KR970064183U - 반도체 금속박막 공정챔버의 쉴드 - Google Patents
반도체 금속박막 공정챔버의 쉴드Info
- Publication number
- KR970064183U KR970064183U KR2019960012219U KR19960012219U KR970064183U KR 970064183 U KR970064183 U KR 970064183U KR 2019960012219 U KR2019960012219 U KR 2019960012219U KR 19960012219 U KR19960012219 U KR 19960012219U KR 970064183 U KR970064183 U KR 970064183U
- Authority
- KR
- South Korea
- Prior art keywords
- shield
- thin film
- process chamber
- metal thin
- film process
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019960012219U KR0134539Y1 (ko) | 1996-05-16 | 1996-05-16 | 반도체 금속박막 공정챔버의 쉴드 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019960012219U KR0134539Y1 (ko) | 1996-05-16 | 1996-05-16 | 반도체 금속박막 공정챔버의 쉴드 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR970064183U true KR970064183U (ko) | 1997-12-11 |
KR0134539Y1 KR0134539Y1 (ko) | 1999-03-20 |
Family
ID=19456327
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2019960012219U KR0134539Y1 (ko) | 1996-05-16 | 1996-05-16 | 반도체 금속박막 공정챔버의 쉴드 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR0134539Y1 (ko) |
-
1996
- 1996-05-16 KR KR2019960012219U patent/KR0134539Y1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR0134539Y1 (ko) | 1999-03-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
REGI | Registration of establishment | ||
FPAY | Annual fee payment |
Payment date: 20060928 Year of fee payment: 9 |
|
LAPS | Lapse due to unpaid annual fee |