KR970077446A - Fixing jig for wafer in screen printing device - Google Patents

Fixing jig for wafer in screen printing device Download PDF

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Publication number
KR970077446A
KR970077446A KR1019960015462A KR19960015462A KR970077446A KR 970077446 A KR970077446 A KR 970077446A KR 1019960015462 A KR1019960015462 A KR 1019960015462A KR 19960015462 A KR19960015462 A KR 19960015462A KR 970077446 A KR970077446 A KR 970077446A
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KR
South Korea
Prior art keywords
wafer
jig
guider
screen printing
printing apparatus
Prior art date
Application number
KR1019960015462A
Other languages
Korean (ko)
Other versions
KR100221651B1 (en
Inventor
장석홍
김경섭
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019960015462A priority Critical patent/KR100221651B1/en
Publication of KR970077446A publication Critical patent/KR970077446A/en
Application granted granted Critical
Publication of KR100221651B1 publication Critical patent/KR100221651B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Screen Printers (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

본 발명은 웨이퍼의 전극 패드 상에 금속 범프(Bump)를 형성하기 위한 스크린 프린트(Screen Print) 장치 중에서 웨이퍼를 고정·지지하는 지그(Jig)에 관한 것으로서, 웨이퍼에 대한 지그의 고정력이 떨어져 웨이퍼의 흔들림이나 기울어짐이 발생될 경우, 그로 인해 나타나는 스크린 프린트시의 부정확한 스크린 정렬, 금속 페이스트의 불균일 전사, 스크린에 의한 웨이퍼의 손상, 금속 페이스트의 붕괴에 의한 단락 현상 등의 문제점을 해결하기 위하여, 웨이퍼 측면을 지지·고정하고 위치이동이 가능한 지지벽을 포함하는 가이드부를 형성함으로써, 웨이퍼에 대한 고정력을 증가시켜 웨이퍼의 흔들림이나 기울어짐을 방지하고, 균일한 금속 페이스트의 전사를 가능하게 하며, 웨이퍼의 손상을 방지할 뿐만 아니라, 웨이퍼의 직경에 관계없이 범용적으로 사용이 가능하게 하는 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a jig for fixing and supporting a wafer in a screen print apparatus for forming a metal bump on an electrode pad of a wafer, In order to solve the problems such as inaccurate screen alignment at the time of screen printing, nonuniform transfer of metal paste, wafer damage due to screen, short circuit due to collapse of metal paste and the like, when shaking or tilting occurs, It is possible to prevent wobbling or tilting of the wafer by increasing the fixing force to the wafer and to enable uniform transfer of the metal paste, In addition to preventing damage, it is universally used regardless of the diameter of the wafer. To enable.

Description

스크린 프린트 장치의 웨이퍼 고정용 지그Fixing jig for wafer in screen printing device

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is a trivial issue, I did not include the contents of the text.

제1도는 본 발명의 실시예에 의한 스크린 프린트 장치의 웨이퍼 고정용 지그 및 웨이퍼가 지그에 공급되는 상태를 나타내는 사시도.FIG. 1 is a perspective view showing a state in which a wafer fixing jig and a wafer of a screen printing apparatus according to an embodiment of the present invention are supplied to a jig. FIG.

Claims (8)

웨이퍼의 전극 패드에 금속 범프를 형성하는 스프린 프린트 장치에 있어서, 스크린 프린트 장치에 결합되며 평탄한 상부면을 가지는 지그 몸체와; 상기 지그 몸체에 한개 이상 형성되며 상기 지그 몸체의 상부면 상에 공급되는 웨이퍼를 흡착하기 위한 흡착수단; 상기 지그 몸체의 상부면 가장자리에 형성되는 복수개의 가이더 몸체와, 상기 가이더 몸체와 일체형으로 형성되며 상기 웨이퍼의 측면을 지지하기 위한 지지벽과,상기 가이더 몸체를 상기 지그 몸체 상에 결합하기 위한 체결수단을 가지는 가이더부(Guider部)를 포함하는 스크린 프린트 장치의 웨이퍼 고정용 지그(Jig).A sprint printing apparatus for forming a metal bump on an electrode pad of a wafer, comprising: a jig body coupled to a screen printing apparatus and having a flat upper surface; At least one adsorption means for adsorbing a wafer to be supplied onto the upper surface of the jig body; A plurality of guider bodies formed on the upper edge of the jig body, a support wall integrally formed with the guider body for supporting a side surface of the wafer, a fastening means for fastening the guider body on the jig body, And a guider portion having a guiding portion for guiding the jig to the wafer holding jig. 제1항에 있어서, 상기 가이더부가 상기 지그 몸체의 상부면 양쪽 가장자리에 형성되어 있는 것을 특징으로 하는 스크린 프린트 장치의 웨이퍼 고정용 지그.The jig for securing a wafer of a screen printing apparatus according to claim 1, wherein the guider portion is formed on both edges of an upper surface of the jig body. 제1항에 있어서, 상기 가이더부가 상기 지그 몸체의 상부면 사방(四方)의 가장자리에 형성되어 있는 것을 특징으로 하는 스크린 프린트 장치의 웨이퍼 고정용 지그.The jig for securing a wafer of a screen printing apparatus according to claim 1, wherein the guider part is formed at an edge of each of four sides of an upper surface of the jig body. 제1항에 있어서, 상기 지그 몸체의 상부면으로부터 상기 가이더부의 상부면까지의 높이가 상기 웨이퍼의 두께보다 작은 것을 특징으로 하는 스크린 프린트 장치의 웨이퍼 고정용 지그.The jig of claim 1, wherein the height from the upper surface of the jig body to the upper surface of the guider body is smaller than the thickness of the wafer. 제1항에 있어서, 상기 가이더부가 상기 지그 몸체 상에서 위치이동이 가능하도록 형성되어 있는 것을 특징으로 하는 스크린 프린트 장치의 웨이퍼 고정용 지그.The jig for fixing a wafer of a screen printing apparatus according to claim 1, wherein the guider part is formed to be movable on the jig body. 제5항에 있어서, 상기 가이더부가 가이더 몸체의 상이 체결수단이 삽입되는 장방향의 체결 홈이 형성되어 있어서, 상기 가이더부가 상기 지그 몸체 상에서 위치이동이 가능하도록 한 것을 특징으로 하는 스크린 프린트 장치의 웨이퍼 고정용 지그.6. The screen printing apparatus according to claim 5, wherein the guider portion is formed with a longitudinal coupling groove into which the fastening means of the guider body is inserted, so that the guider portion can be moved on the jig body. Fixing jig. 제5항에 있어서, 상기 지그 몸체가 상기 가이더부의 위치이동을 인도(引導)하기 위한 가이더 통로가 형성되어 있는 것을 특징으로 하는 스크린 프린트 장치의 웨이퍼 고정용 지그.The jig for securing a wafer in a screen printing apparatus according to claim 5, wherein the jig body is formed with a guider passage for guiding the movement of the guider part. 제1항에 있어서, 상기 흡착수단이 진공 흡착 방법을 이용하는 것을 특징으로 하는 스크린 프린트 장치의 웨이퍼 고정용 지그.The jig for fixing a wafer of a screen printing apparatus according to claim 1, wherein the adsorption means uses a vacuum adsorption method. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: It is disclosed by the contents of the first application.
KR1019960015462A 1996-05-10 1996-05-10 Wafer fixing jig KR100221651B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019960015462A KR100221651B1 (en) 1996-05-10 1996-05-10 Wafer fixing jig

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019960015462A KR100221651B1 (en) 1996-05-10 1996-05-10 Wafer fixing jig

Publications (2)

Publication Number Publication Date
KR970077446A true KR970077446A (en) 1997-12-12
KR100221651B1 KR100221651B1 (en) 1999-09-15

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100904394B1 (en) * 2007-09-19 2009-06-26 세메스 주식회사 Apparatus for transferring a substrate

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101314146B1 (en) * 2011-11-23 2013-10-04 (주)제니스월드 Fixing apparatus for ceramic product

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5926601Y2 (en) * 1981-03-16 1984-08-02 三洋電機株式会社 Transistor characteristics measuring device
JP3017827B2 (en) * 1991-03-26 2000-03-13 沖電気工業株式会社 Wafer ring holding mechanism in die bonding equipment
JPH0521582A (en) * 1991-07-10 1993-01-29 Fujitsu Ltd Wafer holder

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100904394B1 (en) * 2007-09-19 2009-06-26 세메스 주식회사 Apparatus for transferring a substrate

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