KR970072096A - Method for forming bonding pads of semiconductor devices - Google Patents
Method for forming bonding pads of semiconductor devices Download PDFInfo
- Publication number
- KR970072096A KR970072096A KR1019960012726A KR19960012726A KR970072096A KR 970072096 A KR970072096 A KR 970072096A KR 1019960012726 A KR1019960012726 A KR 1019960012726A KR 19960012726 A KR19960012726 A KR 19960012726A KR 970072096 A KR970072096 A KR 970072096A
- Authority
- KR
- South Korea
- Prior art keywords
- film
- forming
- predetermined
- metal wiring
- protective film
- Prior art date
Links
Landscapes
- Wire Bonding (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
본 발명은 반도체 소자의 제조공정에서 와이어 본딩을 위한 본딩 패드 형성방법을 개시한다. 이 방법은 소정의 단위 셀 및 배선 등이 형성된 반도체 기판 상부에 소정의 층간 절연용 산화막이 형성된 반도체 소자에 있어서, 절연용 산화막 위에 소정 두께의 본딩 패드용 금속배선을 형성하는 단계; 금속배선 위에 보호막을 형성하는 단계; 보호막 위에 폴리이미드막을 형성하는 단계; 폴리이미드막의 소정부분을 노광과 현상공정을 통하여 보호막의 표면이 노출될 때까지 제거하는 단계; 노출된 보호막 표면을 소정의 에너지로서 O2플라즈마 식각하는 단계; 금속배선막의 표면이 노출될 때까지 소정의 에너지로서 플라즈마 식각하는 단계를 포함한다.The present invention discloses a method of forming a bonding pad for wire bonding in a manufacturing process of a semiconductor device. In this method, a predetermined interlayer insulating oxide film is formed on a semiconductor substrate on which predetermined unit cells and wirings are formed. The method includes the steps of: forming a metal wiring for a bonding pad having a predetermined thickness on an insulating oxide film; Forming a protective film on the metal wiring; Forming a polyimide film on the protective film; Removing a predetermined portion of the polyimide film through exposure and development until the surface of the protective film is exposed; O 2 plasma etching the exposed protective film surface with a predetermined energy; And plasma etching with predetermined energy until the surface of the metal wiring film is exposed.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is a trivial issue, I did not include the contents of the text.
제2도의 (가) 내지 (라)는 본 발명의 실시예에 따른 것으로서, 본딩 패드를 형성하기 위한 과정을 보여주는 공정 흐름도.FIG. 2 (a) through FIG. 2 (d) are process flow diagrams illustrating a process for forming a bonding pad according to an embodiment of the present invention;
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019960012726A KR970072096A (en) | 1996-04-24 | 1996-04-24 | Method for forming bonding pads of semiconductor devices |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019960012726A KR970072096A (en) | 1996-04-24 | 1996-04-24 | Method for forming bonding pads of semiconductor devices |
Publications (1)
Publication Number | Publication Date |
---|---|
KR970072096A true KR970072096A (en) | 1997-11-07 |
Family
ID=66217153
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019960012726A KR970072096A (en) | 1996-04-24 | 1996-04-24 | Method for forming bonding pads of semiconductor devices |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR970072096A (en) |
-
1996
- 1996-04-24 KR KR1019960012726A patent/KR970072096A/en not_active Application Discontinuation
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