KR970018236A - Method for manufacturing metal wiring of semiconductor device - Google Patents
Method for manufacturing metal wiring of semiconductor device Download PDFInfo
- Publication number
- KR970018236A KR970018236A KR1019950032993A KR19950032993A KR970018236A KR 970018236 A KR970018236 A KR 970018236A KR 1019950032993 A KR1019950032993 A KR 1019950032993A KR 19950032993 A KR19950032993 A KR 19950032993A KR 970018236 A KR970018236 A KR 970018236A
- Authority
- KR
- South Korea
- Prior art keywords
- metal wiring
- wiring layer
- plasma
- semiconductor device
- forming
- Prior art date
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- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
금속배선층의 포토리소그래피 공정시 발생하는 금속배선층의 손상을 방지하여 신뢰도가 향상된 금속배선을 제조하는 방법에 관해 개시한다. 본 발명은 반도체 장치의 금속배선 형성방법에 있어서, 반도체 기판위에 금속 배선층을 형성하는 단계와 상기 금속배선층을 산화성 플라즈마에 노출시키는 단계를 구비하는 것을 특징으로 하는 반도체 장치의 금속배선 형성방법을 제공한다.A method of manufacturing a metal wiring having improved reliability by preventing damage to the metal wiring layer generated during a photolithography process of the metal wiring layer is disclosed. The present invention provides a method for forming a metal wiring in a semiconductor device, the method comprising forming a metal wiring layer on a semiconductor substrate and exposing the metal wiring layer to an oxidizing plasma. .
본 발명에 의하면 금속배선층 표면의 불완전한 원자결합을 안정화시킴과 동시에 표면을 산화시켜 줌으로써 포토리소그래피 공정시 현상액으로 사용하는 화학물질에 의한 표면 손상이 방지되어 신뢰도 높은 반도체장치를 제조할 수 있게 된다.According to the present invention, by stabilizing incomplete atomic bonds on the surface of the metallization layer and oxidizing the surface, surface damage by chemicals used as a developer in the photolithography process can be prevented, and thus a highly reliable semiconductor device can be manufactured.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.
제6도 내지 제11도는 본 발명의 일실시예에 의한 금속배선층의 제조방법을 나타내는 단면도들이다.6 to 11 are cross-sectional views illustrating a method of manufacturing a metallization layer according to an embodiment of the present invention.
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950032993A KR970018236A (en) | 1995-09-29 | 1995-09-29 | Method for manufacturing metal wiring of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950032993A KR970018236A (en) | 1995-09-29 | 1995-09-29 | Method for manufacturing metal wiring of semiconductor device |
Publications (1)
Publication Number | Publication Date |
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KR970018236A true KR970018236A (en) | 1997-04-30 |
Family
ID=66616084
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950032993A KR970018236A (en) | 1995-09-29 | 1995-09-29 | Method for manufacturing metal wiring of semiconductor device |
Country Status (1)
Country | Link |
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KR (1) | KR970018236A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20010066601A (en) * | 1999-12-31 | 2001-07-11 | 황인길 | Wiring manufacturing method for semiconductor device |
-
1995
- 1995-09-29 KR KR1019950032993A patent/KR970018236A/en not_active Application Discontinuation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20010066601A (en) * | 1999-12-31 | 2001-07-11 | 황인길 | Wiring manufacturing method for semiconductor device |
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