KR970702319 A KR 970702319A KR 1019960705442 A KR1019960705442 A KR 1019960705442A KR 19960705442 A KR19960705442 A KR 19960705442A KR 970702319 A KR970702319 A KR 970702319A
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KR
South Korea
Prior art keywords
composition
plate
curable composition
epoxy
curable
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KR1019960705442A
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English (en)
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KR100186923B1 (ko
Inventor
조셉 엠 마크루프
존 알 슈나이더
Original Assignee
한젤 마이클 씨
피피지 인더스트리즈, 인코포레이티드
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Application filed by 한젤 마이클 씨, 피피지 인더스트리즈, 인코포레이티드 filed Critical 한젤 마이클 씨
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/22—After-treatment of expandable particles; Forming foamed products
    • C08J9/228—Forming foamed products
    • C08J9/236—Forming foamed products using binding agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/32—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof from compositions containing microballoons, e.g. syntactic foams
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/02—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin

Abstract

얇은 경질판 또는 시이트, 예를 들어 자동차의 조립품에 사용되는 것들에 적합한 분무가능한 경화성 조성물로 제공한다. 상기 조성물은 열경화성 수지, 팽창성 미소구, 및 분쇄된 유리 섬유, 분쇄된 탄소 섬유 및 이들의 혼합물로 이루어진 그룹중에서 선택된 미립자 강화 물질을 포함한다.

Description

얇은 경질판 강화용의 분무가능한 경화성 조성물(CURABLE SPRAYABLE COMPOSITlONS FOR REINFORCING THIN RIGID PLATES)
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (18)

  1. (i) 열경화성 수지 조성물; (ii) 팽창성 미소구; 및 (iii) 분쇄된 유리 섬유, 분쇄된 탄소 섬유 및 이들의 혼합물로 이루어진 그룹중에서 선택된 미립자 강화 물질을 포함하는 분무가능한 경화성 조성물.
  2. 제1항에 있어서, 상기 열경화성 수지 조성물이 분자당 2개 이상의 에폭사이드 그룹을 함유하는 에폭시-기제 물질, 및 상기 에폭시-기제 물질의 경화를 개시시키는 촉매를 포함하는 경화성 조성물.
  3. 제2항에 있어서, 상기 에폭시-기제 물질이 비스페놀 A의 폴리글리시딜 에테르를 포함하는 경화성 조성물.
  4. 제2항에 있어서, 상기 에폭시-기제 물질이 에폭시-종결된 이량체산 및 에폭시-종결된 폴리에스테르로 이루어진 그룹에서 선택된 2개 이상의 에폭시-기제 물질의 혼합물을 포함하는 경화성 조성물.
  5. 제2항에 있어서, 상기 촉매가 디시안디아미드 및 이염기산의 디하이드라지드로 이루어진 그룹중에서 선택된 경화성 조성물.
  6. 제2항에 있어서, 상기 에폭시-기제 물질이 조성물의 전체 중량을 기준으로 50 내지 65중량% 범위의 양으로 존재하는 경화성 조성물.
  7. 제2항에 있어서, 상기 촉매가 조성물의 전체 중량을 기준으로 0.5 내지 5중량% 범위의 양으로 존재하는 경화성 조성물.
  8. 제2항에 있어서, 상기 팽창성 미소구가 휘발성 액체 분사제를 함유하는 열가소성 중합체 외피를 포함하는 경화성 조성물.
  9. 제2항에 있어서, 상기 팽창성 미소구가 조성물의 전체 중량을 기준으로 2 내지 5중량% 범위의 양으로 존재하는 경화성 조성물.
  10. 제2항에 있어서, 상기 미립자 강화 물질의 길이가 약 1/16in(1.59㎜)인 경화성 조성물.
  11. 제2항에 있어서, 상기 미립자 강화 물질이 조성물의 전체 중량을 기준으로 15 내지 30중량% 범위의 양으로 존재하는 경화성 조성물.
  12. 제2항의 조성물을 경질판의 한면에 도포시킨 다음 상기 경질판과 접촉하고 있는 곳에서만 상기 조성물을 경화시킴을 포함하는 얇은 경질판의 강화 방법.
  13. 제12항에 있어서, 상기 얇은 경질판이 강판, 알루미늄판, 구리판, 스테인레스 강판 및 플라스틱판으로 이루어진 그룹중에서 선택된 방법.
  14. 제12항에 있어서, 상기 조성물의 두께가 경화전에 약 1 내지 6㎜인 방법.
  15. 제12항에 있어서, 상기 조성물을 분무에 의해 도포시키는 방법.
  16. 경질판, 및 주로 상기 경질판의 한쪽면에 결합시킨 제1항의 경화된 조성물을 포함하는 강화된 얇은 경질판.
  17. 제16항에 있어서, 상기 얇은 경질판이 강판, 알루미늄판, 구리판, 스테인레스 강판 및 플라스틱판으로 이루어진 그룹중에서 선택된 강화된 얇은 경질판.
  18. 제16항에 있어서, 상기 경화된 조성물의 두께가 약 2 내지 9㎜인 강화된 얇은 경질판.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019960705442A 1994-03-31 1995-03-21 얇은 경질판 강화용의 분무가능한 경화성 조성물 KR100186923B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US08/220,656 1994-03-31
US8/220,656 1994-03-31
US08/220,656 US5470886A (en) 1994-03-31 1994-03-31 Curable, sprayable compositions for reinforced thin rigid plates
PCT/US1995/003474 WO1995027000A1 (en) 1994-03-31 1995-03-21 Curable, sprayable compositions for reinforcing thin rigid plates

Publications (2)

Publication Number Publication Date
KR970702319A true KR970702319A (ko) 1997-05-13
KR100186923B1 KR100186923B1 (ko) 1999-05-15

Family

ID=22824417

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KR1019960705442A KR100186923B1 (ko) 1994-03-31 1995-03-21 얇은 경질판 강화용의 분무가능한 경화성 조성물

Country Status (10)

Country Link
US (2) US5470886A (ko)
EP (1) EP0753023B1 (ko)
JP (1) JP2912019B2 (ko)
KR (1) KR100186923B1 (ko)
AT (1) ATE183532T1 (ko)
CA (1) CA2186638C (ko)
DE (1) DE69511538T2 (ko)
ES (1) ES2138196T3 (ko)
MX (1) MX9604432A (ko)
WO (1) WO1995027000A1 (ko)

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CA2186638A1 (en) 1995-10-12
US5712317A (en) 1998-01-27
DE69511538D1 (de) 1999-09-23
KR100186923B1 (ko) 1999-05-15
WO1995027000A1 (en) 1995-10-12
ES2138196T3 (es) 2000-01-01
CA2186638C (en) 2000-05-16
EP0753023A1 (en) 1997-01-15
DE69511538T2 (de) 2000-05-04
ATE183532T1 (de) 1999-09-15
JP2912019B2 (ja) 1999-06-28
EP0753023B1 (en) 1999-08-18
JPH09505109A (ja) 1997-05-20
MX9604432A (es) 1997-12-31
US5470886A (en) 1995-11-28

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